JP2006524625A - カーボンナノチューブ成長方法 - Google Patents
カーボンナノチューブ成長方法 Download PDFInfo
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- JP2006524625A JP2006524625A JP2006505876A JP2006505876A JP2006524625A JP 2006524625 A JP2006524625 A JP 2006524625A JP 2006505876 A JP2006505876 A JP 2006505876A JP 2006505876 A JP2006505876 A JP 2006505876A JP 2006524625 A JP2006524625 A JP 2006524625A
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- substrate
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 34
- 239000002041 carbon nanotube Substances 0.000 title claims abstract description 32
- 229910021393 carbon nanotube Inorganic materials 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 title claims abstract description 21
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 49
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 46
- 239000010936 titanium Substances 0.000 claims abstract description 46
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 46
- 239000010941 cobalt Substances 0.000 claims abstract description 43
- 229910017052 cobalt Inorganic materials 0.000 claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 238000004050 hot filament vapor deposition Methods 0.000 claims abstract description 5
- 238000010030 laminating Methods 0.000 claims abstract description 3
- 239000002071 nanotube Substances 0.000 claims description 31
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 239000002109 single walled nanotube Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 65
- 239000002356 single layer Substances 0.000 description 4
- NNSIWZRTNZEWMS-UHFFFAOYSA-N cobalt titanium Chemical compound [Ti].[Co] NNSIWZRTNZEWMS-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 239000002048 multi walled nanotube Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
- H01L21/28562—Selective deposition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B32/00—Carbon; Compounds thereof
- C01B32/15—Nano-sized carbon materials
- C01B32/158—Carbon nanotubes
- C01B32/16—Preparation
- C01B32/162—Preparation characterised by catalysts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
- H10K85/221—Carbon nanotubes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/615—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
- Y10T428/2495—Thickness [relative or absolute]
- Y10T428/24967—Absolute thicknesses specified
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Composite Materials (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Carbon And Carbon Compounds (AREA)
Abstract
Description
Claims (9)
- カーボンナノチューブ成長方法において、チタン層の厚さが0.5乃至5nmであり、かつコバルト層の厚さが0.25乃至10nmであって、該コバルト層の厚さを該チタン層の厚さの半分から2倍と成すように予め基板上にチタン(12)とコバルト(13)との二重層を積層させる手順を含む、熱フィラメント化学的気相成長法による基板(1)上へのカーボンナノチューブ(5)成長方法。
- チタン層はコバルト層の上に形成されてなることを特徴とする請求項1に記載の方法。
- 基板は酸化物で覆われたシリコンで製造されていることを特徴とする請求項1に記載の方法。
- 基板は少なくとも1つの突起(21)を有し、それによって、個々の突起の先端からは一本のナノチューブ(25)が基板を離れるように成長し、かつ他のナノチューブは基板上に広がって成長することを特徴とする請求項1に記載の方法。
- ナノチューブに求められる直径と構造とに従ってチタンとコバルトの厚さの和を選択する手順を含むことを特徴とする請求項1に記載の方法。
- 二重層はコバルト層がチタン層の上に設けられる型のものであり、かつ二重層は厚いチタン層の上に形成されてなることを特徴とする請求項1に記載の方法。
- 二重層はチタン層がコバルト層の上に設けられる型のものであり、かつ二重層は20nmより厚いチタン層で覆われ、それによって、ナノチューブが二重層の側部表面のみから成長することを特徴とする請求項1に記載の方法。
- カーボンナノチューブを支持する基板において、チタン層の厚さが0.5乃至5nmであり、かつコバルト層の厚さが0.25乃至10nmであって、該コバルト層の厚さが該チタン層の厚さの半分から2倍であるチタン(12)とコバルト(13)との二重層で覆われてなる、カーボンナノチューブ(5)を支持する基板。
- 微小の突起(21)を備え、それにより、単層カーボンナノチューブまたは単一のナノチューブバンドルがそれぞれの微小の突起の先端から成長し、かつ他のナノチューブは基板上に広がって成長することを特徴とする請求項8の基板。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0304830A FR2853912B1 (fr) | 2003-04-17 | 2003-04-17 | Procede de croissance de nanotubes de carbone |
PCT/FR2004/050160 WO2004094690A1 (fr) | 2003-04-17 | 2004-04-14 | Procede de croissance de nanotubes de carbone |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006524625A true JP2006524625A (ja) | 2006-11-02 |
JP4673838B2 JP4673838B2 (ja) | 2011-04-20 |
Family
ID=33041948
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006505876A Expired - Fee Related JP4673838B2 (ja) | 2003-04-17 | 2004-04-14 | カーボンナノチューブの製造方法及びカーボンナノチューブを支持する基板 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8481163B2 (ja) |
EP (1) | EP1618226B1 (ja) |
JP (1) | JP4673838B2 (ja) |
AT (1) | ATE350509T1 (ja) |
DE (1) | DE602004004097T2 (ja) |
FR (1) | FR2853912B1 (ja) |
WO (1) | WO2004094690A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010517914A (ja) * | 2007-02-09 | 2010-05-27 | サントル ナシオナル ドゥ ラ ルシェルシェサイアンティフィク(セエヌエールエス) | ナノメートルの先端におけるカーボンナノチューブを成長させるための方法 |
US8125131B2 (en) | 2008-06-27 | 2012-02-28 | Samsung Electronics Co., Ltd. | Nano filament structure and methods of forming the same |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7473930B1 (en) * | 2005-07-01 | 2009-01-06 | The United States Of America As Represented By The United States National Aeronautics And Space Administration | Use of patterned CNT arrays for display purposes |
JP5057010B2 (ja) * | 2005-11-01 | 2012-10-24 | ニッタ株式会社 | カーボンファイバの製造方法 |
US7859036B2 (en) | 2007-04-05 | 2010-12-28 | Micron Technology, Inc. | Memory devices having electrodes comprising nanowires, systems including same and methods of forming same |
US20100108988A1 (en) * | 2007-08-29 | 2010-05-06 | New Jersey Institute Of Technology | Nanotube-Based Structure and Method of Forming the Structure |
CN111188022B (zh) * | 2020-02-25 | 2021-08-06 | 上海旦元新材料科技有限公司 | 用气相沉积碳纳米管管包覆硅负极材料的制备方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1111917A (ja) * | 1997-06-18 | 1999-01-19 | Canon Inc | カーボンナノチューブの製法 |
JPH11194134A (ja) * | 1997-10-30 | 1999-07-21 | Canon Inc | カーボンナノチューブデバイス、その製造方法及び電子放出素子 |
JP2001032071A (ja) * | 1999-06-18 | 2001-02-06 | Cheol Jin Lee | 熱化学気相蒸着装置及びこれを用いたカーボンナノチューブの低温合成方法 |
JP2001303250A (ja) * | 2000-03-15 | 2001-10-31 | Samsung Sdi Co Ltd | 低圧−dc−熱化学蒸着法を利用したカーボンナノチューブ垂直配向蒸着方法 |
JP2003160321A (ja) * | 2001-09-10 | 2003-06-03 | Canon Inc | ファイバーの製造方法、ファイバーを用いた、電子放出素子、電子源及び画像表示装置の製造方法 |
JP2004182537A (ja) * | 2002-12-04 | 2004-07-02 | Mie Tlo Co Ltd | ナノカーボン材料配列構造の形成方法 |
JP2004284921A (ja) * | 2003-03-25 | 2004-10-14 | Kenjiro Oura | カーボンナノチューブの製造方法、カーボンナノチューブデバイスおよび電気二重層キャパシタ |
JP2004292216A (ja) * | 2003-03-26 | 2004-10-21 | Canon Inc | 炭素繊維の製造方法およびそれを用いた電子放出素子、画像形成装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6361861B2 (en) * | 1999-06-14 | 2002-03-26 | Battelle Memorial Institute | Carbon nanotubes on a substrate |
-
2003
- 2003-04-17 FR FR0304830A patent/FR2853912B1/fr not_active Expired - Fee Related
-
2004
- 2004-04-14 DE DE602004004097T patent/DE602004004097T2/de not_active Expired - Lifetime
- 2004-04-14 JP JP2006505876A patent/JP4673838B2/ja not_active Expired - Fee Related
- 2004-04-14 EP EP04742846A patent/EP1618226B1/fr not_active Expired - Lifetime
- 2004-04-14 WO PCT/FR2004/050160 patent/WO2004094690A1/fr active IP Right Grant
- 2004-04-14 US US10/552,546 patent/US8481163B2/en not_active Expired - Fee Related
- 2004-04-14 AT AT04742846T patent/ATE350509T1/de not_active IP Right Cessation
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1111917A (ja) * | 1997-06-18 | 1999-01-19 | Canon Inc | カーボンナノチューブの製法 |
JPH11194134A (ja) * | 1997-10-30 | 1999-07-21 | Canon Inc | カーボンナノチューブデバイス、その製造方法及び電子放出素子 |
JP2001032071A (ja) * | 1999-06-18 | 2001-02-06 | Cheol Jin Lee | 熱化学気相蒸着装置及びこれを用いたカーボンナノチューブの低温合成方法 |
JP2001303250A (ja) * | 2000-03-15 | 2001-10-31 | Samsung Sdi Co Ltd | 低圧−dc−熱化学蒸着法を利用したカーボンナノチューブ垂直配向蒸着方法 |
JP2003160321A (ja) * | 2001-09-10 | 2003-06-03 | Canon Inc | ファイバーの製造方法、ファイバーを用いた、電子放出素子、電子源及び画像表示装置の製造方法 |
JP2004182537A (ja) * | 2002-12-04 | 2004-07-02 | Mie Tlo Co Ltd | ナノカーボン材料配列構造の形成方法 |
JP2004284921A (ja) * | 2003-03-25 | 2004-10-14 | Kenjiro Oura | カーボンナノチューブの製造方法、カーボンナノチューブデバイスおよび電気二重層キャパシタ |
JP2004292216A (ja) * | 2003-03-26 | 2004-10-21 | Canon Inc | 炭素繊維の製造方法およびそれを用いた電子放出素子、画像形成装置 |
Non-Patent Citations (1)
Title |
---|
JPN6010022644, L.Marty et al., "Batch processing of nanometer−scale electrical circuitry based on in−situ grown single−walled carbon", Microelectronic Engineering, 200207, Vol.61−62, pp.485−489, Elsevier Science B.V. * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010517914A (ja) * | 2007-02-09 | 2010-05-27 | サントル ナシオナル ドゥ ラ ルシェルシェサイアンティフィク(セエヌエールエス) | ナノメートルの先端におけるカーボンナノチューブを成長させるための方法 |
US8125131B2 (en) | 2008-06-27 | 2012-02-28 | Samsung Electronics Co., Ltd. | Nano filament structure and methods of forming the same |
Also Published As
Publication number | Publication date |
---|---|
JP4673838B2 (ja) | 2011-04-20 |
EP1618226B1 (fr) | 2007-01-03 |
WO2004094690A1 (fr) | 2004-11-04 |
US20070110971A1 (en) | 2007-05-17 |
US8481163B2 (en) | 2013-07-09 |
ATE350509T1 (de) | 2007-01-15 |
EP1618226A1 (fr) | 2006-01-25 |
DE602004004097D1 (de) | 2007-02-15 |
FR2853912B1 (fr) | 2005-07-15 |
DE602004004097T2 (de) | 2007-07-12 |
FR2853912A1 (fr) | 2004-10-22 |
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