JP2007096279A5 - - Google Patents
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- Publication number
- JP2007096279A5 JP2007096279A5 JP2006225479A JP2006225479A JP2007096279A5 JP 2007096279 A5 JP2007096279 A5 JP 2007096279A5 JP 2006225479 A JP2006225479 A JP 2006225479A JP 2006225479 A JP2006225479 A JP 2006225479A JP 2007096279 A5 JP2007096279 A5 JP 2007096279A5
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- substrate
- circuit device
- recess
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 18
- 239000000463 material Substances 0.000 claims 11
- 230000017525 heat dissipation Effects 0.000 claims 5
- 239000011521 glass Substances 0.000 claims 2
- 239000010453 quartz Substances 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 229910002804 graphite Inorganic materials 0.000 claims 1
- 239000010439 graphite Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006225479A JP5137356B2 (ja) | 2005-09-02 | 2006-08-22 | 集積回路装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005254481 | 2005-09-02 | ||
| JP2005254481 | 2005-09-02 | ||
| JP2006225479A JP5137356B2 (ja) | 2005-09-02 | 2006-08-22 | 集積回路装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007096279A JP2007096279A (ja) | 2007-04-12 |
| JP2007096279A5 true JP2007096279A5 (enExample) | 2009-09-10 |
| JP5137356B2 JP5137356B2 (ja) | 2013-02-06 |
Family
ID=37981542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006225479A Expired - Fee Related JP5137356B2 (ja) | 2005-09-02 | 2006-08-22 | 集積回路装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5137356B2 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4973328B2 (ja) * | 2007-06-14 | 2012-07-11 | 株式会社デンソー | 半導体装置 |
| US9024312B2 (en) | 2009-09-30 | 2015-05-05 | Dai Nippon Printing Co., Ltd. | Substrate for flexible device, thin film transistor substrate for flexible device, flexible device, substrate for thin film element, thin film element, thin film transistor, method for manufacturing substrate for thin film element, method for manufacturing thin film element, and method for manufacturing thin film transistor |
| US20110186899A1 (en) * | 2010-02-03 | 2011-08-04 | Polymer Vision Limited | Semiconductor device with a variable integrated circuit chip bump pitch |
| JP2011233858A (ja) * | 2010-04-09 | 2011-11-17 | Dainippon Printing Co Ltd | 薄膜素子用基板の製造方法、薄膜素子の製造方法、薄膜トランジスタの製造方法、薄膜素子、および薄膜トランジスタ |
| JP2014082253A (ja) * | 2012-10-15 | 2014-05-08 | Nippon Hoso Kyokai <Nhk> | 積層型半導体装置、半導体チップならびに積層型半導体装置の製造方法 |
| US20220037778A1 (en) * | 2018-12-25 | 2022-02-03 | Toray Industries, Inc. | Method for manufacturing wireless communication device, wireless communication device, and assembly of wireless communication devices |
| KR20220096469A (ko) * | 2020-12-31 | 2022-07-07 | 엘지디스플레이 주식회사 | 중첩된 화소 구동부들을 포함하는 표시장치 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3506054B2 (ja) * | 1999-07-23 | 2004-03-15 | 日本電気株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP2002246514A (ja) * | 2001-02-14 | 2002-08-30 | Fuji Electric Co Ltd | 半導体装置 |
| JP4483123B2 (ja) * | 2001-05-07 | 2010-06-16 | ソニー株式会社 | ３次元半導体チップ及びその製造方法 |
| JP3791459B2 (ja) * | 2002-05-27 | 2006-06-28 | 株式会社デンソー | 半導体装置およびその製造方法 |
| JP4238998B2 (ja) * | 2004-03-18 | 2009-03-18 | セイコーエプソン株式会社 | 電気デバイス |
-
2006
- 2006-08-22 JP JP2006225479A patent/JP5137356B2/ja not_active Expired - Fee Related
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