JP2006526757A5 - - Google Patents

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Publication number
JP2006526757A5
JP2006526757A5 JP2006514959A JP2006514959A JP2006526757A5 JP 2006526757 A5 JP2006526757 A5 JP 2006526757A5 JP 2006514959 A JP2006514959 A JP 2006514959A JP 2006514959 A JP2006514959 A JP 2006514959A JP 2006526757 A5 JP2006526757 A5 JP 2006526757A5
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JP
Japan
Prior art keywords
heat pipe
temperature
heat
pressure
flow path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006514959A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006526757A (ja
Filing date
Publication date
Priority claimed from US10/455,004 external-priority patent/US20040244963A1/en
Application filed filed Critical
Publication of JP2006526757A publication Critical patent/JP2006526757A/ja
Publication of JP2006526757A5 publication Critical patent/JP2006526757A5/ja
Pending legal-status Critical Current

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JP2006514959A 2003-06-05 2004-05-26 温度制御付きヒートパイプ Pending JP2006526757A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/455,004 US20040244963A1 (en) 2003-06-05 2003-06-05 Heat pipe with temperature control
PCT/US2004/016495 WO2004109757A2 (fr) 2003-06-05 2004-05-26 Tuyau chauffant a commande de temperature

Publications (2)

Publication Number Publication Date
JP2006526757A JP2006526757A (ja) 2006-11-24
JP2006526757A5 true JP2006526757A5 (fr) 2007-08-02

Family

ID=33489837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006514959A Pending JP2006526757A (ja) 2003-06-05 2004-05-26 温度制御付きヒートパイプ

Country Status (7)

Country Link
US (1) US20040244963A1 (fr)
EP (1) EP1629246A2 (fr)
JP (1) JP2006526757A (fr)
KR (1) KR20060018879A (fr)
CN (1) CN1798953A (fr)
TW (1) TW200504893A (fr)
WO (1) WO2004109757A2 (fr)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7174806B2 (en) * 2001-09-13 2007-02-13 Beacon Power Corporation Flexible bearing damping system, energy storage system using such a system, and a method related thereto
US6675887B2 (en) * 2002-03-26 2004-01-13 Thermal Corp. Multiple temperature sensitive devices using two heat pipes
US7288864B2 (en) * 2004-03-31 2007-10-30 Nikon Corporation System and method for cooling motors of a lithographic tool
CN1892206A (zh) * 2005-07-08 2007-01-10 鸿富锦精密工业（深圳）有限公司 热管量测装置
US20070235161A1 (en) * 2006-03-27 2007-10-11 Eric Barger Refrigerant based heat exchange system with compensating heat pipe technology
KR101239962B1 (ko) 2006-05-04 2013-03-06 삼성전자주식회사 하부 전극 상에 형성된 버퍼층을 포함하는 가변 저항메모리 소자
US20080073563A1 (en) * 2006-07-01 2008-03-27 Nikon Corporation Exposure apparatus that includes a phase change circulation system for movers
KR101206036B1 (ko) 2006-11-16 2012-11-28 삼성전자주식회사 전이 금속 고용체를 포함하는 저항성 메모리 소자 및 그제조 방법
JP2008147026A (ja) * 2006-12-11 2008-06-26 Hitachi Ltd 固体酸化物形燃料電池
US8173989B2 (en) 2007-05-30 2012-05-08 Samsung Electronics Co., Ltd. Resistive random access memory device and methods of manufacturing and operating the same
TWM348267U (en) * 2008-07-25 2009-01-01 Micro Star Int Co Ltd Heat conducting pipe and heat dissipation system using the same
JP5355043B2 (ja) * 2008-11-10 2013-11-27 キヤノン株式会社 露光装置およびデバイス製造方法
WO2010084717A1 (fr) * 2009-01-23 2010-07-29 日本電気株式会社 Dispositif de refroidissement
US20100218496A1 (en) * 2009-03-02 2010-09-02 Miles Mark W Passive heat engine systems and components
NL2006809A (en) 2010-06-23 2011-12-27 Asml Netherlands Bv Lithographic apparatus and lithographic apparatus cooling method.
US8877080B2 (en) 2010-10-18 2014-11-04 Tokyo Electron Limited Using vacuum ultra-violet (VUV) data in microwave sources
EP2515170B1 (fr) * 2011-04-20 2020-02-19 ASML Netherlands BV Système de conditionnement thermique pour le conditionnement thermique d'une pièce d'un appareil lithographique et procédé de conditionnement thermique
US8723205B2 (en) 2011-08-30 2014-05-13 Abl Ip Holding Llc Phosphor incorporated in a thermal conductivity and phase transition heat transfer mechanism
US8710526B2 (en) 2011-08-30 2014-04-29 Abl Ip Holding Llc Thermal conductivity and phase transition heat transfer mechanism including optical element to be cooled by heat transfer of the mechanism
US8759843B2 (en) 2011-08-30 2014-06-24 Abl Ip Holding Llc Optical/electrical transducer using semiconductor nanowire wicking structure in a thermal conductivity and phase transition heat transfer mechanism
DE102011084324A1 (de) * 2011-10-12 2013-04-18 Siemens Aktiengesellschaft Kühleinrichtung für einen Supraleiter einer supraleitenden dynamoelektrischen Synchronmaschine
WO2013113633A1 (fr) 2012-01-30 2013-08-08 Asml Netherlands B.V. Appareil lithographique équipé d'un système de métrologie pour mesurer une position d'une table de support de substrat
US9618859B2 (en) 2012-01-30 2017-04-11 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101427924B1 (ko) * 2012-11-21 2014-08-11 현대자동차 주식회사 연료 전지 시스템의 압축 공기 냉각 장치
US20150068703A1 (en) * 2013-09-06 2015-03-12 Ge Aviation Systems Llc Thermal management system and method of assembling the same
CA2923127A1 (fr) * 2013-09-12 2015-03-19 Renew Group Private Limited Systeme et procede d'utilisation de produits enrichis en graphene pour distribuer une energie thermique
TWI506261B (zh) * 2014-01-27 2015-11-01 Vacuum desorption device after sample gas concentration
CN105004232B (zh) * 2015-08-20 2017-06-06 安徽华茂纺织股份有限公司 一种千分尺读数放大装置
JP2017156465A (ja) * 2016-02-29 2017-09-07 キヤノン株式会社 駆動装置、リソグラフィ装置、冷却方法、および物品の製造方法
CN107300334B (zh) * 2017-07-31 2018-10-02 大连碧蓝节能环保科技有限公司 调节蒸发压力式热管
CN111566926A (zh) * 2017-11-06 2020-08-21 碧绿威自动化股份有限公司 具有散热能力及降热考虑的线性马达
US10936031B2 (en) * 2018-04-13 2021-03-02 Dell Products L.P. Information handling system dynamic thermal transfer control
US10969841B2 (en) * 2018-04-13 2021-04-06 Dell Products L.P. Information handling system housing integrated vapor chamber
CN110379729B (zh) * 2018-04-13 2022-10-21 北京北方华创微电子装备有限公司 加热基座及半导体加工设备
KR102098867B1 (ko) * 2018-09-12 2020-04-09 (주)아이테드 임프린팅 장치 및 임프린팅 방법
JP7182574B2 (ja) * 2020-02-28 2022-12-02 株式会社日立製作所 エレベーター制御装置およびエレベーター制御方法
CN112161501B (zh) * 2020-09-28 2022-02-25 北京空间飞行器总体设计部 可控热管

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3517730A (en) * 1967-03-15 1970-06-30 Us Navy Controllable heat pipe
US3637007A (en) * 1967-08-14 1972-01-25 Trw Inc Method of and means for regulating thermal energy transfer through a heat pipe
US3605878A (en) * 1969-10-08 1971-09-20 Sanders Associates Inc Heat pipe with variable evaporator
US3741289A (en) * 1970-07-06 1973-06-26 R Moore Heat transfer apparatus with immiscible fluids
JPS59180283A (ja) * 1983-03-29 1984-10-13 Toshiba Corp 可変コンダクタンスヒ−トパイプ
US4573525A (en) * 1985-03-28 1986-03-04 Boyd Hermon A Thermally actuated heat exchange method and system
US4898231A (en) * 1985-09-30 1990-02-06 Kabushiki Kaisha Toshiba Heat-pipe system and method of and apparatus for controlling a flow rate of a working fluid in a liquid pipe of the heat pipe system
JPH0631702B2 (ja) * 1985-09-30 1994-04-27 株式会社東芝 二相流体ル−プ
JPS62107271U (fr) * 1985-12-16 1987-07-09
US4787843A (en) * 1987-06-22 1988-11-29 Thermo Electron Corporation Pressure balanced heat pipe
JP2657809B2 (ja) * 1987-12-22 1997-09-30 謙治 岡安 熱伝達装置
JPH0285268U (fr) * 1988-12-07 1990-07-04
JP2622603B2 (ja) * 1989-01-13 1997-06-18 株式会社フジクラ ヒートパイプ式熱交換器
JP2801998B2 (ja) * 1992-10-12 1998-09-21 富士通株式会社 電子機器の冷却装置
JP3475973B2 (ja) * 1994-12-14 2003-12-10 株式会社ニコン リニアモータ、ステージ装置、及び露光装置
US5911272A (en) * 1996-09-11 1999-06-15 Hughes Electronics Corporation Mechanically pumped heat pipe
JP3246891B2 (ja) * 1998-02-03 2002-01-15 東京エレクトロン株式会社 熱処理装置
JP4131038B2 (ja) * 1998-06-26 2008-08-13 株式会社エクォス・リサーチ 燃料電池システム
US6047766A (en) * 1998-08-03 2000-04-11 Hewlett-Packard Company Multi-mode heat transfer using a thermal heat pipe valve
KR100597287B1 (ko) * 1999-07-28 2006-07-04 동경 엘렉트론 주식회사 기판처리장치 및 그 방법
KR100629746B1 (ko) * 1999-07-28 2006-09-28 동경 엘렉트론 주식회사 현상장치 및 그 방법
US6312171B1 (en) * 1999-08-12 2001-11-06 Tokyo Electron Limited Developing apparatus and method thereof
SG89379A1 (en) * 2000-02-22 2002-06-18 Tokyo Electron Ltd Treatment apparatus
US6684941B1 (en) * 2002-06-04 2004-02-03 Yiding Cao Reciprocating-mechanism driven heat loop

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