JP2007039449A5 - - Google Patents
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- JP2007039449A5 JP2007039449A5 JP2006187278A JP2006187278A JP2007039449A5 JP 2007039449 A5 JP2007039449 A5 JP 2007039449A5 JP 2006187278 A JP2006187278 A JP 2006187278A JP 2006187278 A JP2006187278 A JP 2006187278A JP 2007039449 A5 JP2007039449 A5 JP 2007039449A5
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- JP
- Japan
- Prior art keywords
- group
- formula
- alkyl group
- hydrogen atom
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims 5
- 239000004593 Epoxy Substances 0.000 claims 4
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims 4
- 125000003700 epoxy group Chemical group 0.000 claims 4
- 125000004435 hydrogen atoms Chemical group [H]* 0.000 claims 4
- -1 isophthalic acid compound Chemical class 0.000 claims 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 4
- 229920005989 resin Polymers 0.000 claims 4
- 239000011347 resin Substances 0.000 claims 4
- 150000001875 compounds Chemical class 0.000 claims 3
- 125000003837 (C1-C20) alkyl group Chemical group 0.000 claims 2
- 125000004191 (C1-C6) alkoxy group Chemical group 0.000 claims 2
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 claims 2
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 claims 2
- 125000002252 acyl group Chemical group 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 239000003822 epoxy resin Substances 0.000 claims 2
- 125000005843 halogen group Chemical group 0.000 claims 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Substances C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 229920000647 polyepoxide Polymers 0.000 claims 2
- 125000001424 substituent group Chemical group 0.000 claims 2
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000003054 catalyst Substances 0.000 claims 1
- 238000005755 formation reaction Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 0 Cc1c(*)[n](*)c(*)n1 Chemical compound Cc1c(*)[n](*)c(*)n1 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006187278A JP5068045B2 (ja) | 2005-07-06 | 2006-07-06 | 包接化合物、硬化触媒、硬化樹脂形成用組成物及び硬化樹脂 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005198134 | 2005-07-06 | ||
| JP2005198134 | 2005-07-06 | ||
| JP2006187278A JP5068045B2 (ja) | 2005-07-06 | 2006-07-06 | 包接化合物、硬化触媒、硬化樹脂形成用組成物及び硬化樹脂 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012157213A Division JP2012232994A (ja) | 2005-07-06 | 2012-07-13 | 包接化合物、硬化触媒、硬化樹脂形成用組成物及び硬化樹脂 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007039449A JP2007039449A (ja) | 2007-02-15 |
| JP2007039449A5 true JP2007039449A5 (ru) | 2009-08-13 |
| JP5068045B2 JP5068045B2 (ja) | 2012-11-07 |
Family
ID=37797759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006187278A Expired - Fee Related JP5068045B2 (ja) | 2005-07-06 | 2006-07-06 | 包接化合物、硬化触媒、硬化樹脂形成用組成物及び硬化樹脂 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5068045B2 (ru) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101563326B (zh) * | 2006-12-21 | 2012-10-31 | 日本曹达株式会社 | 包合化合物、固化催化剂、固化树脂形成用组合物及固化树脂 |
| US8735529B2 (en) | 2006-12-21 | 2014-05-27 | Nippon Soda Co., Ltd. | Clathrate compound, curing catalyst, composition for forming cured resin, and cured resin |
| CN101802049B (zh) * | 2007-09-21 | 2012-09-12 | 日本曹达株式会社 | 含有包合配合物的半导体封装用环氧树脂组合物 |
| JP2010180337A (ja) * | 2009-02-06 | 2010-08-19 | Nippon Soda Co Ltd | 半導体封止用エポキシ樹脂組成物 |
| EP2392603B1 (en) | 2009-03-11 | 2017-07-26 | Nippon Soda Co., Ltd. | Epoxy resin composition, curing agent, and curing accelerator |
| JP5459873B2 (ja) * | 2009-03-17 | 2014-04-02 | 日本曹達株式会社 | 包接錯体、硬化剤、硬化促進剤、エポキシ樹脂組成物及び半導体封止用エポキシ樹脂組成物 |
| JP5177763B2 (ja) | 2009-06-04 | 2013-04-10 | 日東電工株式会社 | 半導体封止用エポキシ樹脂組成物およびそれを用いた半導体装置 |
| ES2634509T3 (es) | 2009-10-16 | 2017-09-28 | Nippon Soda Co., Ltd. | Composición para la formación de resina epoxi curada y productos curados de la misma |
| JP5595047B2 (ja) * | 2010-01-07 | 2014-09-24 | 日本曹達株式会社 | 包接化合物、それを含有するエポキシ樹脂用硬化剤又は硬化促進剤及びエポキシ樹脂組成物 |
| JP5602669B2 (ja) * | 2010-03-31 | 2014-10-08 | リンテック株式会社 | 半導体用接着剤組成物、半導体用接着シートおよび半導体装置の製造方法 |
| KR20130008611A (ko) * | 2010-05-21 | 2013-01-22 | 닛뽕소다 가부시키가이샤 | 경화성 분체 도료 조성물 및 그 경화물 |
| TWI473831B (zh) * | 2010-09-15 | 2015-02-21 | Nippon Soda Co | Liquid hardened epoxy resin composition and a binder containing the same |
| JP6046894B2 (ja) * | 2011-12-28 | 2016-12-21 | ナミックス株式会社 | 液状封止材 |
| JP5875888B2 (ja) * | 2012-02-17 | 2016-03-02 | 日本曹達株式会社 | Ｓｕｓ基板用接着剤 |
| JP2013213168A (ja) * | 2012-04-04 | 2013-10-17 | Nippon Soda Co Ltd | プリプレグ用エポキシ樹脂組成物 |
| JP2014122181A (ja) * | 2012-12-21 | 2014-07-03 | Nippon Soda Co Ltd | 芳香族ポリアミン包接化合物 |
| JP2014185115A (ja) | 2013-03-25 | 2014-10-02 | Nippon Soda Co Ltd | 新規な包接化合物 |
| WO2016117298A1 (ja) * | 2015-01-19 | 2016-07-28 | 日本曹達株式会社 | 包接化合物の結晶多形、それを含有する硬化性組成物、及び硬化物 |
| US10508068B2 (en) | 2015-01-19 | 2019-12-17 | Nippon Soda Co., Ltd. | Production method for inclusion compound |
| TWI734686B (zh) | 2015-05-19 | 2021-08-01 | 瑞士商亨斯邁先進材料授權（瑞士）有限公司 | 熱固性環氧樹脂之固化劑及製備電機工程用絕緣系統的方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB840130A (en) * | 1957-08-29 | 1960-07-06 | Ici Ltd | Oxidation of organic compounds |
| JP3096830B2 (ja) * | 1991-10-25 | 2000-10-10 | 英史 平井 | 芳香族カルボン酸またはその誘導体にカルボキシル基を導入する方法 |
| JP3904311B2 (ja) * | 1996-12-27 | 2007-04-11 | 日本曹達株式会社 | エポキシ樹脂用硬化剤・硬化促進剤及びエポキシ樹脂組成物 |
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2006
- 2006-07-06 JP JP2006187278A patent/JP5068045B2/ja not_active Expired - Fee Related