JP2007000915A5 - - Google Patents

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Publication number
JP2007000915A5
JP2007000915A5 JP2005186111A JP2005186111A JP2007000915A5 JP 2007000915 A5 JP2007000915 A5 JP 2007000915A5 JP 2005186111 A JP2005186111 A JP 2005186111A JP 2005186111 A JP2005186111 A JP 2005186111A JP 2007000915 A5 JP2007000915 A5 JP 2007000915A5
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JP
Japan
Prior art keywords
pressure
soldered
chamber
heating
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005186111A
Other languages
English (en)
Japanese (ja)
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JP2007000915A (ja
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Publication date
Application filed filed Critical
Priority to JP2005186111A priority Critical patent/JP2007000915A/ja
Priority claimed from JP2005186111A external-priority patent/JP2007000915A/ja
Publication of JP2007000915A publication Critical patent/JP2007000915A/ja
Publication of JP2007000915A5 publication Critical patent/JP2007000915A5/ja
Pending legal-status Critical Current

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JP2005186111A 2005-06-27 2005-06-27 半田付け方法及び半田付け装置 Pending JP2007000915A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005186111A JP2007000915A (ja) 2005-06-27 2005-06-27 半田付け方法及び半田付け装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005186111A JP2007000915A (ja) 2005-06-27 2005-06-27 半田付け方法及び半田付け装置

Publications (2)

Publication Number Publication Date
JP2007000915A JP2007000915A (ja) 2007-01-11
JP2007000915A5 true JP2007000915A5 (enrdf_load_stackoverflow) 2008-08-07

Family

ID=37686975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005186111A Pending JP2007000915A (ja) 2005-06-27 2005-06-27 半田付け方法及び半田付け装置

Country Status (1)

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JP (1) JP2007000915A (enrdf_load_stackoverflow)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5045392B2 (ja) * 2007-11-22 2012-10-10 トヨタ自動車株式会社 電子部品と回路基板との接合方法、およびその接合装置
BR112013006989A2 (pt) 2010-09-30 2019-09-24 Dow Global Technologies Llc composição de resina epóxi polifuncional reepoxidada, processo para preparar uma composição de resina epóxi polifuncional reepoxidada, composição de resina epóxi curável, produto termofixo, processo para preparar uma composição e artigo
EP2621993B1 (en) 2010-09-30 2014-09-03 Dow Global Technologies LLC Coating compositions
CN103140532B (zh) 2010-09-30 2016-05-04 蓝立方知识产权有限责任公司 环氧树脂加合物及其热固性材料
BR112013003299A8 (pt) 2010-09-30 2017-10-24 Dow Global Technologies Llc Processo para preparar uma resina epóxi alifática ou cicloalifática
JP5868614B2 (ja) * 2011-05-30 2016-02-24 有限会社ヨコタテクニカ 半田付け装置
JP5778731B2 (ja) * 2012-09-17 2015-09-16 ピーエスケー・インコーポレーテッド 連続線形熱処理装置の配列
JP6506035B2 (ja) * 2015-01-30 2019-04-24 株式会社タムラ製作所 はんだバンプの形成方法
JP6506046B2 (ja) * 2015-02-24 2019-04-24 株式会社タムラ製作所 はんだバンプのリフロー方法
JP6506047B2 (ja) * 2015-02-24 2019-04-24 株式会社タムラ製作所 はんだ接合構造体の製造方法
CN107855622B (zh) * 2017-12-29 2023-05-23 山东才聚电子科技有限公司 一种适应范围广的真空焊接炉
CN107931768B (zh) * 2017-12-29 2023-05-16 山东才聚电子科技有限公司 一种真空焊接炉及焊接工艺
CN107855623B (zh) 2017-12-29 2023-07-18 山东才聚电子科技有限公司 一种真空焊接炉控制系统及其控制方法
JP2020064937A (ja) * 2018-10-16 2020-04-23 トヨタ自動車株式会社 半導体装置の製造方法
CN116727961A (zh) * 2023-03-17 2023-09-12 杰华特微电子股份有限公司 一种焊接夹具及焊接装置
CN117139941A (zh) * 2023-10-30 2023-12-01 北京中科同志科技股份有限公司 真空系统及其工作方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54114455A (en) * 1978-02-24 1979-09-06 Kanto Yakin Kogyo Furnace for soldering aluminium material under protecting gas without using flux and use
JP3809806B2 (ja) * 2002-03-29 2006-08-16 富士電機デバイステクノロジー株式会社 半導体装置の製造方法

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