JP2007035904A5 - - Google Patents
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- Publication number
- JP2007035904A5 JP2007035904A5 JP2005216752A JP2005216752A JP2007035904A5 JP 2007035904 A5 JP2007035904 A5 JP 2007035904A5 JP 2005216752 A JP2005216752 A JP 2005216752A JP 2005216752 A JP2005216752 A JP 2005216752A JP 2007035904 A5 JP2007035904 A5 JP 2007035904A5
- Authority
- JP
- Japan
- Prior art keywords
- film
- contact layer
- ohmic contact
- semiconductor thin
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010408 film Substances 0.000 claims 48
- 239000010409 thin film Substances 0.000 claims 18
- 239000004065 semiconductor Substances 0.000 claims 16
- 239000000758 substrate Substances 0.000 claims 16
- 238000004519 manufacturing process Methods 0.000 claims 14
- 238000000059 patterning Methods 0.000 claims 10
- 238000001312 dry etching Methods 0.000 claims 8
- 239000002184 metal Substances 0.000 claims 7
- 230000015572 biosynthetic process Effects 0.000 claims 5
- 238000005530 etching Methods 0.000 claims 5
- 238000005755 formation reaction Methods 0.000 claims 5
- 238000001039 wet etching Methods 0.000 claims 4
- 238000000206 photolithography Methods 0.000 claims 2
- 239000007769 metal material Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000009751 slip forming Methods 0.000 claims 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005216752A JP5087825B2 (ja) | 2005-07-27 | 2005-07-27 | アクティブ基板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005216752A JP5087825B2 (ja) | 2005-07-27 | 2005-07-27 | アクティブ基板の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2007035904A JP2007035904A (ja) | 2007-02-08 |
JP2007035904A5 true JP2007035904A5 (zh) | 2008-08-07 |
JP5087825B2 JP5087825B2 (ja) | 2012-12-05 |
Family
ID=37794796
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005216752A Expired - Fee Related JP5087825B2 (ja) | 2005-07-27 | 2005-07-27 | アクティブ基板の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5087825B2 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101308534B1 (ko) * | 2007-07-18 | 2013-09-23 | 삼성디스플레이 주식회사 | 표시 기판 및 이의 제조 방법 |
KR101640293B1 (ko) * | 2010-10-07 | 2016-07-15 | 샤프 가부시키가이샤 | 반도체 장치, 표시 장치, 및 반도체 장치 및 표시 장치의 제조 방법 |
KR20120039947A (ko) * | 2010-10-18 | 2012-04-26 | 삼성모바일디스플레이주식회사 | 표시 장치 및 그 제조 방법 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1010583A (ja) * | 1996-04-22 | 1998-01-16 | Sharp Corp | アクティブマトリクス基板の製造方法、およびそのアクティブマトリクス基板 |
JP3352604B2 (ja) * | 1997-03-24 | 2002-12-03 | シャープ株式会社 | 薄膜素子の製造方法及びドライエッチング装置 |
JPH11264995A (ja) * | 1998-03-17 | 1999-09-28 | Idemitsu Kosan Co Ltd | 液晶表示装置の製造方法 |
JP4796221B2 (ja) * | 1998-11-26 | 2011-10-19 | 三星電子株式会社 | 液晶表示装置用薄膜トランジスタ基板及びその製造方法 |
JP2001264811A (ja) * | 2000-03-22 | 2001-09-26 | Fujitsu Ltd | 液晶表示装置の製造方法及び露光装置 |
JP4651929B2 (ja) * | 2002-11-15 | 2011-03-16 | Nec液晶テクノロジー株式会社 | 液晶表示装置の製造方法 |
JP4380243B2 (ja) * | 2003-07-18 | 2009-12-09 | カシオ計算機株式会社 | 薄膜トランジスタパネルの製造方法 |
-
2005
- 2005-07-27 JP JP2005216752A patent/JP5087825B2/ja not_active Expired - Fee Related
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