JP2011508449A5 - - Google Patents

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Publication number
JP2011508449A5
JP2011508449A5 JP2010540731A JP2010540731A JP2011508449A5 JP 2011508449 A5 JP2011508449 A5 JP 2011508449A5 JP 2010540731 A JP2010540731 A JP 2010540731A JP 2010540731 A JP2010540731 A JP 2010540731A JP 2011508449 A5 JP2011508449 A5 JP 2011508449A5
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JP
Japan
Prior art keywords
forming
tpg
hole
metallic material
thermal spacer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010540731A
Other languages
English (en)
Japanese (ja)
Other versions
JP5469089B2 (ja
JP2011508449A (ja
Filing date
Publication date
Priority claimed from US11/967,298 external-priority patent/US20090165302A1/en
Application filed filed Critical
Publication of JP2011508449A publication Critical patent/JP2011508449A/ja
Publication of JP2011508449A5 publication Critical patent/JP2011508449A5/ja
Application granted granted Critical
Publication of JP5469089B2 publication Critical patent/JP5469089B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2010540731A 2007-12-31 2008-12-08 ヒートシンクを形成する方法 Expired - Fee Related JP5469089B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/967,298 US20090165302A1 (en) 2007-12-31 2007-12-31 Method of forming a heatsink
US11/967,298 2007-12-31
PCT/US2008/085783 WO2009088603A1 (en) 2007-12-31 2008-12-08 Method of forming a heatsink

Publications (3)

Publication Number Publication Date
JP2011508449A JP2011508449A (ja) 2011-03-10
JP2011508449A5 true JP2011508449A5 (enExample) 2012-01-26
JP5469089B2 JP5469089B2 (ja) 2014-04-09

Family

ID=40419402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010540731A Expired - Fee Related JP5469089B2 (ja) 2007-12-31 2008-12-08 ヒートシンクを形成する方法

Country Status (6)

Country Link
US (1) US20090165302A1 (enExample)
EP (1) EP2238816A1 (enExample)
JP (1) JP5469089B2 (enExample)
KR (1) KR20100126284A (enExample)
CN (1) CN101953240B (enExample)
WO (1) WO2009088603A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8347502B2 (en) * 2007-12-28 2013-01-08 Ge Intelligent Platforms, Inc. Heat sink and method of forming a heatsink using a wedge-lock system
US8957316B2 (en) * 2010-09-10 2015-02-17 Honeywell International Inc. Electrical component assembly for thermal transfer
JP5704994B2 (ja) * 2011-03-31 2015-04-22 インターナショナル・ビジネス・マシーンズ・コーポレーションＩｎｔｅｒｎａｔｉｏｎａｌ Ｂｕｓｉｎｅｓｓ Ｍａｃｈｉｎｅｓ Ｃｏｒｐｏｒａｔｉｏｎ 半導体接合装置
US9064852B1 (en) * 2011-12-05 2015-06-23 The Peregrine Falcon Corporation Thermal pyrolytic graphite enhanced components
EP3410478A1 (en) * 2017-05-29 2018-12-05 Mitsubishi Electric R & D Centre Europe B.V. Power module and method for manufacturing the power module
JP7133020B2 (ja) * 2017-12-29 2022-09-07 エアバス ディフェンス アンド スペース，エス．エー． 高コンダクタンス熱リンク

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1114338C (zh) * 1995-01-25 2003-07-09 北方电讯网络有限公司 制作用于印刷电路板的散热片的方法和散热片
EP1025586B1 (en) * 1997-09-19 2006-06-14 The General Electric Company Flexible heat transfer device and method
JP4051402B2 (ja) * 1997-09-19 2008-02-27 モーメンティブ・パフォーマンス・マテリアルズ・インク 可撓性を有する伝熱装置およびその製造方法
US6131651A (en) * 1998-09-16 2000-10-17 Advanced Ceramics Corporation Flexible heat transfer device and method
JP2003060141A (ja) * 2001-08-20 2003-02-28 Otsuka Denki Kk 超伝熱部材およびそれを用いた冷却装置
US6758263B2 (en) * 2001-12-13 2004-07-06 Advanced Energy Technology Inc. Heat dissipating component using high conducting inserts
JP2003188323A (ja) * 2001-12-19 2003-07-04 Sony Corp グラファイトシート及びその製造方法
US6907917B2 (en) * 2003-01-10 2005-06-21 International Business Machines Corporation Graphite-based heat sinks and method and apparatus for the manufacture thereof
JP2005210035A (ja) * 2004-01-26 2005-08-04 Otsuka Denki Kk グラファイト複合材
US7889502B1 (en) * 2005-11-04 2011-02-15 Graftech International Holdings Inc. Heat spreading circuit assembly
US7303005B2 (en) * 2005-11-04 2007-12-04 Graftech International Holdings Inc. Heat spreaders with vias

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