TW200735204A - Method for polishing semiconductor wafer - Google Patents

Method for polishing semiconductor wafer

Info

Publication number
TW200735204A
TW200735204A TW095115591A TW95115591A TW200735204A TW 200735204 A TW200735204 A TW 200735204A TW 095115591 A TW095115591 A TW 095115591A TW 95115591 A TW95115591 A TW 95115591A TW 200735204 A TW200735204 A TW 200735204A
Authority
TW
Taiwan
Prior art keywords
polishing
polishing process
silicon wafer
wafer
cloth
Prior art date
Application number
TW095115591A
Other languages
English (en)
Chinese (zh)
Other versions
TWI310222B (https=
Inventor
Takahiro Kanda
Kosuke Miyoshi
Kazuo Ogata
Original Assignee
Komatsu Denshi Kinzoku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Denshi Kinzoku Kk filed Critical Komatsu Denshi Kinzoku Kk
Publication of TW200735204A publication Critical patent/TW200735204A/zh
Application granted granted Critical
Publication of TWI310222B publication Critical patent/TWI310222B/zh

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW095115591A 2005-07-19 2006-05-02 Method for polishing semiconductor wafer TW200735204A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005208738A JP2007027488A (ja) 2005-07-19 2005-07-19 半導体ウェーハの研磨方法

Publications (2)

Publication Number Publication Date
TW200735204A true TW200735204A (en) 2007-09-16
TWI310222B TWI310222B (https=) 2009-05-21

Family

ID=37787848

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095115591A TW200735204A (en) 2005-07-19 2006-05-02 Method for polishing semiconductor wafer

Country Status (2)

Country Link
JP (1) JP2007027488A (https=)
TW (1) TW200735204A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110026881A (zh) * 2018-01-09 2019-07-19 信越半导体株式会社 研磨装置及研磨方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130095660A1 (en) * 2010-07-02 2013-04-18 Sumco Corporation Method for polishing silicon wafer
CN102709170A (zh) * 2012-05-08 2012-10-03 常州天合光能有限公司 用于少子寿命测量的硅片表面处理方法
CN109396967B (zh) * 2018-12-12 2020-10-02 中国电子科技集团公司第四十六研究所 一种用于硒化镉晶体的化学机械抛光方法
CN113649859A (zh) * 2021-08-17 2021-11-16 顺芯科技有限公司 一种加速代谢晶圆研磨废弃物的方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4066202B2 (ja) * 1996-10-04 2008-03-26 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェハの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110026881A (zh) * 2018-01-09 2019-07-19 信越半导体株式会社 研磨装置及研磨方法

Also Published As

Publication number Publication date
JP2007027488A (ja) 2007-02-01
TWI310222B (https=) 2009-05-21

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