GB0306721D0 - Method of forming a semiconductor device - Google Patents

Method of forming a semiconductor device

Info

Publication number
GB0306721D0
GB0306721D0 GBGB0306721.2A GB0306721A GB0306721D0 GB 0306721 D0 GB0306721 D0 GB 0306721D0 GB 0306721 A GB0306721 A GB 0306721A GB 0306721 D0 GB0306721 D0 GB 0306721D0
Authority
GB
United Kingdom
Prior art keywords
forming
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB0306721.2A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Microemissive Displays Ltd
Original Assignee
Microemissive Displays Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Microemissive Displays Ltd filed Critical Microemissive Displays Ltd
Priority to GBGB0306721.2A priority Critical patent/GB0306721D0/en
Publication of GB0306721D0 publication Critical patent/GB0306721D0/en
Priority to EP04722587A priority patent/EP1606847A1/en
Priority to JP2006506013A priority patent/JP2006523920A/ja
Priority to US10/550,244 priority patent/US20070026553A1/en
Priority to PCT/GB2004/001270 priority patent/WO2004086529A1/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
GBGB0306721.2A 2003-03-24 2003-03-24 Method of forming a semiconductor device Ceased GB0306721D0 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
GBGB0306721.2A GB0306721D0 (en) 2003-03-24 2003-03-24 Method of forming a semiconductor device
EP04722587A EP1606847A1 (en) 2003-03-24 2004-03-23 Method of forming a semiconductor device
JP2006506013A JP2006523920A (ja) 2003-03-24 2004-03-23 半導体素子を形成する方法
US10/550,244 US20070026553A1 (en) 2003-03-24 2004-03-23 Method of forming a semiconductor device
PCT/GB2004/001270 WO2004086529A1 (en) 2003-03-24 2004-03-23 Method of forming a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB0306721.2A GB0306721D0 (en) 2003-03-24 2003-03-24 Method of forming a semiconductor device

Publications (1)

Publication Number Publication Date
GB0306721D0 true GB0306721D0 (en) 2003-04-30

Family

ID=9955406

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB0306721.2A Ceased GB0306721D0 (en) 2003-03-24 2003-03-24 Method of forming a semiconductor device

Country Status (5)

Country Link
US (1) US20070026553A1 (enExample)
EP (1) EP1606847A1 (enExample)
JP (1) JP2006523920A (enExample)
GB (1) GB0306721D0 (enExample)
WO (1) WO2004086529A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100685811B1 (ko) 2005-01-04 2007-02-22 삼성에스디아이 주식회사 유기전계 발광표시장치 및 그의 제조방법
GB0605014D0 (en) * 2006-03-13 2006-04-19 Microemissive Displays Ltd Electroluminescent device
JP4755002B2 (ja) * 2006-03-23 2011-08-24 パイオニア株式会社 光デバイス用の封止部材の製造方法、光デバイスの製造方法、光デバイス、および光デバイス用の封止部材
GB0622998D0 (en) * 2006-11-17 2006-12-27 Microemissive Displays Ltd Colour optoelectronic device
JP5269376B2 (ja) * 2007-09-28 2013-08-21 株式会社東芝 画像表示装置及びｘ線診断治療装置
GB201111138D0 (en) 2011-06-30 2011-08-17 Leman Micro Devices Uk Ltd Personal health data collection
US9608029B2 (en) * 2013-06-28 2017-03-28 Stmicroelectronics Pte Ltd. Optical package with recess in transparent cover

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3613838B2 (ja) * 1995-05-18 2005-01-26 株式会社デンソー 半導体装置の製造方法
JP3846094B2 (ja) * 1998-03-17 2006-11-15 株式会社デンソー 半導体装置の製造方法
GB9907931D0 (en) * 1999-04-07 1999-06-02 Univ Edinburgh An optoelectronic display
JP4420538B2 (ja) * 1999-07-23 2010-02-24 アバゴ・テクノロジーズ・ワイヤレス・アイピー（シンガポール）プライベート・リミテッド ウェーハパッケージの製造方法
DE19962231A1 (de) * 1999-12-22 2001-07-12 Infineon Technologies Ag Verfahren zur Herstellung mikromechanischer Strukturen
JP3620706B2 (ja) * 2000-04-13 2005-02-16 日本精機株式会社 有機ｅｌパネルの製造方法
US20010052752A1 (en) * 2000-04-25 2001-12-20 Ghosh Amalkumar P. Thin film encapsulation of organic light emitting diode devices
GB0013394D0 (en) * 2000-06-01 2000-07-26 Microemissive Displays Ltd A method of creating a color optoelectronic device
TW538246B (en) * 2000-06-05 2003-06-21 Semiconductor Energy Lab Display panel, display panel inspection method, and display panel manufacturing method
GB0024804D0 (en) * 2000-10-10 2000-11-22 Microemissive Displays Ltd An optoelectronic device
GB0104961D0 (en) * 2001-02-28 2001-04-18 Microemissive Displays Ltd An encapsulated electrode
GB0107236D0 (en) * 2001-03-22 2001-05-16 Microemissive Displays Ltd Method of creating an electroluminescent device
JP2002352951A (ja) * 2001-05-24 2002-12-06 Tohoku Pioneer Corp 有機ｅｌ表示パネル及びその製造方法
GB0222649D0 (en) * 2002-09-30 2002-11-06 Microemissive Displays Ltd Passivation layer
GB0224121D0 (en) * 2002-10-16 2002-11-27 Microemissive Displays Ltd Method of patterning a functional material on to a substrate

Also Published As

Publication number Publication date
JP2006523920A (ja) 2006-10-19
WO2004086529A1 (en) 2004-10-07
EP1606847A1 (en) 2005-12-21
US20070026553A1 (en) 2007-02-01

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)