JP2004500692A5 - - Google Patents

Download PDF

Info

Publication number
JP2004500692A5
JP2004500692A5 JP2000512246A JP2000512246A JP2004500692A5 JP 2004500692 A5 JP2004500692 A5 JP 2004500692A5 JP 2000512246 A JP2000512246 A JP 2000512246A JP 2000512246 A JP2000512246 A JP 2000512246A JP 2004500692 A5 JP2004500692 A5 JP 2004500692A5
Authority
JP
Japan
Prior art keywords
heat transfer
transfer device
core material
binder
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000512246A
Other languages
English (en)
Japanese (ja)
Other versions
JP4051402B2 (ja
JP2004500692A (ja
Filing date
Publication date
Priority claimed from US09/154,253 external-priority patent/US6131651A/en
Application filed filed Critical
Priority claimed from PCT/US1998/019601 external-priority patent/WO1999014805A1/en
Publication of JP2004500692A publication Critical patent/JP2004500692A/ja
Publication of JP2004500692A5 publication Critical patent/JP2004500692A5/ja
Application granted granted Critical
Publication of JP4051402B2 publication Critical patent/JP4051402B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2000512246A 1997-09-19 1998-09-21 可撓性を有する伝熱装置およびその製造方法 Expired - Lifetime JP4051402B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US5958697P 1997-09-19 1997-09-19
US09/154,253 US6131651A (en) 1998-09-16 1998-09-16 Flexible heat transfer device and method
PCT/US1998/019601 WO1999014805A1 (en) 1997-09-19 1998-09-21 Flexible heat transfer device and method

Publications (3)

Publication Number Publication Date
JP2004500692A JP2004500692A (ja) 2004-01-08
JP2004500692A5 true JP2004500692A5 (enExample) 2005-10-27
JP4051402B2 JP4051402B2 (ja) 2008-02-27

Family

ID=30447824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000512246A Expired - Lifetime JP4051402B2 (ja) 1997-09-19 1998-09-21 可撓性を有する伝熱装置およびその製造方法

Country Status (1)

Country Link
JP (1) JP4051402B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090165302A1 (en) * 2007-12-31 2009-07-02 Slaton David S Method of forming a heatsink
US8085531B2 (en) * 2009-07-14 2011-12-27 Specialty Minerals (Michigan) Inc. Anisotropic thermal conduction element and manufacturing method
JP5361852B2 (ja) * 2010-12-17 2013-12-04 株式会社カネカ フィルム状グラファイトとその製造方法
US10347559B2 (en) * 2011-03-16 2019-07-09 Momentive Performance Materials Inc. High thermal conductivity/low coefficient of thermal expansion composites
JP5938577B2 (ja) * 2012-04-19 2016-06-22 パナソニックIpマネジメント株式会社 熱伝導シートおよびその製造方法およびこれを用いた熱伝導体
JP2016198937A (ja) * 2015-04-09 2016-12-01 株式会社デンソー 炭素材料層含有複合材料および熱交換器
JP6738193B2 (ja) * 2016-05-09 2020-08-12 昭和電工株式会社 伝熱構造体、絶縁積層材、絶縁回路基板およびパワーモジュール用ベース
KR101743022B1 (ko) 2016-10-31 2017-06-02 신화인터텍 주식회사 방열 시트 및 그 제조 방법

Similar Documents

Publication Publication Date Title
US6131651A (en) Flexible heat transfer device and method
JP2011091106A5 (ja) 放熱用部品及びその製造方法、半導体パッケージ
KR100705868B1 (ko) 반도체 장치 및 그 제조 방법
US20110061848A1 (en) Heat Dissipation Module and the Manufacturing Method Thereof
JP2001177024A (ja) 熱拡散用複合プレート
JP2009021530A (ja) 絶縁性樹脂膜およびパワーモジュール
US20150118514A1 (en) High Performance Thermal Interface System With Improved Heat Spreading and CTE Compliance
JPH10247708A (ja) 面間伝熱プレート
JP2004500692A5 (enExample)
CA1218739A (fr) Support allege pour composants electroniques
CN108109975A (zh) 一种三维泡沫金属骨架的高导热散热片及其制备方法
US5796049A (en) Electronics mounting plate with heat exchanger and method for manufacturing same
JP4051402B2 (ja) 可撓性を有する伝熱装置およびその製造方法
EP1025586B1 (en) Flexible heat transfer device and method
TW201639706A (zh) 散熱積層結構及其製造方法
CN108389839A (zh) 石墨散热板
JP2011508449A5 (enExample)
JP4597279B2 (ja) 熱良導複合材料
CN209845582U (zh) 一种多层导热件
US7097915B2 (en) Separator plate for manufacturing printed circuit board components
JPS5837329A (ja) 熱回収型パツド
RU2000109304A (ru) Гибкое устройство для передачи тепла и способ его изготовления
JPH0831990A (ja) 放熱フィン
CA1235528A (en) Heat dissipation for electronic components on ceramic substrate
RU2208266C2 (ru) Высокогибкое теплопередающее устройство