JP2011508446A5 - - Google Patents

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Publication number
JP2011508446A5
JP2011508446A5 JP2010540692A JP2010540692A JP2011508446A5 JP 2011508446 A5 JP2011508446 A5 JP 2011508446A5 JP 2010540692 A JP2010540692 A JP 2010540692A JP 2010540692 A JP2010540692 A JP 2010540692A JP 2011508446 A5 JP2011508446 A5 JP 2011508446A5
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JP
Japan
Prior art keywords
tpg
metallic material
tpg element
hole
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010540692A
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English (en)
Japanese (ja)
Other versions
JP5384522B2 (ja
JP2011508446A (ja
Filing date
Publication date
Priority claimed from US11/966,201 external-priority patent/US8347502B2/en
Application filed filed Critical
Publication of JP2011508446A publication Critical patent/JP2011508446A/ja
Publication of JP2011508446A5 publication Critical patent/JP2011508446A5/ja
Application granted granted Critical
Publication of JP5384522B2 publication Critical patent/JP5384522B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2010540692A 2007-12-28 2008-11-14 ヒートシンク、および楔係止システムを用いたヒートシンク形成方法 Expired - Fee Related JP5384522B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/966,201 2007-12-28
US11/966,201 US8347502B2 (en) 2007-12-28 2007-12-28 Heat sink and method of forming a heatsink using a wedge-lock system
PCT/US2008/083645 WO2009085423A2 (en) 2007-12-28 2008-11-14 A heat sink and method of forming a heatsink using a wedge-lock system

Publications (3)

Publication Number Publication Date
JP2011508446A JP2011508446A (ja) 2011-03-10
JP2011508446A5 true JP2011508446A5 (enExample) 2012-01-05
JP5384522B2 JP5384522B2 (ja) 2014-01-08

Family

ID=40328487

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010540692A Expired - Fee Related JP5384522B2 (ja) 2007-12-28 2008-11-14 ヒートシンク、および楔係止システムを用いたヒートシンク形成方法

Country Status (6)

Country Link
US (2) US8347502B2 (enExample)
EP (1) EP2227822A2 (enExample)
JP (1) JP5384522B2 (enExample)
KR (1) KR20100110346A (enExample)
CN (1) CN101911270B (enExample)
WO (1) WO2009085423A2 (enExample)

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FR2967763B1 (fr) * 2010-11-19 2014-07-04 Thales Sa Dispositif de dissipation de chaleur et carte electronique correspondante
CN102768998A (zh) * 2011-05-05 2012-11-07 优杰精密机械(苏州)有限公司 大功率电子器件模组用基板
US9111899B2 (en) 2012-09-13 2015-08-18 Lenovo Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacks
US9245813B2 (en) 2013-01-30 2016-01-26 International Business Machines Corporation Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performance
US9090004B2 (en) 2013-02-06 2015-07-28 International Business Machines Corporation Composites comprised of aligned carbon fibers in chain-aligned polymer binder
US9082744B2 (en) 2013-07-08 2015-07-14 International Business Machines Corporation Method for aligning carbon nanotubes containing magnetic nanoparticles in a thermosetting polymer using a magnetic field
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US9357670B2 (en) 2014-02-18 2016-05-31 Lockheed Martin Corporation Efficient heat transfer from conduction-cooled circuit cards
US9953957B2 (en) 2015-03-05 2018-04-24 Invensas Corporation Embedded graphite heat spreader for 3DIC
US20190016482A1 (en) * 2015-03-12 2019-01-17 Airbus Defence And Space Netherlands B.V. Radiator, as well as space vehicle structure comprising such radiator
US10101099B2 (en) 2015-03-12 2018-10-16 Airbus Defence And Space Netherlands B.V. Radiator, as well as space vehicle structure comprising such radiator
US10741519B2 (en) 2016-07-11 2020-08-11 Laird Technologies, Inc. Systems of applying materials to components
US11141823B2 (en) * 2018-04-28 2021-10-12 Laird Technologies, Inc. Systems and methods of applying materials to components

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