JP2007109947A - 蛍光体板及びこれを備えた発光装置 - Google Patents

蛍光体板及びこれを備えた発光装置 Download PDF

Info

Publication number
JP2007109947A
JP2007109947A JP2005300314A JP2005300314A JP2007109947A JP 2007109947 A JP2007109947 A JP 2007109947A JP 2005300314 A JP2005300314 A JP 2005300314A JP 2005300314 A JP2005300314 A JP 2005300314A JP 2007109947 A JP2007109947 A JP 2007109947A
Authority
JP
Japan
Prior art keywords
light
phosphor
phosphor plate
light emitting
phosphor layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005300314A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007109947A5 (enrdf_load_stackoverflow
Inventor
Toshimasa Hayashi
稔真 林
Hiroaki Kawaguchi
洋明 川口
Takumi Narita
巧 成田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2005300314A priority Critical patent/JP2007109947A/ja
Publication of JP2007109947A publication Critical patent/JP2007109947A/ja
Publication of JP2007109947A5 publication Critical patent/JP2007109947A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2005300314A 2005-10-14 2005-10-14 蛍光体板及びこれを備えた発光装置 Withdrawn JP2007109947A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005300314A JP2007109947A (ja) 2005-10-14 2005-10-14 蛍光体板及びこれを備えた発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005300314A JP2007109947A (ja) 2005-10-14 2005-10-14 蛍光体板及びこれを備えた発光装置

Publications (2)

Publication Number Publication Date
JP2007109947A true JP2007109947A (ja) 2007-04-26
JP2007109947A5 JP2007109947A5 (enrdf_load_stackoverflow) 2008-01-31

Family

ID=38035562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005300314A Withdrawn JP2007109947A (ja) 2005-10-14 2005-10-14 蛍光体板及びこれを備えた発光装置

Country Status (1)

Country Link
JP (1) JP2007109947A (enrdf_load_stackoverflow)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008306013A (ja) * 2007-06-08 2008-12-18 Ushio Inc 照明装置
JP2009021426A (ja) * 2007-07-12 2009-01-29 Sharp Corp チップ部品型ｌｅｄ及びその製造方法
JP2009105125A (ja) * 2007-10-22 2009-05-14 Nichia Corp 半導体レーザ装置
JP2010087324A (ja) * 2008-10-01 2010-04-15 Minebea Co Ltd 発光装置
KR20100080384A (ko) * 2008-12-29 2010-07-08 오스람 실바니아 인코포레이티드 원격 인광물질 ｌｅｄ 조명 시스템
JP2010532104A (ja) * 2007-06-27 2010-09-30 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア 高効率白色発光ダイオードのための光学設計
JP2012003923A (ja) * 2010-06-16 2012-01-05 Sony Corp 照明装置及び画像表示装置
JP2012059893A (ja) * 2010-09-08 2012-03-22 Nippon Electric Glass Co Ltd 波長変換部材、光源及び波長変換部材の製造方法
JP2012238633A (ja) * 2011-05-10 2012-12-06 Rohm Co Ltd Ｌｅｄモジュール
KR101251962B1 (ko) * 2011-08-25 2013-04-08 희성전자 주식회사 발광다이오드 패키지
EP2400569A3 (en) * 2010-06-28 2014-08-13 LG Innotek Co., Ltd. Light-emitting diode package
WO2015182685A1 (ja) * 2014-05-30 2015-12-03 富士フイルム株式会社 波長変換部材、バックライトユニット、偏光板、液晶パネル、および液晶表示装置
JP2016038537A (ja) * 2014-08-11 2016-03-22 旭硝子株式会社 ワイヤグリッド型偏光子、光源モジュールおよび投射型表示装置
EP3007239A1 (en) * 2014-10-08 2016-04-13 Kabushiki Kaisha Toshiba Semiconductor light emitting device and method for manufacturing the same
JP2017116719A (ja) * 2015-12-24 2017-06-29 パナソニックＩｐマネジメント株式会社 発光素子および照明装置
WO2017163598A1 (ja) * 2016-03-24 2017-09-28 ソニー株式会社 発光装置、表示装置および照明装置

Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008306013A (ja) * 2007-06-08 2008-12-18 Ushio Inc 照明装置
US8624281B2 (en) 2007-06-27 2014-01-07 The Regents Of The University Of California Optical designs for high-efficacy white-light emitting diodes
JP2010532104A (ja) * 2007-06-27 2010-09-30 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア 高効率白色発光ダイオードのための光学設計
US9515240B2 (en) 2007-06-27 2016-12-06 The Regents Of The University Of California Optical designs for high-efficacy white-light emitting diodes
US9219205B2 (en) 2007-06-27 2015-12-22 The Regents Of The University Of California Optical designs for high-efficacy white-light emitting diodes
JP2009021426A (ja) * 2007-07-12 2009-01-29 Sharp Corp チップ部品型ｌｅｄ及びその製造方法
JP2009105125A (ja) * 2007-10-22 2009-05-14 Nichia Corp 半導体レーザ装置
JP2010087324A (ja) * 2008-10-01 2010-04-15 Minebea Co Ltd 発光装置
KR20100080384A (ko) * 2008-12-29 2010-07-08 오스람 실바니아 인코포레이티드 원격 인광물질 ｌｅｄ 조명 시스템
KR101670510B1 (ko) * 2008-12-29 2016-10-28 오스람 실바니아 인코포레이티드 원격 인광물질 ｌｅｄ 조명 시스템
US9052582B2 (en) 2010-06-16 2015-06-09 Sony Corporation Illumination device and image display apparatus
JP2012003923A (ja) * 2010-06-16 2012-01-05 Sony Corp 照明装置及び画像表示装置
US9995927B2 (en) 2010-06-16 2018-06-12 Sony Corporation Illumination device and image display apparatus
US9733558B2 (en) 2010-06-16 2017-08-15 Sony Corporation Illumination device and image display apparatus
US9618738B2 (en) 2010-06-16 2017-04-11 Sony Corporation Illumination device and image display apparatus
US9369682B2 (en) 2010-06-16 2016-06-14 Sony Corporation Illumination device and image display apparatus
US10429636B2 (en) 2010-06-16 2019-10-01 Sony Corporation Illumination device and image display apparatus
EP2400569A3 (en) * 2010-06-28 2014-08-13 LG Innotek Co., Ltd. Light-emitting diode package
JP2012059893A (ja) * 2010-09-08 2012-03-22 Nippon Electric Glass Co Ltd 波長変換部材、光源及び波長変換部材の製造方法
JP2012238633A (ja) * 2011-05-10 2012-12-06 Rohm Co Ltd Ｌｅｄモジュール
KR101251962B1 (ko) * 2011-08-25 2013-04-08 희성전자 주식회사 발광다이오드 패키지
JP2015228415A (ja) * 2014-05-30 2015-12-17 富士フイルム株式会社 波長変換部材、バックライトユニット、偏光板、液晶パネル、および液晶表示装置
US10267973B2 (en) 2014-05-30 2019-04-23 Fujifilm Corporation Wavelength conversion member, backlight unit, polarizing plate, liquid crystal panel, and liquid crystal display device
WO2015182685A1 (ja) * 2014-05-30 2015-12-03 富士フイルム株式会社 波長変換部材、バックライトユニット、偏光板、液晶パネル、および液晶表示装置
JP2016038537A (ja) * 2014-08-11 2016-03-22 旭硝子株式会社 ワイヤグリッド型偏光子、光源モジュールおよび投射型表示装置
EP3007239A1 (en) * 2014-10-08 2016-04-13 Kabushiki Kaisha Toshiba Semiconductor light emitting device and method for manufacturing the same
JP2017116719A (ja) * 2015-12-24 2017-06-29 パナソニックＩｐマネジメント株式会社 発光素子および照明装置
WO2017163598A1 (ja) * 2016-03-24 2017-09-28 ソニー株式会社 発光装置、表示装置および照明装置
JPWO2017163598A1 (ja) * 2016-03-24 2019-01-31 ソニー株式会社 発光装置、表示装置および照明装置
US10877346B2 (en) 2016-03-24 2020-12-29 Saturn Licensing Llc Light-emitting device, display apparatus, and illumination apparatus
US11294228B2 (en) 2016-03-24 2022-04-05 Saturn Licensing Llc Light-emitting device, display apparatus, and illumination apparatus
US11630344B2 (en) 2016-03-24 2023-04-18 Saturn Licensing Llc Light-emitting device, display apparatus, and illumination apparatus
US12372827B2 (en) 2016-03-24 2025-07-29 Saturn Licensing Llc Light-emitting device, display apparatus, and illumination apparatus
US12386221B2 (en) 2016-03-24 2025-08-12 Saturn Licensing Llc Light-emitting device, display apparatus, and illumination apparatus

Similar Documents

Publication Publication Date Title
US20070120463A1 (en) Phosphor plate and light emitting device having same
JP4254266B2 (ja) 発光装置及び発光装置の製造方法
JP5284006B2 (ja) 発光装置
JP5369486B2 (ja) 発光装置
US20140103798A1 (en) Light-emitting device
JP2007109947A (ja) 蛍光体板及びこれを備えた発光装置
JP4353196B2 (ja) 発光装置
JP3979424B2 (ja) 発光装置
JP2007019096A (ja) 発光装置及びその製造方法
JP2007242856A (ja) チップ型半導体発光素子
JP2007266343A (ja) 発光装置
JP2007335798A (ja) 発光装置
JP2007035802A (ja) 発光装置
JP2009267039A (ja) 発光装置
JP3729001B2 (ja) 発光装置、砲弾型発光ダイオード、チップタイプｌｅｄ
JP2006253336A (ja) 光源装置
JP4894354B2 (ja) 発光装置
JP4773755B2 (ja) チップ型半導体発光素子
JP2007329374A (ja) 発光装置及び液晶表示用バックライト装置
JP4534717B2 (ja) 発光装置
JP2007134656A (ja) 蛍光体板及びこれを備えた発光装置
JP2007109946A (ja) 蛍光体板及びこれを備えた発光装置
JP2004207519A (ja) 発光装置
JP2007109887A (ja) 半導体発光装置
JP7024410B2 (ja) 半導体発光装置

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20071211

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20071221

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20090625