JP2007059890A5 - - Google Patents
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- Publication number
- JP2007059890A5 JP2007059890A5 JP2006200298A JP2006200298A JP2007059890A5 JP 2007059890 A5 JP2007059890 A5 JP 2007059890A5 JP 2006200298 A JP2006200298 A JP 2006200298A JP 2006200298 A JP2006200298 A JP 2006200298A JP 2007059890 A5 JP2007059890 A5 JP 2007059890A5
- Authority
- JP
- Japan
- Prior art keywords
- opening
- insulating film
- forming
- interlayer insulating
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010408 film Substances 0.000 claims 76
- 239000011229 interlayer Substances 0.000 claims 34
- 239000000758 substrate Substances 0.000 claims 30
- 238000000034 method Methods 0.000 claims 25
- 239000010409 thin film Substances 0.000 claims 24
- 238000004519 manufacturing process Methods 0.000 claims 19
- 239000004065 semiconductor Substances 0.000 claims 19
- 230000001678 irradiating effect Effects 0.000 claims 3
- 230000000149 penetrating effect Effects 0.000 claims 2
- 238000007650 screen-printing Methods 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006200298A JP5127178B2 (ja) | 2005-07-29 | 2006-07-24 | 半導体装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005222199 | 2005-07-29 | ||
| JP2005222199 | 2005-07-29 | ||
| JP2006200298A JP5127178B2 (ja) | 2005-07-29 | 2006-07-24 | 半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007059890A JP2007059890A (ja) | 2007-03-08 |
| JP2007059890A5 true JP2007059890A5 (https=) | 2009-08-13 |
| JP5127178B2 JP5127178B2 (ja) | 2013-01-23 |
Family
ID=37923052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006200298A Expired - Fee Related JP5127178B2 (ja) | 2005-07-29 | 2006-07-24 | 半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5127178B2 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1976000A3 (en) * | 2007-03-26 | 2009-05-13 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JP5416931B2 (ja) * | 2007-08-24 | 2014-02-12 | 株式会社半導体エネルギー研究所 | 半導体装置の製造方法 |
| JP5581106B2 (ja) * | 2009-04-27 | 2014-08-27 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| EP3514831B1 (en) | 2009-12-26 | 2021-10-13 | Canon Kabushiki Kaisha | Solid-state image pickup apparatus and image pickup system |
| JP2017135318A (ja) * | 2016-01-29 | 2017-08-03 | 株式会社ブイ・テクノロジー | 配線基板の配線修正装置、配線基板の製造方法、配線基板、および表示装置 |
| KR102378976B1 (ko) * | 2016-05-18 | 2022-03-24 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 박리 방법, 표시 장치, 모듈, 및 전자 기기 |
| KR102308784B1 (ko) | 2020-02-28 | 2021-10-01 | 한양대학교 산학협력단 | 텔루륨 산화물 및 이를 채널층으로 구비하는 박막트랜지스터 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05152529A (ja) * | 1991-11-29 | 1993-06-18 | Oki Electric Ind Co Ltd | 半導体装置 |
| JP3778964B2 (ja) * | 1995-02-15 | 2006-05-24 | 株式会社半導体エネルギー研究所 | アクティブマトリクス表示装置 |
| JP3713418B2 (ja) * | 2000-05-30 | 2005-11-09 | 光正 小柳 | ３次元画像処理装置の製造方法 |
| JP4921645B2 (ja) * | 2001-03-01 | 2012-04-25 | セイコーインスツル株式会社 | ウエハレベルｃｓｐ |
| JP4408006B2 (ja) * | 2001-06-28 | 2010-02-03 | 富士通マイクロエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
| JP2004349513A (ja) * | 2003-05-22 | 2004-12-09 | Seiko Epson Corp | 薄膜回路装置及びその製造方法、並びに電気光学装置、電子機器 |
| JP4285604B2 (ja) * | 2003-09-19 | 2009-06-24 | 株式会社フジクラ | 貫通電極付き基板、その製造方法及び電子デバイス |
-
2006
- 2006-07-24 JP JP2006200298A patent/JP5127178B2/ja not_active Expired - Fee Related
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