JP2007073542A5 - - Google Patents

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Publication number
JP2007073542A5
JP2007073542A5 JP2005255294A JP2005255294A JP2007073542A5 JP 2007073542 A5 JP2007073542 A5 JP 2007073542A5 JP 2005255294 A JP2005255294 A JP 2005255294A JP 2005255294 A JP2005255294 A JP 2005255294A JP 2007073542 A5 JP2007073542 A5 JP 2007073542A5
Authority
JP
Japan
Prior art keywords
main frame
joined
bottom plate
reinforcing
vacuum chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005255294A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007073542A (ja
JP4791110B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005255294A priority Critical patent/JP4791110B2/ja
Priority claimed from JP2005255294A external-priority patent/JP4791110B2/ja
Priority to KR1020060083845A priority patent/KR100856145B1/ko
Priority to TW095132454A priority patent/TWI406332B/zh
Priority to CNB2006101289226A priority patent/CN100421212C/zh
Publication of JP2007073542A publication Critical patent/JP2007073542A/ja
Publication of JP2007073542A5 publication Critical patent/JP2007073542A5/ja
Application granted granted Critical
Publication of JP4791110B2 publication Critical patent/JP4791110B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2005255294A 2005-09-02 2005-09-02 真空チャンバおよび真空処理装置 Expired - Fee Related JP4791110B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005255294A JP4791110B2 (ja) 2005-09-02 2005-09-02 真空チャンバおよび真空処理装置
KR1020060083845A KR100856145B1 (ko) 2005-09-02 2006-08-31 진공 챔버 및 진공 처리 장치
TW095132454A TWI406332B (zh) 2005-09-02 2006-09-01 Vacuum chamber and vacuum treatment device
CNB2006101289226A CN100421212C (zh) 2005-09-02 2006-09-04 真空腔室和真空处理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005255294A JP4791110B2 (ja) 2005-09-02 2005-09-02 真空チャンバおよび真空処理装置

Publications (3)

Publication Number Publication Date
JP2007073542A JP2007073542A (ja) 2007-03-22
JP2007073542A5 true JP2007073542A5 (es) 2008-10-02
JP4791110B2 JP4791110B2 (ja) 2011-10-12

Family

ID=37817679

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005255294A Expired - Fee Related JP4791110B2 (ja) 2005-09-02 2005-09-02 真空チャンバおよび真空処理装置

Country Status (4)

Country Link
JP (1) JP4791110B2 (es)
KR (1) KR100856145B1 (es)
CN (1) CN100421212C (es)
TW (1) TWI406332B (es)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004001817A1 (en) 2002-06-21 2003-12-31 Applied Materials, Inc. Transfer chamber for vacuum processing system
KR101101757B1 (ko) * 2005-11-07 2012-01-05 주성엔지니어링(주) 제조비용을 절감한 진공챔버
WO2009078351A1 (ja) * 2007-12-14 2009-06-25 Ulvac, Inc. チャンバ及び成膜装置
JP5551346B2 (ja) * 2008-06-10 2014-07-16 東京エレクトロン株式会社 チャンバ及び処理装置
WO2010082467A1 (ja) * 2009-01-14 2010-07-22 株式会社アルバック プラズマｃｖｄ装置
FI122940B (fi) * 2009-02-09 2012-09-14 Beneq Oy Reaktiokammio
KR20110067939A (ko) * 2009-12-15 2011-06-22 주식회사 테스 로드락 챔버
KR101598176B1 (ko) * 2010-03-30 2016-02-26 주식회사 원익아이피에스 진공챔버
JP5526988B2 (ja) * 2010-04-28 2014-06-18 東京エレクトロン株式会社 基板処理装置及び基板処理システム
KR101363064B1 (ko) * 2012-05-22 2014-02-14 박종민 진공 챔버 구조
JP2016537805A (ja) * 2013-09-26 2016-12-01 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板処理のための混合プラットフォームの装置、システム、及び方法
JP7023097B2 (ja) * 2016-12-28 2022-02-21 東京エレクトロン株式会社 真空チャンバおよび真空チャンバの扉の施錠方法
JP6625597B2 (ja) * 2017-11-13 2019-12-25 平田機工株式会社 搬送チャンバ
JP7277137B2 (ja) * 2018-12-28 2023-05-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、および搬送モジュール
KR102193096B1 (ko) 2019-01-31 2020-12-21 (주)에프티엘 진공챔버의 리브를 용접하기 위한 용접지그장치

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3608065B2 (ja) * 1996-10-31 2005-01-05 東京エレクトロン株式会社 縦型熱処理装置およびそのボートと保温筒のメンテナンス方法
US5914493A (en) * 1997-02-21 1999-06-22 Nikon Corporation Charged-particle-beam exposure apparatus and methods with substrate-temperature control
US6241117B1 (en) * 1997-11-26 2001-06-05 Steven R. Wickins Pressure differential containment structure
JP4253107B2 (ja) * 2000-08-24 2009-04-08 キヤノンアネルバ株式会社 基板処理装置及びその増設方法
JP4003412B2 (ja) * 2001-06-20 2007-11-07 株式会社島津製作所 真空チャンバ及びその真空チャンバを用いた液晶注入装置
JP2003077974A (ja) * 2001-08-31 2003-03-14 Hitachi Kokusai Electric Inc 基板処理装置および半導体装置の製造方法
JP2003188226A (ja) * 2001-12-18 2003-07-04 Anelva Corp 真空搬送処理装置
JP2004089872A (ja) * 2002-08-30 2004-03-25 Tsukishima Kikai Co Ltd 真空装置
JP2004311640A (ja) * 2003-04-04 2004-11-04 Tokyo Electron Ltd 処理容器
SG115678A1 (en) * 2003-04-22 2005-10-28 Asml Netherlands Bv Substrate carrier and method for making a substrate carrier
JP2004335743A (ja) * 2003-05-08 2004-11-25 Ulvac Japan Ltd 真空処理装置用真空チャンバー
KR100441875B1 (ko) * 2003-06-02 2004-07-27 주성엔지니어링(주) 분리형 이송 챔버
JP4833512B2 (ja) * 2003-06-24 2011-12-07 東京エレクトロン株式会社 被処理体処理装置、被処理体処理方法及び被処理体搬送方法
JP4767574B2 (ja) * 2005-03-31 2011-09-07 東京エレクトロン株式会社 処理チャンバおよび処理装置
JP4079157B2 (ja) * 2005-04-12 2008-04-23 東京エレクトロン株式会社 ゲートバルブ装置及び処理システム

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