JP2007063669A - 蒸着装置のヒータ及びこれを採用した蒸発源 - Google Patents
蒸着装置のヒータ及びこれを採用した蒸発源 Download PDFInfo
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- JP2007063669A JP2007063669A JP2006232615A JP2006232615A JP2007063669A JP 2007063669 A JP2007063669 A JP 2007063669A JP 2006232615 A JP2006232615 A JP 2006232615A JP 2006232615 A JP2006232615 A JP 2006232615A JP 2007063669 A JP2007063669 A JP 2007063669A
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- heater
- crucible
- vapor deposition
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- 230000008020 evaporation Effects 0.000 title claims abstract description 24
- 238000001704 evaporation Methods 0.000 title claims abstract description 24
- 238000007740 vapor deposition Methods 0.000 title claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 26
- 238000010438 heat treatment Methods 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 2
- 238000009826 distribution Methods 0.000 abstract description 6
- 230000007423 decrease Effects 0.000 abstract 1
- 230000008016 vaporization Effects 0.000 abstract 1
- 238000000151 deposition Methods 0.000 description 11
- 230000008021 deposition Effects 0.000 description 11
- 239000010408 film Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 238000004088 simulation Methods 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
【解決手段】蒸着装置のるつぼを加熱させるためにるつぼの上面と下面のうちの少なくとも一箇所に設置される板状のヒータにおいて、前記ヒータは不均一なピッチ間隔で蛇行した形状を有し、前記ヒータの中央部は蛇行する回数が少なくピッチ間隔が広くなるように形成され、両端部はピッチ間隔が狭くなるように形成される。
【選択図】図4
Description
110 ハウジング、
120 るつぼ、
130 従来のヒータ、
140 噴射ノズル、
142 厚さ測定器、
180 第1の熱遮断板、
190 第2の熱遮断板、
230、330 ヒータ。
Claims (6)
- 蒸着装置のるつぼを加熱させるためにるつぼの上面と下面のうちの少なくとも一箇所に設置される板状のヒータであって、
前記ヒータは、不均一なピッチ間隔で蛇行して形成され、
前記ヒータの中央部は、蛇行する回数が少なく、ピッチ間隔が広くなるように形成され、
前記ヒータの両端部は、ピッチ間隔が狭くなるように形成されることを特徴とするヒータ。 - 前記ヒータの中央部のピッチ間隔aの、端部のピッチ間隔bに対する割合であるa/bが1.5〜5.0であることを特徴とする請求項1に記載のヒータ。
- 前記ヒータのピッチ間隔は、前記ヒータの端部から中央部に向かって漸次的に広くなることを特徴とする請求項1に記載のヒータ。
- ハウジングと、蒸着物質を収容し、前記ハウジングに内蔵されるるつぼと、
前記るつぼを加熱するためにるつぼの上面と下面のうちの少なくとも一箇所に設置される板状のヒータであって、中央部は蛇行する回数が少なくピッチ間隔が広くなるように形成され、両端部はピッチ間隔が狭くなるように形成されるヒータと、
前記るつぼで蒸発させられた蒸着物質を基板へ噴射するための噴射ノズルを含むノズル部と、を含む蒸発源。 - 前記中央部のピッチaの、前記端部のピッチbに対する割合であるa/bが1.5〜5.0であることを特徴とする請求項4に記載の蒸発源。
- 前記ヒータのピッチ間隔は、前記ヒータの両端部から中央部に向かって漸次的に広くなることを特徴とする請求項4に記載の蒸発源。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020050080280A KR100645688B1 (ko) | 2005-08-30 | 2005-08-30 | 증착장치의 히터 및 이를 채용한 증발원 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007063669A true JP2007063669A (ja) | 2007-03-15 |
JP4454606B2 JP4454606B2 (ja) | 2010-04-21 |
Family
ID=37654529
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006232615A Expired - Fee Related JP4454606B2 (ja) | 2005-08-30 | 2006-08-29 | 蒸発源 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20070119849A1 (ja) |
JP (1) | JP4454606B2 (ja) |
KR (1) | KR100645688B1 (ja) |
CN (1) | CN1924080A (ja) |
TW (1) | TWI349719B (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101390413B1 (ko) * | 2012-12-27 | 2014-04-30 | 주식회사 선익시스템 | 증발원 가열 장치 |
KR101456657B1 (ko) * | 2012-12-26 | 2014-11-04 | 주식회사 선익시스템 | 증발원 가열 장치 |
KR101481094B1 (ko) * | 2012-12-28 | 2015-01-14 | 주식회사 선익시스템 | 증발원 가열 장치 |
KR20200090667A (ko) * | 2020-07-15 | 2020-07-29 | 삼성디스플레이 주식회사 | 증착원 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101106289B1 (ko) | 2006-08-04 | 2012-01-18 | 순천향대학교 산학협력단 | 증착 공정을 위한 선형 증착 소스 |
WO2008016247A1 (en) * | 2006-08-04 | 2008-02-07 | Soonchunhyang University Industry Academy Cooperation Foundation | Linear deposition sources for deposition processes |
JP4468474B1 (ja) * | 2008-12-24 | 2010-05-26 | 三菱重工業株式会社 | 真空蒸着装置及び温度調整方法 |
KR101156430B1 (ko) * | 2009-09-25 | 2012-06-18 | 삼성모바일디스플레이주식회사 | 증착 소스 및 유기 발광 소자 제조 방법 |
KR101186609B1 (ko) * | 2010-04-23 | 2012-09-27 | (주)알파플러스 | 열복사 가열형 선형 증발원 장치 |
KR101209107B1 (ko) | 2010-06-23 | 2012-12-06 | (주)알파플러스 | 소스 튐 방지용 구조물을 구비한 증발원 장치 |
KR102052074B1 (ko) | 2013-04-04 | 2019-12-05 | 삼성디스플레이 주식회사 | 증착 장치, 이를 이용한 박막 형성 방법 및 유기 발광 표시 장치 제조 방법 |
KR20150004646A (ko) * | 2013-07-03 | 2015-01-13 | 삼성디스플레이 주식회사 | 증착원 |
CN103805954B (zh) * | 2014-02-20 | 2016-01-13 | 江西沃格光电股份有限公司 | 磁控溅射镀膜系统 |
US10550454B2 (en) * | 2014-09-05 | 2020-02-04 | Jfe Steel Corporation | Cold-rolled ferritic stainless steel sheet |
CN104404451A (zh) * | 2014-12-16 | 2015-03-11 | 合肥鑫晟光电科技有限公司 | 蒸镀源和蒸镀装置 |
US10982319B2 (en) * | 2015-08-21 | 2021-04-20 | Flisom Ag | Homogeneous linear evaporation source |
CN205443432U (zh) * | 2016-04-07 | 2016-08-10 | 鄂尔多斯市源盛光电有限责任公司 | 一种线性蒸发源、蒸发源系统及蒸镀装置 |
EP3494243B1 (en) * | 2016-08-05 | 2021-12-29 | Flisom AG | Homogeneous linear evaporation source with heater |
CN109423631B (zh) * | 2017-08-31 | 2020-09-01 | 中国科学院苏州纳米技术与纳米仿生研究所 | 气相沉积均匀加热装置及气相沉积炉 |
CN109423627B (zh) * | 2017-08-31 | 2021-02-23 | 中国科学院苏州纳米技术与纳米仿生研究所 | 圆盘类零件一次性全表面气相沉积炉 |
CN108754429B (zh) * | 2018-08-28 | 2020-11-06 | 京东方科技集团股份有限公司 | 一种蒸发源 |
KR102227547B1 (ko) * | 2019-03-13 | 2021-03-15 | 주식회사 선익시스템 | 박스형 선형 증발원용 도가니 및 선형 증발원 |
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US2371696A (en) * | 1943-07-17 | 1945-03-20 | Cities Service Oil Co | Helical electric immersion heater |
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2005
- 2005-08-30 KR KR1020050080280A patent/KR100645688B1/ko not_active IP Right Cessation
-
2006
- 2006-08-24 TW TW095131095A patent/TWI349719B/zh not_active IP Right Cessation
- 2006-08-29 JP JP2006232615A patent/JP4454606B2/ja not_active Expired - Fee Related
- 2006-08-30 US US11/514,313 patent/US20070119849A1/en not_active Abandoned
- 2006-08-30 CN CNA2006101277106A patent/CN1924080A/zh active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101456657B1 (ko) * | 2012-12-26 | 2014-11-04 | 주식회사 선익시스템 | 증발원 가열 장치 |
KR101390413B1 (ko) * | 2012-12-27 | 2014-04-30 | 주식회사 선익시스템 | 증발원 가열 장치 |
KR101481094B1 (ko) * | 2012-12-28 | 2015-01-14 | 주식회사 선익시스템 | 증발원 가열 장치 |
KR20200090667A (ko) * | 2020-07-15 | 2020-07-29 | 삼성디스플레이 주식회사 | 증착원 |
KR102221552B1 (ko) * | 2020-07-15 | 2021-03-02 | 삼성디스플레이 주식회사 | 증착원 |
Also Published As
Publication number | Publication date |
---|---|
TW200710268A (en) | 2007-03-16 |
JP4454606B2 (ja) | 2010-04-21 |
US20070119849A1 (en) | 2007-05-31 |
CN1924080A (zh) | 2007-03-07 |
KR100645688B1 (ko) | 2006-11-14 |
TWI349719B (en) | 2011-10-01 |
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