JP2007019267A - 配線基板、およびこの配線基板を備えた電子機器 - Google Patents

配線基板、およびこの配線基板を備えた電子機器 Download PDF

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Publication number
JP2007019267A
JP2007019267A JP2005199151A JP2005199151A JP2007019267A JP 2007019267 A JP2007019267 A JP 2007019267A JP 2005199151 A JP2005199151 A JP 2005199151A JP 2005199151 A JP2005199151 A JP 2005199151A JP 2007019267 A JP2007019267 A JP 2007019267A
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JP
Japan
Prior art keywords
wiring board
electronic component
substrate
mark
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2005199151A
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English (en)
Japanese (ja)
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JP2007019267A5 (enrdf_load_stackoverflow
Inventor
Daigo Suzuki
大悟 鈴木
Akihiko Happoya
明彦 八甫谷
Shusuke Tanaka
秀典 田中
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Toshiba Corp
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Toshiba Corp
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Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2005199151A priority Critical patent/JP2007019267A/ja
Publication of JP2007019267A publication Critical patent/JP2007019267A/ja
Publication of JP2007019267A5 publication Critical patent/JP2007019267A5/ja
Pending legal-status Critical Current

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  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2005199151A 2005-07-07 2005-07-07 配線基板、およびこの配線基板を備えた電子機器 Pending JP2007019267A (ja)

Priority Applications (1)

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JP2005199151A JP2007019267A (ja) 2005-07-07 2005-07-07 配線基板、およびこの配線基板を備えた電子機器

Applications Claiming Priority (1)

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JP2005199151A JP2007019267A (ja) 2005-07-07 2005-07-07 配線基板、およびこの配線基板を備えた電子機器

Publications (2)

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JP2007019267A true JP2007019267A (ja) 2007-01-25
JP2007019267A5 JP2007019267A5 (enrdf_load_stackoverflow) 2008-07-03

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ID=37756149

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JP2005199151A Pending JP2007019267A (ja) 2005-07-07 2005-07-07 配線基板、およびこの配線基板を備えた電子機器

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JP (1) JP2007019267A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008244177A (ja) * 2007-03-27 2008-10-09 Matsushita Electric Works Ltd 凹凸回路基板の製造方法
JP2009239247A (ja) * 2008-03-27 2009-10-15 Ibiden Co Ltd 多層プリント配線板の製造方法
WO2009147936A1 (ja) * 2008-06-02 2009-12-10 イビデン株式会社 多層プリント配線板の製造方法
US7935893B2 (en) 2008-02-14 2011-05-03 Ibiden Co., Ltd. Method of manufacturing printed wiring board with built-in electronic component
US8024858B2 (en) 2008-02-14 2011-09-27 Ibiden Co., Ltd. Method of manufacturing printed wiring board with built-in electronic component
US8327533B2 (en) 2008-03-21 2012-12-11 Ibiden Co., Ltd. Printed wiring board with resin complex layer and manufacturing method thereof
US8710374B2 (en) 2008-03-12 2014-04-29 Ibiden Co., Ltd. Printed wiring board with reinforced insulation layer and manufacturing method thereof

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1154560A (ja) * 1997-08-01 1999-02-26 Seiko Epson Corp Ｉｃ実装方法、液晶表示装置及び電子機器
JP2001332863A (ja) * 2000-02-25 2001-11-30 Ibiden Co Ltd 多層プリント配線板の製造方法
JP2002118363A (ja) * 2000-10-12 2002-04-19 Nippon Avionics Co Ltd 多層プリント配線板およびその製造方法
JP2003204167A (ja) * 2001-10-26 2003-07-18 Matsushita Electric Works Ltd 配線板用シート材及びその製造方法、並びに多層板及びその製造方法
JP2003209357A (ja) * 2002-01-15 2003-07-25 Sony Corp 多層基板製造方法
JP2004296562A (ja) * 2003-03-26 2004-10-21 Sharp Corp 電子部品内蔵基板及びその製造方法
JP2004343021A (ja) * 2003-03-17 2004-12-02 Matsushita Electric Ind Co Ltd 部品内蔵モジュールの製造方法及び製造装置
JP2007503713A (ja) * 2003-08-26 2007-02-22 イムベラ エレクトロニクス オサケユキチュア 電子モジュールおよびその製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1154560A (ja) * 1997-08-01 1999-02-26 Seiko Epson Corp Ｉｃ実装方法、液晶表示装置及び電子機器
JP2001332863A (ja) * 2000-02-25 2001-11-30 Ibiden Co Ltd 多層プリント配線板の製造方法
JP2002118363A (ja) * 2000-10-12 2002-04-19 Nippon Avionics Co Ltd 多層プリント配線板およびその製造方法
JP2003204167A (ja) * 2001-10-26 2003-07-18 Matsushita Electric Works Ltd 配線板用シート材及びその製造方法、並びに多層板及びその製造方法
JP2003209357A (ja) * 2002-01-15 2003-07-25 Sony Corp 多層基板製造方法
JP2004343021A (ja) * 2003-03-17 2004-12-02 Matsushita Electric Ind Co Ltd 部品内蔵モジュールの製造方法及び製造装置
JP2004296562A (ja) * 2003-03-26 2004-10-21 Sharp Corp 電子部品内蔵基板及びその製造方法
JP2007503713A (ja) * 2003-08-26 2007-02-22 イムベラ エレクトロニクス オサケユキチュア 電子モジュールおよびその製造方法

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008244177A (ja) * 2007-03-27 2008-10-09 Matsushita Electric Works Ltd 凹凸回路基板の製造方法
US7935893B2 (en) 2008-02-14 2011-05-03 Ibiden Co., Ltd. Method of manufacturing printed wiring board with built-in electronic component
US8024858B2 (en) 2008-02-14 2011-09-27 Ibiden Co., Ltd. Method of manufacturing printed wiring board with built-in electronic component
US8336205B2 (en) 2008-02-14 2012-12-25 Ibiden Co., Ltd. Method of manufacturing printed wiring board with built-in electronic component
US8613136B2 (en) 2008-02-14 2013-12-24 Ibiden Co., Ltd. Method of manufacturing printed wiring board with built-in electronic component
US8710374B2 (en) 2008-03-12 2014-04-29 Ibiden Co., Ltd. Printed wiring board with reinforced insulation layer and manufacturing method thereof
US8327533B2 (en) 2008-03-21 2012-12-11 Ibiden Co., Ltd. Printed wiring board with resin complex layer and manufacturing method thereof
JP2009239247A (ja) * 2008-03-27 2009-10-15 Ibiden Co Ltd 多層プリント配線板の製造方法
WO2009147936A1 (ja) * 2008-06-02 2009-12-10 イビデン株式会社 多層プリント配線板の製造方法
JPWO2009147936A1 (ja) * 2008-06-02 2011-10-27 イビデン株式会社 多層プリント配線板の製造方法
US8291584B2 (en) 2008-06-02 2012-10-23 Ibiden Co., Ltd. Method of manufacturing a printed wiring board with built-in electronic component

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