JP2007007522A - 液滴吐出装置 - Google Patents
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J11/00—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
- B41J11/0015—Devices or arrangements of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form for treating before, during or after printing or for uniform coating or laminating the copy material before or after printing
- B41J11/002—Curing or drying the ink on the copy materials, e.g. by heating or irradiating
- B41J11/0021—Curing or drying the ink on the copy materials, e.g. by heating or irradiating using irradiation
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
- G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
- G03F7/2018—Masking pattern obtained by selective application of an ink or a toner, e.g. ink jet printing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
- H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
- H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
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- H—ELECTRICITY
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- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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Abstract
液滴吐出及びレーザ照射に関するパラメータの管理が容易であり、液滴をワークに吐出する描画系と、吐出された液滴とレーザスポットの位置合わせを正確かつ迅速にすることができる液滴吐出装置を提供する。
【解決手段】
基台(防振台)2と、機能液を液滴にして吐出する液滴吐出ヘッド31と、液滴吐出ヘッド31を保持するキャリッジ32と、液滴が描画されるワークWを保持するステージ3aと、を備える描画系3と、レーザ光を出力する光源40と、光源40と液滴との間に構成され液滴に入射されるレーザ光が通過する光路4a,4b,4cと、を備える光学系4と、を有し、基台2上に、描画系3と光学系4が共に基台2の上面を基準面として構築されると共に、描画系3と光学系4の連携制御を介してパターン描画・定着が行われる。
【選択図】
図2
Description
2 基台(防振台)
2a ブリッジ
3 描画系
4 光学系
4a,4b,4c 第1〜第3の光路
5 撮像系
31 液滴吐出ヘッド
32 キャリッジ
33 キャリッジ用θ方向回転体
33 ゴニオステージ
34 キャリッジ用Z軸方向移動体
35 キャリッジ用フィード方向移動体
3a ステージ
3b ステージ用θ方向回転体
3c ステージ用フィード方向移動体
3d ステージ用スキャン方向移動体
40 レーザ光源
51 第1のCCDカメラ(第1の電子カメラ)
52 第1のCCDカメラ用Z軸方向移動体
53 第2のCCDカメラ(第2の電子カメラ)
55 仕切り
56 ビームディフューザ
60 制御部
D 液滴
P 配線パターン
S レーザスポット
Claims (10)
- 基台と、
機能液を液滴にして吐出する液滴吐出ヘッドと、前記液滴吐出ヘッドを保持するキャリッジと、前記液滴が描画されるワークを保持するステージと、を備える描画系と、
レーザ光を出力する光源と、前記光源と前記液滴との間に構成され該液滴に入射される前記レーザ光が通過する光路と、を備える光学系と、
を有し、
前記基台上に、該基台上面を共に基準面として前記描画系と前記光学系が構築されると共に、両系の連携制御を介してパターン描画・定着を行うことを特徴とする液滴吐出装置。 - 前記光路は、前記ステージに対して上方から前記レーザ光を前記液滴に入射させる第1の光路を含むことを特徴とする請求項1記載の液滴吐出装置。
- 前記光路は、前記ステージに対して斜め方向から前記レーザ光を前記液滴に入射させる第2の光路を含むことを特徴とする請求項1記載の液滴吐出装置。
- 前記光路は、前記ステージに対して平行な方向から前記レーザ光を前記液滴に入射させる第3の光路を含むことを特徴とする請求項1記載の液滴吐出装置。
- 前記液滴吐出ヘッドを前記レーザ光から保護する保護カバーを有し、前記保護カバーの側面は、前記第3の光路の光路調整時にレーザスポット位置確認用の平面として使用可能であることを特徴とする請求項4記載の液滴吐出装置。
- 前記基台上に設けられ、前記ワークと前記描画系のアライメントをとるための第1の電子カメラと、前記描画系と前記光学系のアライメントをとるための第2の電子カメラと、を有することを特徴とする請求項1記載の液滴吐出装置。
- 描画中、前記キャリッジ及び前記液滴吐出ヘッドは前記基台に対して位置が固定され、前記ステージが移動して描画を行うことを特徴とする請求項1記載の液滴吐出装置。
- 前記光路を通過したレーザが照射されるエリアは、前記ワークの移動方向に沿って、前記液滴が前記ワークに着弾するエリアの前方に位置することを特徴とする請求項1記載の液滴吐出装置。
- 前記機能液は電気的素子、光学的素子又は電気光学的素子の材料を含み、
前記液滴を前記ワーク上に吐出して所定のパターンを描画し、前記液滴に前記レーザ光を照射することによりパターンを定着させて、デバイスを製造することを特徴とする請求項1記載の液滴吐出装置。 - 前記機能液は導電性粒子を含み、
前記液滴を前記ワーク上に吐出して所定のパターンを描画し、前記液滴に前記レーザ光を照射することにより該液滴を乾燥し前記導電性粒子を焼結させて配線パターンを形成することを特徴とする請求項1記載の液滴吐出装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005189508A JP4353145B2 (ja) | 2005-06-29 | 2005-06-29 | 液滴吐出装置 |
US11/421,545 US7726803B2 (en) | 2005-06-29 | 2006-06-01 | Droplet ejection apparatus |
TW095122948A TWI301800B (en) | 2005-06-29 | 2006-06-26 | Droplet ejection apparatus |
KR1020060058018A KR100786211B1 (ko) | 2005-06-29 | 2006-06-27 | 액적 토출 장치 |
CN2006100956985A CN1891461B (zh) | 2005-06-29 | 2006-06-29 | 液滴喷出装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005189508A JP4353145B2 (ja) | 2005-06-29 | 2005-06-29 | 液滴吐出装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007007522A true JP2007007522A (ja) | 2007-01-18 |
JP4353145B2 JP4353145B2 (ja) | 2009-10-28 |
Family
ID=37588941
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005189508A Expired - Fee Related JP4353145B2 (ja) | 2005-06-29 | 2005-06-29 | 液滴吐出装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7726803B2 (ja) |
JP (1) | JP4353145B2 (ja) |
KR (1) | KR100786211B1 (ja) |
CN (1) | CN1891461B (ja) |
TW (1) | TWI301800B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL2016137B1 (en) * | 2016-01-21 | 2017-07-25 | Meyer Burger (Netherlands) B V | Inkjet printing system and method for processing substrates. |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4442677B2 (ja) * | 2007-10-11 | 2010-03-31 | セイコーエプソン株式会社 | 液滴吐出装置の液滴乾燥方法及び液滴吐出装置 |
US8833921B2 (en) | 2010-07-30 | 2014-09-16 | Ricoh Company, Limited | Thin-film forming apparatus, thin-film forming method, piezoelectric-element forming method, droplet discharging head, and ink-jet recording apparatus |
CN102407665B (zh) * | 2010-07-30 | 2015-03-04 | 株式会社理光 | 薄膜形成设备及方法、压电元件形成方法、排放头和设备 |
JP2013063371A (ja) * | 2011-09-15 | 2013-04-11 | Ricoh Co Ltd | 薄膜製造装置のアライメント調整方法、薄膜製造装置、該薄膜製造装置により製造した電気機械変換膜、電気機械変換素子、液滴吐出ヘッド及び液滴吐出装置 |
EP3166774B1 (en) * | 2014-07-13 | 2019-05-22 | Stratasys Ltd. | Method and system for rotational 3d printing |
JP6390407B2 (ja) * | 2014-12-16 | 2018-09-19 | 富士ゼロックス株式会社 | 乾燥装置、画像形成装置、及び乾燥プログラム |
CN111822256A (zh) * | 2020-07-30 | 2020-10-27 | 重庆盛泰光电有限公司 | 基于转盘的摄像头模组点胶系统 |
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- 2006-06-26 TW TW095122948A patent/TWI301800B/zh not_active IP Right Cessation
- 2006-06-27 KR KR1020060058018A patent/KR100786211B1/ko not_active IP Right Cessation
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JP2005502455A (ja) * | 2001-09-10 | 2005-01-27 | セイコーエプソン株式会社 | インクジェット堆積装置および方法 |
JP2003326691A (ja) * | 2002-05-09 | 2003-11-19 | Konica Minolta Holdings Inc | 画像記録方法、エネルギー線硬化インク及び画像記録装置 |
JP2004241770A (ja) * | 2003-01-17 | 2004-08-26 | Semiconductor Energy Lab Co Ltd | 導電層の作製方法及び半導体装置の作製方法 |
JP2004337709A (ja) * | 2003-05-14 | 2004-12-02 | Seiko Epson Corp | 液滴吐出装置、カラーフィルター製造装置、カラーフィルター及びその製造方法、液晶装置、電子機器 |
JP2005081159A (ja) * | 2003-09-04 | 2005-03-31 | Ricoh Co Ltd | 機能性基体製造装置ならびに製造される機能性基体 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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NL2016137B1 (en) * | 2016-01-21 | 2017-07-25 | Meyer Burger (Netherlands) B V | Inkjet printing system and method for processing substrates. |
WO2017126967A1 (en) * | 2016-01-21 | 2017-07-27 | Meyer Burger (Netherlands) B.V. | Inkjet printing system and method for processing substrates |
US10391763B2 (en) | 2016-01-21 | 2019-08-27 | Meyer Burger (Netherlands) B.V. | Inkjet printing system and method for processing substrates |
TWI784937B (zh) * | 2016-01-21 | 2022-12-01 | 荷蘭商梅耶博格荷蘭責任有限公司 | 用以處理基體之噴墨列印系統及方法 |
Also Published As
Publication number | Publication date |
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JP4353145B2 (ja) | 2009-10-28 |
KR100786211B1 (ko) | 2007-12-17 |
US7726803B2 (en) | 2010-06-01 |
TW200706381A (en) | 2007-02-16 |
TWI301800B (en) | 2008-10-11 |
US20070002114A1 (en) | 2007-01-04 |
KR20070001805A (ko) | 2007-01-04 |
CN1891461A (zh) | 2007-01-10 |
CN1891461B (zh) | 2010-12-08 |
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