JP2006523920A - 半導体素子を形成する方法 - Google Patents

半導体素子を形成する方法 Download PDF

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Publication number
JP2006523920A
JP2006523920A JP2006506013A JP2006506013A JP2006523920A JP 2006523920 A JP2006523920 A JP 2006523920A JP 2006506013 A JP2006506013 A JP 2006506013A JP 2006506013 A JP2006506013 A JP 2006506013A JP 2006523920 A JP2006523920 A JP 2006523920A
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JP
Japan
Prior art keywords
thin plate
substrate
forming
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006506013A
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English (en)
Japanese (ja)
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JP2006523920A5 (enExample
Inventor
バックリー、アラステア、ロバート
ボダマー、ジョージ、カール、ヘルマン
ホワイトレッグ、スティーブン、アンドリュー
Original Assignee
マイクロエミッシブ ディスプレイズ リミテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by マイクロエミッシブ ディスプレイズ リミテッド filed Critical マイクロエミッシブ ディスプレイズ リミテッド
Publication of JP2006523920A publication Critical patent/JP2006523920A/ja
Publication of JP2006523920A5 publication Critical patent/JP2006523920A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
JP2006506013A 2003-03-24 2004-03-23 半導体素子を形成する方法 Pending JP2006523920A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0306721.2A GB0306721D0 (en) 2003-03-24 2003-03-24 Method of forming a semiconductor device
PCT/GB2004/001270 WO2004086529A1 (en) 2003-03-24 2004-03-23 Method of forming a semiconductor device

Publications (2)

Publication Number Publication Date
JP2006523920A true JP2006523920A (ja) 2006-10-19
JP2006523920A5 JP2006523920A5 (enExample) 2007-05-24

Family

ID=9955406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006506013A Pending JP2006523920A (ja) 2003-03-24 2004-03-23 半導体素子を形成する方法

Country Status (5)

Country Link
US (1) US20070026553A1 (enExample)
EP (1) EP1606847A1 (enExample)
JP (1) JP2006523920A (enExample)
GB (1) GB0306721D0 (enExample)
WO (1) WO2004086529A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007258005A (ja) * 2006-03-23 2007-10-04 Pioneer Electronic Corp 光デバイス用の封止部材の製造方法、光デバイスの製造方法、光デバイス、および光デバイス用の封止部材
JP2009082468A (ja) * 2007-09-28 2009-04-23 Toshiba Corp 画像表示装置及びｘ線診断治療装置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100685811B1 (ko) 2005-01-04 2007-02-22 삼성에스디아이 주식회사 유기전계 발광표시장치 및 그의 제조방법
GB0605014D0 (en) * 2006-03-13 2006-04-19 Microemissive Displays Ltd Electroluminescent device
GB0622998D0 (en) * 2006-11-17 2006-12-27 Microemissive Displays Ltd Colour optoelectronic device
GB201111138D0 (en) 2011-06-30 2011-08-17 Leman Micro Devices Uk Ltd Personal health data collection
US9608029B2 (en) * 2013-06-28 2017-03-28 Stmicroelectronics Pte Ltd. Optical package with recess in transparent cover

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001046664A2 (de) * 1999-12-22 2001-06-28 Infineon Technologies Ag Verfahren zur herstellung mikromechanischer strukturen
JP2002352951A (ja) * 2001-05-24 2002-12-06 Tohoku Pioneer Corp 有機ｅｌ表示パネル及びその製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3613838B2 (ja) * 1995-05-18 2005-01-26 株式会社デンソー 半導体装置の製造方法
JP3846094B2 (ja) * 1998-03-17 2006-11-15 株式会社デンソー 半導体装置の製造方法
GB9907931D0 (en) * 1999-04-07 1999-06-02 Univ Edinburgh An optoelectronic display
JP4420538B2 (ja) * 1999-07-23 2010-02-24 アバゴ・テクノロジーズ・ワイヤレス・アイピー（シンガポール）プライベート・リミテッド ウェーハパッケージの製造方法
JP3620706B2 (ja) * 2000-04-13 2005-02-16 日本精機株式会社 有機ｅｌパネルの製造方法
US20010052752A1 (en) * 2000-04-25 2001-12-20 Ghosh Amalkumar P. Thin film encapsulation of organic light emitting diode devices
GB0013394D0 (en) * 2000-06-01 2000-07-26 Microemissive Displays Ltd A method of creating a color optoelectronic device
TW538246B (en) * 2000-06-05 2003-06-21 Semiconductor Energy Lab Display panel, display panel inspection method, and display panel manufacturing method
GB0024804D0 (en) * 2000-10-10 2000-11-22 Microemissive Displays Ltd An optoelectronic device
GB0104961D0 (en) * 2001-02-28 2001-04-18 Microemissive Displays Ltd An encapsulated electrode
GB0107236D0 (en) * 2001-03-22 2001-05-16 Microemissive Displays Ltd Method of creating an electroluminescent device
GB0222649D0 (en) * 2002-09-30 2002-11-06 Microemissive Displays Ltd Passivation layer
GB0224121D0 (en) * 2002-10-16 2002-11-27 Microemissive Displays Ltd Method of patterning a functional material on to a substrate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001046664A2 (de) * 1999-12-22 2001-06-28 Infineon Technologies Ag Verfahren zur herstellung mikromechanischer strukturen
JP2003517946A (ja) * 1999-12-22 2003-06-03 インフィネオン テクノロジーズ アクチエンゲゼルシャフト 微細機械構造の製造方法
JP2002352951A (ja) * 2001-05-24 2002-12-06 Tohoku Pioneer Corp 有機ｅｌ表示パネル及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007258005A (ja) * 2006-03-23 2007-10-04 Pioneer Electronic Corp 光デバイス用の封止部材の製造方法、光デバイスの製造方法、光デバイス、および光デバイス用の封止部材
JP2009082468A (ja) * 2007-09-28 2009-04-23 Toshiba Corp 画像表示装置及びｘ線診断治療装置

Also Published As

Publication number Publication date
WO2004086529A1 (en) 2004-10-07
EP1606847A1 (en) 2005-12-21
US20070026553A1 (en) 2007-02-01
GB0306721D0 (en) 2003-04-30

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