JP2007007774A5 - - Google Patents

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Publication number
JP2007007774A5
JP2007007774A5 JP2005191656A JP2005191656A JP2007007774A5 JP 2007007774 A5 JP2007007774 A5 JP 2007007774A5 JP 2005191656 A JP2005191656 A JP 2005191656A JP 2005191656 A JP2005191656 A JP 2005191656A JP 2007007774 A5 JP2007007774 A5 JP 2007007774A5
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JP
Japan
Prior art keywords
electro mechanical
micro electro
package
mechanical device
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005191656A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007007774A (ja
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Publication date
Application filed filed Critical
Priority to JP2005191656A priority Critical patent/JP2007007774A/ja
Priority claimed from JP2005191656A external-priority patent/JP2007007774A/ja
Publication of JP2007007774A publication Critical patent/JP2007007774A/ja
Publication of JP2007007774A5 publication Critical patent/JP2007007774A5/ja
Withdrawn legal-status Critical Current

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JP2005191656A 2005-06-30 2005-06-30 微小電気機械装置用パッケージおよびその製造方法 Withdrawn JP2007007774A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005191656A JP2007007774A (ja) 2005-06-30 2005-06-30 微小電気機械装置用パッケージおよびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005191656A JP2007007774A (ja) 2005-06-30 2005-06-30 微小電気機械装置用パッケージおよびその製造方法

Publications (2)

Publication Number Publication Date
JP2007007774A JP2007007774A (ja) 2007-01-18
JP2007007774A5 true JP2007007774A5 (enExample) 2008-07-31

Family

ID=37746899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005191656A Withdrawn JP2007007774A (ja) 2005-06-30 2005-06-30 微小電気機械装置用パッケージおよびその製造方法

Country Status (1)

Country Link
JP (1) JP2007007774A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009285810A (ja) * 2008-05-30 2009-12-10 Toshiba Corp 半導体装置およびその製造方法
JP5624866B2 (ja) * 2010-12-06 2014-11-12 ローム株式会社 Ｍｅｍｓセンサの製造方法
JP5937778B2 (ja) * 2010-09-29 2016-06-22 株式会社小糸製作所 電子部品および電子部品の接続構造
JP6223085B2 (ja) * 2013-09-13 2017-11-01 新日本無線株式会社 半導体装置の製造方法

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