JP2011514663A - 部品の熱伝達のための方法及び装置 - Google Patents

部品の熱伝達のための方法及び装置 Download PDF

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Publication number
JP2011514663A
JP2011514663A JP2010545195A JP2010545195A JP2011514663A JP 2011514663 A JP2011514663 A JP 2011514663A JP 2010545195 A JP2010545195 A JP 2010545195A JP 2010545195 A JP2010545195 A JP 2010545195A JP 2011514663 A JP2011514663 A JP 2011514663A
Authority
JP
Japan
Prior art keywords
lid
heat
transfer device
heat transfer
thermal interface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010545195A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011514663A5 (enExample
Inventor
ジェイムス イー ファオロ、
ジェイムス、 アール マイヤーズ、
アイシス ロシュリオス、
スティーブン、 エヌ ピーターソン、
ジョージ、 アール カニングトン、
ケビン、 エイ ポールソン、
シンシア、 アール コーネン、
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of JP2011514663A publication Critical patent/JP2011514663A/ja
Publication of JP2011514663A5 publication Critical patent/JP2011514663A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2010545195A 2008-01-31 2009-01-30 部品の熱伝達のための方法及び装置 Pending JP2011514663A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US2524808P 2008-01-31 2008-01-31
PCT/US2009/032601 WO2009099934A2 (en) 2008-01-31 2009-01-30 Methods and apparatus for heat transfer for a component

Publications (2)

Publication Number Publication Date
JP2011514663A true JP2011514663A (ja) 2011-05-06
JP2011514663A5 JP2011514663A5 (enExample) 2011-10-06

Family

ID=40578743

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010545195A Pending JP2011514663A (ja) 2008-01-31 2009-01-30 部品の熱伝達のための方法及び装置

Country Status (4)

Country Link
US (1) US20090257196A1 (enExample)
EP (1) EP2238617A2 (enExample)
JP (1) JP2011514663A (enExample)
WO (1) WO2009099934A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017139484A (ja) * 2017-04-03 2017-08-10 ルネサスエレクトロニクス株式会社 半導体装置
JP7641769B2 (ja) 2020-03-05 2025-03-07 ハミルトン・サンドストランド・コーポレイション ２カードアセンブリ、および２カードアセンブリの組み立て方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10325828B2 (en) * 2016-03-30 2019-06-18 Qorvo Us, Inc. Electronics package with improved thermal performance
US20240258190A1 (en) * 2023-01-26 2024-08-01 Advanced Micro Devices, Inc. Floating heat spreader with guided mechanism

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006528846A (ja) * 2003-05-30 2006-12-21 ハネウエル・インターナシヨナル・インコーポレーテツド 集積型熱拡散器リッド

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0544329A3 (en) * 1991-11-28 1993-09-01 Kabushiki Kaisha Toshiba Semiconductor package
EP0790762B1 (en) * 1996-01-30 2003-10-08 Parker Hannifin Corporation Conductive cooling of a heat-generating electronic component
US6705388B1 (en) * 1997-11-10 2004-03-16 Parker-Hannifin Corporation Non-electrically conductive thermal dissipator for electronic components
US6218730B1 (en) * 1999-01-06 2001-04-17 International Business Machines Corporation Apparatus for controlling thermal interface gap distance
EP1336199A2 (en) * 2000-11-14 2003-08-20 Honeywell International, Inc. Lid and heat spreader design for a semiconductor package
US7026223B2 (en) * 2002-03-28 2006-04-11 M/A-Com, Inc Hermetic electric component package
US20050224953A1 (en) * 2004-03-19 2005-10-13 Lee Michael K L Heat spreader lid cavity filled with cured molding compound
ATE480579T1 (de) * 2004-12-16 2010-09-15 Dow Corning Amidsubstituierte silikone und verfahren zu ihrer herstellung und verwendung
AT8722U1 (de) * 2005-06-06 2006-11-15 Siemens Ag Oesterreich Anordnung zur kühlung einer gruppe von leistungselektronischen bauelementen
US7301227B1 (en) * 2005-08-19 2007-11-27 Sun Microsystems, Inc. Package lid or heat spreader for microprocessor packages

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006528846A (ja) * 2003-05-30 2006-12-21 ハネウエル・インターナシヨナル・インコーポレーテツド 集積型熱拡散器リッド

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017139484A (ja) * 2017-04-03 2017-08-10 ルネサスエレクトロニクス株式会社 半導体装置
JP7641769B2 (ja) 2020-03-05 2025-03-07 ハミルトン・サンドストランド・コーポレイション ２カードアセンブリ、および２カードアセンブリの組み立て方法

Also Published As

Publication number Publication date
WO2009099934A3 (en) 2010-02-11
EP2238617A2 (en) 2010-10-13
US20090257196A1 (en) 2009-10-15
WO2009099934A2 (en) 2009-08-13

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