JP2007109946A - 蛍光体板及びこれを備えた発光装置 - Google Patents

蛍光体板及びこれを備えた発光装置 Download PDF

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Publication number
JP2007109946A
JP2007109946A JP2005300313A JP2005300313A JP2007109946A JP 2007109946 A JP2007109946 A JP 2007109946A JP 2005300313 A JP2005300313 A JP 2005300313A JP 2005300313 A JP2005300313 A JP 2005300313A JP 2007109946 A JP2007109946 A JP 2007109946A
Authority
JP
Japan
Prior art keywords
light
light emitting
phosphor
phosphor plate
led element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005300313A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007109946A5 (enExample
Inventor
Toshimasa Hayashi
稔真 林
Hiroaki Kawaguchi
洋明 川口
Takumi Narita
巧 成田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyoda Gosei Co Ltd
Original Assignee
Toyoda Gosei Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyoda Gosei Co Ltd filed Critical Toyoda Gosei Co Ltd
Priority to JP2005300313A priority Critical patent/JP2007109946A/ja
Publication of JP2007109946A publication Critical patent/JP2007109946A/ja
Publication of JP2007109946A5 publication Critical patent/JP2007109946A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2005300313A 2005-10-14 2005-10-14 蛍光体板及びこれを備えた発光装置 Withdrawn JP2007109946A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005300313A JP2007109946A (ja) 2005-10-14 2005-10-14 蛍光体板及びこれを備えた発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005300313A JP2007109946A (ja) 2005-10-14 2005-10-14 蛍光体板及びこれを備えた発光装置

Publications (2)

Publication Number Publication Date
JP2007109946A true JP2007109946A (ja) 2007-04-26
JP2007109946A5 JP2007109946A5 (enExample) 2008-01-31

Family

ID=38035561

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005300313A Withdrawn JP2007109946A (ja) 2005-10-14 2005-10-14 蛍光体板及びこれを備えた発光装置

Country Status (1)

Country Link
JP (1) JP2007109946A (enExample)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010056462A (ja) * 2008-08-29 2010-03-11 Kyocera Corp 発光装置及び発光装置を用いた照明装置
WO2010103840A1 (ja) * 2009-03-13 2010-09-16 株式会社小糸製作所 発光モジュール、および灯具ユニット
JP2012009719A (ja) * 2010-06-28 2012-01-12 Kyocera Corp 発光装置および照明装置
WO2012014360A1 (ja) * 2010-07-26 2012-02-02 株式会社小糸製作所 発光モジュール
WO2012148224A3 (ko) * 2011-04-27 2013-01-10 삼성전자 주식회사 발광소자 패키지 및 이의 제조방법
JP2013545279A (ja) * 2010-10-04 2013-12-19 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング シリコーン箔の製造方法、シリコーン箔、およびシリコーン箔を備えたオプトエレクトロニクス半導体部品
JP2014056886A (ja) * 2012-09-11 2014-03-27 Kyocera Corp 発光装置
JP2014116459A (ja) * 2012-12-10 2014-06-26 Stanley Electric Co Ltd 半導体発光装置
JP2014158054A (ja) * 2009-07-22 2014-08-28 Philips Lumileds Lightng Co Llc 発光ダイオードパッケージ及びその製造方法
JP2015015418A (ja) * 2013-07-08 2015-01-22 シャープ株式会社 半導体発光装置
WO2016021971A1 (ko) * 2014-08-07 2016-02-11 엘지이노텍 주식회사 형광체 플레이트 및 이를 포함하는 조명장치
WO2023248791A1 (ja) * 2022-06-20 2023-12-28 スタンレー電気株式会社 波長変換装置及び照明装置

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010056462A (ja) * 2008-08-29 2010-03-11 Kyocera Corp 発光装置及び発光装置を用いた照明装置
WO2010103840A1 (ja) * 2009-03-13 2010-09-16 株式会社小糸製作所 発光モジュール、および灯具ユニット
JPWO2010103840A1 (ja) * 2009-03-13 2012-09-13 株式会社小糸製作所 発光モジュール、および灯具ユニット
JP2014158054A (ja) * 2009-07-22 2014-08-28 Philips Lumileds Lightng Co Llc 発光ダイオードパッケージ及びその製造方法
JP2012009719A (ja) * 2010-06-28 2012-01-12 Kyocera Corp 発光装置および照明装置
WO2012014360A1 (ja) * 2010-07-26 2012-02-02 株式会社小糸製作所 発光モジュール
WO2012014439A1 (ja) * 2010-07-26 2012-02-02 株式会社小糸製作所 発光モジュール
CN103026515A (zh) * 2010-07-26 2013-04-03 株式会社小糸制作所 发光模块
JPWO2012014439A1 (ja) * 2010-07-26 2013-09-12 株式会社小糸製作所 発光モジュール
US8704261B2 (en) 2010-07-26 2014-04-22 Koito Manufacturing Co., Ltd. Light emitting module
JP2013545279A (ja) * 2010-10-04 2013-12-19 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング シリコーン箔の製造方法、シリコーン箔、およびシリコーン箔を備えたオプトエレクトロニクス半導体部品
WO2012148224A3 (ko) * 2011-04-27 2013-01-10 삼성전자 주식회사 발광소자 패키지 및 이의 제조방법
JP2014056886A (ja) * 2012-09-11 2014-03-27 Kyocera Corp 発光装置
JP2014116459A (ja) * 2012-12-10 2014-06-26 Stanley Electric Co Ltd 半導体発光装置
JP2015015418A (ja) * 2013-07-08 2015-01-22 シャープ株式会社 半導体発光装置
WO2016021971A1 (ko) * 2014-08-07 2016-02-11 엘지이노텍 주식회사 형광체 플레이트 및 이를 포함하는 조명장치
KR20160017948A (ko) * 2014-08-07 2016-02-17 엘지이노텍 주식회사 형광체 플레이트 및 이를 포함하는 조명장치
CN106574764A (zh) * 2014-08-07 2017-04-19 Lg 伊诺特有限公司 磷光体板和包含所述磷光体板的照明装置
EP3179160A4 (en) * 2014-08-07 2018-03-14 LG Innotek Co., Ltd. Phosphor plate, and illumination device containing same
US10451245B2 (en) 2014-08-07 2019-10-22 Lg Innotek Co., Ltd. Phosphor plate and lighting device including the same
CN106574764B (zh) * 2014-08-07 2019-11-05 Lg 伊诺特有限公司 磷光体板和包含所述磷光体板的照明装置
KR102310805B1 (ko) * 2014-08-07 2021-10-08 엘지이노텍 주식회사 형광체 플레이트 및 이를 포함하는 조명장치
WO2023248791A1 (ja) * 2022-06-20 2023-12-28 スタンレー電気株式会社 波長変換装置及び照明装置

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