FR2967763B1 - Dispositif de dissipation de chaleur et carte electronique correspondante - Google Patents

Dispositif de dissipation de chaleur et carte electronique correspondante

Info

Publication number
FR2967763B1
FR2967763B1 FR1004514A FR1004514A FR2967763B1 FR 2967763 B1 FR2967763 B1 FR 2967763B1 FR 1004514 A FR1004514 A FR 1004514A FR 1004514 A FR1004514 A FR 1004514A FR 2967763 B1 FR2967763 B1 FR 2967763B1
Authority
FR
France
Prior art keywords
heat dissipating
electronic board
corresponding electronic
dissipating device
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
FR1004514A
Other languages
English (en)
Other versions
FR2967763A1 (fr
Inventor
Antoine Vanier
Bruno Bellin
Marc Gatti
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thales SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thales SA filed Critical Thales SA
Priority to FR1004514A priority Critical patent/FR2967763B1/fr
Publication of FR2967763A1 publication Critical patent/FR2967763A1/fr
Application granted granted Critical
Publication of FR2967763B1 publication Critical patent/FR2967763B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4338—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR1004514A 2010-11-19 2010-11-19 Dispositif de dissipation de chaleur et carte electronique correspondante Active FR2967763B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR1004514A FR2967763B1 (fr) 2010-11-19 2010-11-19 Dispositif de dissipation de chaleur et carte electronique correspondante

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1004514A FR2967763B1 (fr) 2010-11-19 2010-11-19 Dispositif de dissipation de chaleur et carte electronique correspondante

Publications (2)

Publication Number Publication Date
FR2967763A1 FR2967763A1 (fr) 2012-05-25
FR2967763B1 true FR2967763B1 (fr) 2014-07-04

Family

ID=44146629

Family Applications (1)

Application Number Title Priority Date Filing Date
FR1004514A Active FR2967763B1 (fr) 2010-11-19 2010-11-19 Dispositif de dissipation de chaleur et carte electronique correspondante

Country Status (1)

Country Link
FR (1) FR2967763B1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3079021B1 (fr) * 2018-03-16 2020-09-11 Alstom Transp Tech Dispositif de conduction thermique et systeme de dissipation de chaleur associe

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57147255A (en) * 1981-03-05 1982-09-11 Nec Corp Multichip lsi package
DE3126100A1 (de) * 1981-07-02 1983-01-20 Robert Bosch Gmbh, 7000 Stuttgart "vorrichtung zur befestigung und zur kuehlung eines leistungstransistors"
DE3927755C2 (de) * 1989-08-23 1997-09-11 Sel Alcatel Ag Wärmeableitvorrichtung für elektrische Bauelemente
RU1798945C (ru) * 1991-02-28 1993-02-28 Чистопольское Конструкторско-Технологическое Бюро "Вектор" Устройство дл отвода тепла от электрорадиоэлементов
JPH1070219A (ja) * 1996-08-27 1998-03-10 Fujitsu Ltd 実装モジュールの冷却装置
US20060060328A1 (en) * 2004-09-21 2006-03-23 Ingo Ewes Heat-transfer devices
US8347502B2 (en) * 2007-12-28 2013-01-08 Ge Intelligent Platforms, Inc. Heat sink and method of forming a heatsink using a wedge-lock system

Also Published As

Publication number Publication date
FR2967763A1 (fr) 2012-05-25

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