JP2006521704A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2006521704A5 JP2006521704A5 JP2006507513A JP2006507513A JP2006521704A5 JP 2006521704 A5 JP2006521704 A5 JP 2006521704A5 JP 2006507513 A JP2006507513 A JP 2006507513A JP 2006507513 A JP2006507513 A JP 2006507513A JP 2006521704 A5 JP2006521704 A5 JP 2006521704A5
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- robot
- holder
- cassette
- positioning system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 235000012431 wafers Nutrition 0.000 description 102
- 239000012636 effector Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 3
- 230000005465 channeling Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010191 image analysis Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/395,940 US6748293B1 (en) | 2003-03-24 | 2003-03-24 | Methods and apparatus for high speed object handling |
| US10/395,940 | 2003-03-24 | ||
| PCT/US2004/008942 WO2004086465A2 (en) | 2003-03-24 | 2004-03-24 | Method and apparatus for high speed wafer handling |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006521704A JP2006521704A (ja) | 2006-09-21 |
| JP2006521704A5 true JP2006521704A5 (https=) | 2011-05-12 |
| JP4727572B2 JP4727572B2 (ja) | 2011-07-20 |
Family
ID=32326203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006507513A Expired - Fee Related JP4727572B2 (ja) | 2003-03-24 | 2004-03-24 | 高速で対象物を取り扱う方法および装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6748293B1 (https=) |
| JP (1) | JP4727572B2 (https=) |
| KR (1) | KR100969058B1 (https=) |
| CN (1) | CN100385614C (https=) |
| WO (1) | WO2004086465A2 (https=) |
Families Citing this family (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4696373B2 (ja) * | 2001-02-20 | 2011-06-08 | 東京エレクトロン株式会社 | 処理システム及び被処理体の搬送方法 |
| US6852194B2 (en) * | 2001-05-21 | 2005-02-08 | Tokyo Electron Limited | Processing apparatus, transferring apparatus and transferring method |
| JP4327599B2 (ja) * | 2001-11-29 | 2009-09-09 | ダイアモンド セミコンダクタ グループ エルエルシー | ウエーハ取り扱い装置及び方法 |
| JP3865703B2 (ja) * | 2002-10-25 | 2007-01-10 | ファナック株式会社 | 物品搬送システム及び搬送方法 |
| KR100577582B1 (ko) * | 2004-06-09 | 2006-05-08 | 삼성전자주식회사 | 반도체 포토 스피너 설비 및 이를 이용한 웨이퍼 티칭불량방지방법 |
| US8668422B2 (en) * | 2004-08-17 | 2014-03-11 | Mattson Technology, Inc. | Low cost high throughput processing platform |
| JP4907077B2 (ja) * | 2004-11-30 | 2012-03-28 | 株式会社Sen | ウエハ処理装置及びウエハ処理方法並びにイオン注入装置 |
| US7585141B2 (en) * | 2005-02-01 | 2009-09-08 | Varian Semiconductor Equipment Associates, Inc. | Load lock system for ion beam processing |
| US8118535B2 (en) * | 2005-05-18 | 2012-02-21 | International Business Machines Corporation | Pod swapping internal to tool run time |
| JP2007005582A (ja) * | 2005-06-24 | 2007-01-11 | Asm Japan Kk | 基板搬送装置及びそれを搭載した半導体基板製造装置 |
| JP4440178B2 (ja) * | 2005-07-25 | 2010-03-24 | 東京エレクトロン株式会社 | 基板の搬送装置 |
| US7690881B2 (en) * | 2006-08-30 | 2010-04-06 | Asm Japan K.K. | Substrate-processing apparatus with buffer mechanism and substrate-transferring apparatus |
| US7740437B2 (en) | 2006-09-22 | 2010-06-22 | Asm International N.V. | Processing system with increased cassette storage capacity |
| US20080075563A1 (en) * | 2006-09-27 | 2008-03-27 | Mclane James R | Substrate handling system and method |
| US7585142B2 (en) * | 2007-03-16 | 2009-09-08 | Asm America, Inc. | Substrate handling chamber with movable substrate carrier loading platform |
| US7953511B1 (en) * | 2007-09-21 | 2011-05-31 | National Semiconductor Corporation | System and method for reducing processing errors during wafer fabrication employing a 2D wafer scribe and monitoring system |
| WO2009086164A2 (en) * | 2007-12-27 | 2009-07-09 | Lam Research Corporation | Systems and methods for calibrating end effector alignment using at least a light source |
| SG195592A1 (en) | 2007-12-27 | 2013-12-30 | Lam Res Corp | Arrangements and methods for determining positions and offsets in plasma processing system |
| KR101590655B1 (ko) | 2007-12-27 | 2016-02-18 | 램 리써치 코포레이션 | 동적 정렬 빔 교정의 방법 및 시스템 |
| CN102027568B (zh) | 2007-12-27 | 2014-09-03 | 朗姆研究公司 | 用于校准等离子体处理系统中的末端执行器对准的系统和方法 |
| FR2931295B1 (fr) * | 2008-05-13 | 2010-08-20 | Altatech Semiconductor | Dispositif et procede d'inspection de plaquettes semi-conductrices |
| US9254566B2 (en) * | 2009-03-13 | 2016-02-09 | Kawasaki Jukogyo Kabushiki Kaisha | Robot having end effector and method of operating the same |
| US8970820B2 (en) | 2009-05-20 | 2015-03-03 | Nikon Corporation | Object exchange method, exposure method, carrier system, exposure apparatus, and device manufacturing method |
| US8285418B2 (en) * | 2009-07-23 | 2012-10-09 | Kla-Tencor Corporation | Dual scanning stage |
| JP5477133B2 (ja) * | 2010-04-09 | 2014-04-23 | 日新イオン機器株式会社 | ウェーハハンドリング方法およびイオン注入装置 |
| CN102310999B (zh) * | 2010-07-09 | 2013-07-17 | 上海凯世通半导体有限公司 | 真空传输制程设备及方法 |
| JP2012243335A (ja) * | 2011-05-17 | 2012-12-10 | Sony Corp | ディスク搬送装置及びディスクストレージシステム |
| JP5573861B2 (ja) * | 2012-02-16 | 2014-08-20 | 株式会社安川電機 | 搬送システム |
| SG2014014070A (en) * | 2012-06-06 | 2014-06-27 | Ev Group E Thallner Gmbh | Device and method for determination of alignment errors |
| JP2013110114A (ja) * | 2012-12-27 | 2013-06-06 | Hitachi High-Technologies Corp | 有機elデバイス製造装置及び角度補正機構 |
| US9149936B2 (en) | 2013-01-18 | 2015-10-06 | Persimmon Technologies, Corp. | Robot having arm with unequal link lengths |
| US10224232B2 (en) | 2013-01-18 | 2019-03-05 | Persimmon Technologies Corporation | Robot having two arms with unequal link lengths |
| KR102465277B1 (ko) * | 2013-01-18 | 2022-11-09 | 퍼시몬 테크놀로지스 코포레이션 | 로봇, 전자 장치 처리 시스템, 기판 이송 방법 |
| US9783372B2 (en) | 2015-01-28 | 2017-10-10 | Kla-Tencor Corporation | Flipping apparatus, system and method for processing articles |
| CN107207167B (zh) * | 2015-01-28 | 2020-04-03 | 科磊股份有限公司 | 用于处理物品的翻转设备、系统及方法 |
| US11691268B2 (en) | 2015-03-12 | 2023-07-04 | Persimmon Technologies Corporation | Robot having a variable transmission ratio |
| US9831110B2 (en) | 2015-07-30 | 2017-11-28 | Lam Research Corporation | Vision-based wafer notch position measurement |
| US10724967B2 (en) | 2018-04-20 | 2020-07-28 | Samsung Electronics Co., Ltd. | Inspection apparatus for semiconductor process and semiconductor process device |
| US11626305B2 (en) * | 2019-06-25 | 2023-04-11 | Applied Materials, Inc. | Sensor-based correction of robot-held object |
| US11335578B2 (en) * | 2020-02-13 | 2022-05-17 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate transfer apparatus and method of measuring positional deviation of substrate |
| US12046501B2 (en) * | 2022-10-06 | 2024-07-23 | Kawasaki Jukogyo Kabushiki Kaisha | Substrate handling apparatus and method of handling substrate |
| US12504391B2 (en) * | 2023-08-31 | 2025-12-23 | Taiwan Semiconductor Manufacturing Company Ltd. | System for monitoring wafer carrier and method of manufacturing semiconductor structure |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3901183A (en) | 1973-06-12 | 1975-08-26 | Extrion Corp | Wafer treatment apparatus |
| US4008683A (en) | 1973-07-16 | 1977-02-22 | Varian Associates | Machine for treating wafer-form items |
| US4282924A (en) | 1979-03-16 | 1981-08-11 | Varian Associates, Inc. | Apparatus for mechanically clamping semiconductor wafer against pliable thermally conductive surface |
| DE3219502C2 (de) | 1982-05-25 | 1990-04-19 | Ernst Leitz Wetzlar Gmbh, 6330 Wetzlar | Vorrichtung zum automatischen Transport scheibenförmiger Objekte |
| US4836733A (en) | 1986-04-28 | 1989-06-06 | Varian Associates, Inc. | Wafer transfer system |
| JPS6464231A (en) | 1987-09-03 | 1989-03-10 | Toshiba Corp | Conveyor |
| JPH0825151B2 (ja) | 1988-09-16 | 1996-03-13 | 東京応化工業株式会社 | ハンドリングユニット |
| WO1991004213A1 (en) | 1989-09-12 | 1991-04-04 | Rapro Technology, Inc. | Automated wafer transport system |
| US5186594A (en) | 1990-04-19 | 1993-02-16 | Applied Materials, Inc. | Dual cassette load lock |
| US5286296A (en) | 1991-01-10 | 1994-02-15 | Sony Corporation | Multi-chamber wafer process equipment having plural, physically communicating transfer means |
| JPH05275511A (ja) * | 1991-03-01 | 1993-10-22 | Tokyo Electron Ltd | 被処理体の移載システム及び処理装置 |
| JPH04295704A (ja) * | 1991-03-25 | 1992-10-20 | Kokusai Electric Co Ltd | ウェーハの中心位置検出装置 |
| JPH0785469B2 (ja) * | 1991-09-05 | 1995-09-13 | 日新ハイボルテージ株式会社 | イオン注入装置におけるウエファ搬送装置 |
| US5404894A (en) | 1992-05-20 | 1995-04-11 | Tokyo Electron Kabushiki Kaisha | Conveyor apparatus |
| JP3320539B2 (ja) * | 1993-12-17 | 2002-09-03 | 東京エレクトロン株式会社 | 被処理体の搬入、搬出装置 |
| JPH07263518A (ja) * | 1994-03-18 | 1995-10-13 | Fujitsu Ltd | 半導体ウェハの搬送装置及び搬送方法並びに半導体ウェハ処理装置 |
| US5486080A (en) | 1994-06-30 | 1996-01-23 | Diamond Semiconductor Group, Inc. | High speed movement of workpieces in vacuum processing |
| JPH09102530A (ja) | 1995-06-07 | 1997-04-15 | Varian Assoc Inc | ウェーハの向き検査システム |
| US6481956B1 (en) * | 1995-10-27 | 2002-11-19 | Brooks Automation Inc. | Method of transferring substrates with two different substrate holding end effectors |
| US5944940A (en) * | 1996-07-09 | 1999-08-31 | Gamma Precision Technology, Inc. | Wafer transfer system and method of using the same |
| JPH11135600A (ja) * | 1997-08-25 | 1999-05-21 | Shibaura Mechatronics Corp | ロボット装置および処理装置 |
| US6114705A (en) | 1997-09-10 | 2000-09-05 | Varian Semiconductor Equipment Associates, Inc. | System for correcting eccentricity and rotational error of a workpiece |
| US6491491B1 (en) * | 1997-10-30 | 2002-12-10 | Sankyo Seiki Mfg. Co., Ltd. | Articulated robot |
| WO1999028951A2 (en) * | 1997-11-28 | 1999-06-10 | Mattson Technology, Inc. | Systems and methods for low contamination, high throughput handling of workpieces for vacuum processing |
| JP3778677B2 (ja) * | 1997-12-01 | 2006-05-24 | 大日本スクリーン製造株式会社 | 基板処理装置 |
| JPH11260889A (ja) * | 1998-03-13 | 1999-09-24 | Ebara Corp | イオン注入装置 |
| US6323616B1 (en) * | 1999-03-15 | 2001-11-27 | Berkeley Process Control, Inc. | Self teaching robotic wafer handling system |
| AU6763000A (en) * | 1999-08-11 | 2001-03-05 | Multilevel Metals, Inc. | Load lock system for foups |
| TW494523B (en) * | 2000-04-05 | 2002-07-11 | Tokyo Electron Ltd | Processing device |
| JP2002026104A (ja) * | 2000-06-30 | 2002-01-25 | Dainippon Printing Co Ltd | 受け渡し装置、およびロボットによる受け渡し方法 |
| JP2002270672A (ja) * | 2001-03-09 | 2002-09-20 | Olympus Optical Co Ltd | アライメント方法及び基板検査装置 |
| JP2002313874A (ja) * | 2001-04-17 | 2002-10-25 | Dainippon Screen Mfg Co Ltd | 基板支持部材、ならびにそれを用いた基板保持機構、基板搬送装置、基板搬送方法、基板処理装置および基板処理方法 |
| JP4435443B2 (ja) * | 2001-04-17 | 2010-03-17 | 大日本スクリーン製造株式会社 | 基板搬送装置および基板搬送方法 |
-
2003
- 2003-03-24 US US10/395,940 patent/US6748293B1/en not_active Expired - Fee Related
-
2004
- 2004-03-24 JP JP2006507513A patent/JP4727572B2/ja not_active Expired - Fee Related
- 2004-03-24 WO PCT/US2004/008942 patent/WO2004086465A2/en not_active Ceased
- 2004-03-24 CN CNB2004800080710A patent/CN100385614C/zh not_active Expired - Fee Related
- 2004-03-24 KR KR1020057017796A patent/KR100969058B1/ko not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2006521704A5 (https=) | ||
| JP4727572B2 (ja) | 高速で対象物を取り扱う方法および装置 | |
| JP5758628B2 (ja) | 一体化されたウェハ受渡し機構 | |
| US8016541B2 (en) | Substrate handling system for aligning and orienting substrates during a transfer operation | |
| US10615068B2 (en) | Substrate handling system for aligning and orienting substrates during a transfer operation | |
| JP2005019963A (ja) | 基板処理装置及び基板受け渡し位置の調整方法 | |
| US20090016857A1 (en) | Substrate-replacing apparatus, substrate-processing apparatus, and substrate-inspecting apparatus | |
| US20210252694A1 (en) | Teaching method of transfer device and processing system | |
| WO2001040086A1 (en) | Wafer orienting and reading mechanism | |
| KR102799230B1 (ko) | 로봇 홀딩 오브젝트의 센서 기반 보정 | |
| EP2346073B1 (en) | Prealigner | |
| EP1918977A2 (en) | Workpiece rotation apparatus for a plasma reactor system | |
| US11572235B2 (en) | Aligner device and method for correcting positional misalignment of workpiece | |
| JP7660006B2 (ja) | 基板処理装置、教示情報生成方法および教示セット | |
| US6114705A (en) | System for correcting eccentricity and rotational error of a workpiece | |
| US20070004058A1 (en) | Semiconductor manufacturing device with transfer robot | |
| US20090092470A1 (en) | End effector with sensing capabilities | |
| JP4632590B2 (ja) | 基板搬送システム及び基板処理装置 | |
| US7891936B2 (en) | High speed substrate aligner apparatus | |
| JP2003218018A (ja) | 処理装置 | |
| JP2024048046A (ja) | 基板搬送システム及び画像補正方法 | |
| JP2003243479A (ja) | 搬送手段の停止位置調整機構 | |
| TW202537025A (zh) | 對準裝置及對準裝置之控制方法 | |
| JP3687389B2 (ja) | 基板処理装置 | |
| TW202427658A (zh) | 基板搬送系統及基板位置調整方法 |