JP2007027488A - 半導体ウェーハの研磨方法 - Google Patents

半導体ウェーハの研磨方法 Download PDF

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Publication number
JP2007027488A
JP2007027488A JP2005208738A JP2005208738A JP2007027488A JP 2007027488 A JP2007027488 A JP 2007027488A JP 2005208738 A JP2005208738 A JP 2005208738A JP 2005208738 A JP2005208738 A JP 2005208738A JP 2007027488 A JP2007027488 A JP 2007027488A
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Japan
Prior art keywords
polishing
silicon wafer
cloth
semiconductor wafer
rough
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Pending
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JP2005208738A
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English (en)
Japanese (ja)
Inventor
Takahiro Kanda
貴裕 神田
Kosuke Miyoshi
康介 三好
Kazuo Ogata
和郎 緒方
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumco Techxiv Corp
Original Assignee
Komatsu Electronic Metals Co Ltd
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Publication date
Application filed by Komatsu Electronic Metals Co Ltd filed Critical Komatsu Electronic Metals Co Ltd
Priority to JP2005208738A priority Critical patent/JP2007027488A/ja
Priority to TW095115591A priority patent/TW200735204A/zh
Publication of JP2007027488A publication Critical patent/JP2007027488A/ja
Pending legal-status Critical Current

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  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2005208738A 2005-07-19 2005-07-19 半導体ウェーハの研磨方法 Pending JP2007027488A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005208738A JP2007027488A (ja) 2005-07-19 2005-07-19 半導体ウェーハの研磨方法
TW095115591A TW200735204A (en) 2005-07-19 2006-05-02 Method for polishing semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005208738A JP2007027488A (ja) 2005-07-19 2005-07-19 半導体ウェーハの研磨方法

Publications (1)

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JP2007027488A true JP2007027488A (ja) 2007-02-01

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ID=37787848

Family Applications (1)

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JP2005208738A Pending JP2007027488A (ja) 2005-07-19 2005-07-19 半導体ウェーハの研磨方法

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JP (1) JP2007027488A (https=)
TW (1) TW200735204A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5622124B2 (ja) * 2010-07-02 2014-11-12 株式会社Sumco シリコンウェーハの研磨方法
CN113649859A (zh) * 2021-08-17 2021-11-16 顺芯科技有限公司 一种加速代谢晶圆研磨废弃物的方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102709170A (zh) * 2012-05-08 2012-10-03 常州天合光能有限公司 用于少子寿命测量的硅片表面处理方法
JP6924710B2 (ja) * 2018-01-09 2021-08-25 信越半導体株式会社 研磨装置および研磨方法
CN109396967B (zh) * 2018-12-12 2020-10-02 中国电子科技集团公司第四十六研究所 一种用于硒化镉晶体的化学机械抛光方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10112450A (ja) * 1996-10-04 1998-04-28 Komatsu Electron Metals Co Ltd 半導体ウェハの製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10112450A (ja) * 1996-10-04 1998-04-28 Komatsu Electron Metals Co Ltd 半導体ウェハの製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5622124B2 (ja) * 2010-07-02 2014-11-12 株式会社Sumco シリコンウェーハの研磨方法
CN113649859A (zh) * 2021-08-17 2021-11-16 顺芯科技有限公司 一种加速代谢晶圆研磨废弃物的方法

Also Published As

Publication number Publication date
TWI310222B (https=) 2009-05-21
TW200735204A (en) 2007-09-16

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