JP2011514663A5 - - Google Patents

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Publication number
JP2011514663A5
JP2011514663A5 JP2010545195A JP2010545195A JP2011514663A5 JP 2011514663 A5 JP2011514663 A5 JP 2011514663A5 JP 2010545195 A JP2010545195 A JP 2010545195A JP 2010545195 A JP2010545195 A JP 2010545195A JP 2011514663 A5 JP2011514663 A5 JP 2011514663A5
Authority
JP
Japan
Prior art keywords
thermally conductive
lid
die
integrated circuit
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010545195A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011514663A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2009/032601 external-priority patent/WO2009099934A2/en
Publication of JP2011514663A publication Critical patent/JP2011514663A/ja
Publication of JP2011514663A5 publication Critical patent/JP2011514663A5/ja
Pending legal-status Critical Current

Links

JP2010545195A 2008-01-31 2009-01-30 部品の熱伝達のための方法及び装置 Pending JP2011514663A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US2524808P 2008-01-31 2008-01-31
PCT/US2009/032601 WO2009099934A2 (en) 2008-01-31 2009-01-30 Methods and apparatus for heat transfer for a component

Publications (2)

Publication Number Publication Date
JP2011514663A JP2011514663A (ja) 2011-05-06
JP2011514663A5 true JP2011514663A5 (enExample) 2011-10-06

Family

ID=40578743

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010545195A Pending JP2011514663A (ja) 2008-01-31 2009-01-30 部品の熱伝達のための方法及び装置

Country Status (4)

Country Link
US (1) US20090257196A1 (enExample)
EP (1) EP2238617A2 (enExample)
JP (1) JP2011514663A (enExample)
WO (1) WO2009099934A2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10325828B2 (en) * 2016-03-30 2019-06-18 Qorvo Us, Inc. Electronics package with improved thermal performance
JP6310110B2 (ja) * 2017-04-03 2018-04-11 ルネサスエレクトロニクス株式会社 半導体装置
US11140767B2 (en) 2020-03-05 2021-10-05 Hamilton Sundstrand Corporation Conductive thermal management architecture for electronic modules in a two-card assembly
US20240258190A1 (en) * 2023-01-26 2024-08-01 Advanced Micro Devices, Inc. Floating heat spreader with guided mechanism

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0544329A3 (en) * 1991-11-28 1993-09-01 Kabushiki Kaisha Toshiba Semiconductor package
EP0790762B1 (en) * 1996-01-30 2003-10-08 Parker Hannifin Corporation Conductive cooling of a heat-generating electronic component
US6705388B1 (en) * 1997-11-10 2004-03-16 Parker-Hannifin Corporation Non-electrically conductive thermal dissipator for electronic components
US6218730B1 (en) * 1999-01-06 2001-04-17 International Business Machines Corporation Apparatus for controlling thermal interface gap distance
EP1336199A2 (en) * 2000-11-14 2003-08-20 Honeywell International, Inc. Lid and heat spreader design for a semiconductor package
US7026223B2 (en) * 2002-03-28 2006-04-11 M/A-Com, Inc Hermetic electric component package
US6906413B2 (en) * 2003-05-30 2005-06-14 Honeywell International Inc. Integrated heat spreader lid
US20050224953A1 (en) * 2004-03-19 2005-10-13 Lee Michael K L Heat spreader lid cavity filled with cured molding compound
ATE480579T1 (de) * 2004-12-16 2010-09-15 Dow Corning Amidsubstituierte silikone und verfahren zu ihrer herstellung und verwendung
AT8722U1 (de) * 2005-06-06 2006-11-15 Siemens Ag Oesterreich Anordnung zur kühlung einer gruppe von leistungselektronischen bauelementen
US7301227B1 (en) * 2005-08-19 2007-11-27 Sun Microsystems, Inc. Package lid or heat spreader for microprocessor packages

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