JP2006520543A5 - - Google Patents
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- Publication number
- JP2006520543A5 JP2006520543A5 JP2006509212A JP2006509212A JP2006520543A5 JP 2006520543 A5 JP2006520543 A5 JP 2006520543A5 JP 2006509212 A JP2006509212 A JP 2006509212A JP 2006509212 A JP2006509212 A JP 2006509212A JP 2006520543 A5 JP2006520543 A5 JP 2006520543A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- forming
- solder
- inclined surface
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000010410 layer Substances 0.000 claims 18
- 229910000679 solder Inorganic materials 0.000 claims 11
- 238000000034 method Methods 0.000 claims 7
- 239000004065 semiconductor Substances 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- 239000011247 coating layer Substances 0.000 claims 5
- 238000000151 deposition Methods 0.000 claims 3
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 claims 1
- 239000003989 dielectric material Substances 0.000 claims 1
- 230000005496 eutectics Effects 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000009736 wetting Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/385,487 US6764937B1 (en) | 2003-03-12 | 2003-03-12 | Solder on a sloped surface |
| PCT/US2004/006912 WO2004082347A2 (en) | 2003-03-12 | 2004-03-04 | Solder on a sloped surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006520543A JP2006520543A (ja) | 2006-09-07 |
| JP2006520543A5 true JP2006520543A5 (enExample) | 2006-11-30 |
Family
ID=32681800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006509212A Withdrawn JP2006520543A (ja) | 2003-03-12 | 2004-03-04 | 傾斜した面上に設けるはんだ |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US6764937B1 (enExample) |
| EP (1) | EP1602265A2 (enExample) |
| JP (1) | JP2006520543A (enExample) |
| WO (1) | WO2004082347A2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7652678B2 (en) * | 2004-06-25 | 2010-01-26 | Apple Inc. | Partial display updates in a windowing system using a programmable graphics processing unit |
| CN114340212B (zh) * | 2021-12-24 | 2024-04-30 | 鹤山市中富兴业电路有限公司 | 电路板金手指斜坡结构的制造方法和电路板金手指 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4360142A (en) | 1979-06-29 | 1982-11-23 | International Business Machines Corporation | Method of forming a solder interconnection capable of sustained high power levels between a semiconductor device and a supporting substrate |
| US5539153A (en) | 1994-08-08 | 1996-07-23 | Hewlett-Packard Company | Method of bumping substrates by contained paste deposition |
| US5492235A (en) | 1995-12-18 | 1996-02-20 | Intel Corporation | Process for single mask C4 solder bump fabrication |
| US5736456A (en) * | 1996-03-07 | 1998-04-07 | Micron Technology, Inc. | Method of forming conductive bumps on die for flip chip applications |
| US6051887A (en) * | 1998-08-28 | 2000-04-18 | Medtronic, Inc. | Semiconductor stacked device for implantable medical apparatus |
| US6312830B1 (en) | 1999-09-02 | 2001-11-06 | Intel Corporation | Method and an apparatus for forming an under bump metallization structure |
-
2003
- 2003-03-12 US US10/385,487 patent/US6764937B1/en not_active Expired - Fee Related
- 2003-10-30 US US10/698,725 patent/US6979906B2/en not_active Expired - Fee Related
-
2004
- 2004-03-04 WO PCT/US2004/006912 patent/WO2004082347A2/en not_active Ceased
- 2004-03-04 JP JP2006509212A patent/JP2006520543A/ja not_active Withdrawn
- 2004-03-04 EP EP04717495A patent/EP1602265A2/en not_active Withdrawn
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