JP2007027559A - 表面実装型電子部品、その製造方法および光学電子機器 - Google Patents

表面実装型電子部品、その製造方法および光学電子機器 Download PDF

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Publication number
JP2007027559A
JP2007027559A JP2005210115A JP2005210115A JP2007027559A JP 2007027559 A JP2007027559 A JP 2007027559A JP 2005210115 A JP2005210115 A JP 2005210115A JP 2005210115 A JP2005210115 A JP 2005210115A JP 2007027559 A JP2007027559 A JP 2007027559A
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JP
Japan
Prior art keywords
electronic component
resin
photoelectric effect
effect element
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005210115A
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English (en)
Japanese (ja)
Other versions
JP2007027559A5 (https=
Inventor
Takahiro Matsuyama
貴洋 松山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP2005210115A priority Critical patent/JP2007027559A/ja
Publication of JP2007027559A publication Critical patent/JP2007027559A/ja
Publication of JP2007027559A5 publication Critical patent/JP2007027559A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
  • Light Receiving Elements (AREA)
JP2005210115A 2005-07-20 2005-07-20 表面実装型電子部品、その製造方法および光学電子機器 Pending JP2007027559A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005210115A JP2007027559A (ja) 2005-07-20 2005-07-20 表面実装型電子部品、その製造方法および光学電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005210115A JP2007027559A (ja) 2005-07-20 2005-07-20 表面実装型電子部品、その製造方法および光学電子機器

Publications (2)

Publication Number Publication Date
JP2007027559A true JP2007027559A (ja) 2007-02-01
JP2007027559A5 JP2007027559A5 (https=) 2007-05-17

Family

ID=37787898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005210115A Pending JP2007027559A (ja) 2005-07-20 2005-07-20 表面実装型電子部品、その製造方法および光学電子機器

Country Status (1)

Country Link
JP (1) JP2007027559A (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008053546A (ja) * 2006-08-25 2008-03-06 Tdk Corp 受光素子
JP2008288539A (ja) * 2007-05-16 2008-11-27 Philips Lumileds Lightng Co Llc 実装用に半導体発光デバイスを前処理するための方法
JP2009099680A (ja) * 2007-10-15 2009-05-07 Panasonic Corp 光学デバイスおよびその製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0480989A (ja) * 1990-07-23 1992-03-13 Nec Home Electron Ltd 封止樹脂の塞止め構造
JP2001250889A (ja) * 2000-03-06 2001-09-14 Matsushita Electric Ind Co Ltd 光素子の実装構造体およびその製造方法
JP2003273371A (ja) * 2002-03-19 2003-09-26 Matsushita Electric Ind Co Ltd 集積回路素子の実装構造および実装方法
JP2005166870A (ja) * 2003-12-02 2005-06-23 Seiko Epson Corp 光素子及びその製造方法、光モジュール、光伝送装置
JP2006186288A (ja) * 2004-09-14 2006-07-13 Sony Chem Corp 機能素子実装モジュール及びその製造方法
JP2007189182A (ja) * 2005-03-09 2007-07-26 Pioneer Electronic Corp 光検出半導体装置及びその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0480989A (ja) * 1990-07-23 1992-03-13 Nec Home Electron Ltd 封止樹脂の塞止め構造
JP2001250889A (ja) * 2000-03-06 2001-09-14 Matsushita Electric Ind Co Ltd 光素子の実装構造体およびその製造方法
JP2003273371A (ja) * 2002-03-19 2003-09-26 Matsushita Electric Ind Co Ltd 集積回路素子の実装構造および実装方法
JP2005166870A (ja) * 2003-12-02 2005-06-23 Seiko Epson Corp 光素子及びその製造方法、光モジュール、光伝送装置
JP2006186288A (ja) * 2004-09-14 2006-07-13 Sony Chem Corp 機能素子実装モジュール及びその製造方法
JP2007189182A (ja) * 2005-03-09 2007-07-26 Pioneer Electronic Corp 光検出半導体装置及びその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008053546A (ja) * 2006-08-25 2008-03-06 Tdk Corp 受光素子
JP2008288539A (ja) * 2007-05-16 2008-11-27 Philips Lumileds Lightng Co Llc 実装用に半導体発光デバイスを前処理するための方法
JP2009099680A (ja) * 2007-10-15 2009-05-07 Panasonic Corp 光学デバイスおよびその製造方法

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