JP2007007774A - 微小電気機械装置用パッケージおよびその製造方法 - Google Patents

微小電気機械装置用パッケージおよびその製造方法 Download PDF

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Publication number
JP2007007774A
JP2007007774A JP2005191656A JP2005191656A JP2007007774A JP 2007007774 A JP2007007774 A JP 2007007774A JP 2005191656 A JP2005191656 A JP 2005191656A JP 2005191656 A JP2005191656 A JP 2005191656A JP 2007007774 A JP2007007774 A JP 2007007774A
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Japan
Prior art keywords
electro mechanical
micro electro
substrate
package
mechanical device
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Withdrawn
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JP2005191656A
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English (en)
Japanese (ja)
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JP2007007774A5 (enExample
Inventor
Takashi Tada
考志 多田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
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Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2005191656A priority Critical patent/JP2007007774A/ja
Publication of JP2007007774A publication Critical patent/JP2007007774A/ja
Publication of JP2007007774A5 publication Critical patent/JP2007007774A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips

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  • Micromachines (AREA)
JP2005191656A 2005-06-30 2005-06-30 微小電気機械装置用パッケージおよびその製造方法 Withdrawn JP2007007774A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005191656A JP2007007774A (ja) 2005-06-30 2005-06-30 微小電気機械装置用パッケージおよびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005191656A JP2007007774A (ja) 2005-06-30 2005-06-30 微小電気機械装置用パッケージおよびその製造方法

Publications (2)

Publication Number Publication Date
JP2007007774A true JP2007007774A (ja) 2007-01-18
JP2007007774A5 JP2007007774A5 (enExample) 2008-07-31

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ID=37746899

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JP2005191656A Withdrawn JP2007007774A (ja) 2005-06-30 2005-06-30 微小電気機械装置用パッケージおよびその製造方法

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JP (1) JP2007007774A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009285810A (ja) * 2008-05-30 2009-12-10 Toshiba Corp 半導体装置およびその製造方法
JP2012074551A (ja) * 2010-09-29 2012-04-12 Koito Mfg Co Ltd 電子部品および電子部品の接続構造
JP2012122772A (ja) * 2010-12-06 2012-06-28 Rohm Co Ltd Ｍｅｍｓセンサおよびその製造方法、ならびにｍｅｍｓパッケージ
JP2015056572A (ja) * 2013-09-13 2015-03-23 新日本無線株式会社 半導体装置およびその製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009285810A (ja) * 2008-05-30 2009-12-10 Toshiba Corp 半導体装置およびその製造方法
JP2012074551A (ja) * 2010-09-29 2012-04-12 Koito Mfg Co Ltd 電子部品および電子部品の接続構造
CN102568759A (zh) * 2010-09-29 2012-07-11 株式会社小糸制作所 电子元件和电子元件的连接结构
JP2012122772A (ja) * 2010-12-06 2012-06-28 Rohm Co Ltd Ｍｅｍｓセンサおよびその製造方法、ならびにｍｅｍｓパッケージ
JP2015056572A (ja) * 2013-09-13 2015-03-23 新日本無線株式会社 半導体装置およびその製造方法

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