JP2007043170A5 - - Google Patents
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- Publication number
- JP2007043170A5 JP2007043170A5 JP2006209468A JP2006209468A JP2007043170A5 JP 2007043170 A5 JP2007043170 A5 JP 2007043170A5 JP 2006209468 A JP2006209468 A JP 2006209468A JP 2006209468 A JP2006209468 A JP 2006209468A JP 2007043170 A5 JP2007043170 A5 JP 2007043170A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cooling
- substrate support
- thermal conductor
- cooling channels
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 86
- 238000001816 cooling Methods 0.000 claims description 71
- 238000010438 heat treatment Methods 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 22
- 239000012809 cooling fluid Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 15
- 239000010935 stainless steel Substances 0.000 claims description 13
- 229910001220 stainless steel Inorganic materials 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 9
- 239000002470 thermal conductor Substances 0.000 claims 14
- 239000011159 matrix material Substances 0.000 claims 2
- 239000004973 liquid crystal related substance Substances 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- 239000007789 gas Substances 0.000 description 5
- 239000003570 air Substances 0.000 description 4
- 239000000498 cooling water Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000003507 refrigerant Substances 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000000112 cooling gas Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052756 noble gas Inorganic materials 0.000 description 1
- 150000002835 noble gases Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US70503105P | 2005-08-02 | 2005-08-02 | |
| US60/705031 | 2005-08-02 | ||
| US11/213348 | 2005-08-24 | ||
| US11/213,348 US7429718B2 (en) | 2005-08-02 | 2005-08-24 | Heating and cooling of substrate support |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007043170A JP2007043170A (ja) | 2007-02-15 |
| JP2007043170A5 true JP2007043170A5 (enExample) | 2014-02-27 |
| JP5517392B2 JP5517392B2 (ja) | 2014-06-11 |
Family
ID=37800793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006209468A Active JP5517392B2 (ja) | 2005-08-02 | 2006-08-01 | 基板支持アセンブリ、プロセスチャンバ及びプロセスチャンバ内の基板の温度を維持するための方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5517392B2 (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101374583B1 (ko) * | 2007-03-01 | 2014-03-17 | 어플라이드 머티어리얼스, 인코포레이티드 | Ｒｆ 셔터 |
| WO2009016870A1 (ja) * | 2007-08-01 | 2009-02-05 | Sharp Kabushiki Kaisha | 加熱処理装置および加熱処理方法 |
| TWI565444B (zh) * | 2011-04-25 | 2017-01-11 | 鴻準精密工業股份有限公司 | 加熱及冷卻裝置 |
| KR101493983B1 (ko) * | 2013-11-14 | 2015-02-17 | 주식회사 선익시스템 | 유기 태양전지 기판의 가열 장치 |
| WO2020112764A1 (en) * | 2018-11-28 | 2020-06-04 | Lam Research Corporation | Pedestal including vapor chamber for substrate processing systems |
| KR102188261B1 (ko) * | 2019-08-02 | 2020-12-09 | 세미기어, 인코포레이션 | 기판 냉각 장치 및 방법 |
| JP2021064695A (ja) * | 2019-10-11 | 2021-04-22 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
| CN113517211B (zh) * | 2021-04-16 | 2024-05-17 | 北京北方华创微电子装备有限公司 | 半导体工艺设备及薄膜沉积方法 |
| JP7744187B2 (ja) * | 2021-09-15 | 2025-09-25 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理装置、基板処理システムおよび基板処理方法 |
| JP7704891B2 (ja) * | 2021-12-06 | 2025-07-08 | 株式会社Kokusai Electric | 天井ヒータ、半導体装置の製造方法、基板処理方法及び基板処理装置 |
| CN115305452B (zh) * | 2022-07-06 | 2023-09-08 | 北京北方华创微电子装备有限公司 | 反应腔室 |
| CN118501202B (zh) * | 2024-07-17 | 2024-10-15 | 湖南隆深氢能科技有限公司 | 一种钢带加热用测试系统及测试方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62277234A (ja) * | 1986-05-23 | 1987-12-02 | Canon Inc | 静電チヤツク装置 |
| JP3021264B2 (ja) * | 1993-12-13 | 2000-03-15 | アネルバ株式会社 | 基板加熱・冷却機構 |
| JP2002009064A (ja) * | 2000-06-21 | 2002-01-11 | Hitachi Ltd | 試料の処理装置及び試料の処理方法 |
| JP4945031B2 (ja) * | 2001-05-02 | 2012-06-06 | アプライド マテリアルズ インコーポレイテッド | 基板加熱装置および半導体製造装置 |
| JP3921060B2 (ja) * | 2001-08-31 | 2007-05-30 | 京セラ株式会社 | ウエハ加熱装置 |
| JP2003163244A (ja) * | 2001-11-28 | 2003-06-06 | Taiheiyo Cement Corp | ウェハプローバ |
| JP3908678B2 (ja) * | 2003-02-28 | 2007-04-25 | 株式会社日立ハイテクノロジーズ | ウエハ処理方法 |
| WO2004095531A2 (en) * | 2003-03-28 | 2004-11-04 | Tokyo Electron Ltd | Method and system for temperature control of a substrate |
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2006
- 2006-08-01 JP JP2006209468A patent/JP5517392B2/ja active Active
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