JP4051402B2 - 可撓性を有する伝熱装置およびその製造方法 - Google Patents
可撓性を有する伝熱装置およびその製造方法 Download PDFInfo
- Publication number
- JP4051402B2 JP4051402B2 JP2000512246A JP2000512246A JP4051402B2 JP 4051402 B2 JP4051402 B2 JP 4051402B2 JP 2000512246 A JP2000512246 A JP 2000512246A JP 2000512246 A JP2000512246 A JP 2000512246A JP 4051402 B2 JP4051402 B2 JP 4051402B2
- Authority
- JP
- Japan
- Prior art keywords
- transfer device
- heat transfer
- core material
- heat
- sheets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title description 4
- 238000004519 manufacturing process Methods 0.000 title description 2
- 239000011162 core material Substances 0.000 claims description 43
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 239000011230 binding agent Substances 0.000 claims description 13
- 229910002804 graphite Inorganic materials 0.000 claims description 13
- 239000010439 graphite Substances 0.000 claims description 13
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 239000002131 composite material Substances 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052790 beryllium Inorganic materials 0.000 claims description 2
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 claims description 2
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims description 2
- 239000000374 eutectic mixture Substances 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 238000005219 brazing Methods 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 239000000463 material Substances 0.000 description 8
- 239000011888 foil Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- 229910052582 BN Inorganic materials 0.000 description 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 4
- 238000009472 formulation Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 150000002894 organic compounds Chemical class 0.000 description 3
- 101000760817 Homo sapiens Macrophage-capping protein Proteins 0.000 description 2
- 102100024573 Macrophage-capping protein Human genes 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- -1 or paraline Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000009966 trimming Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001374 Invar Inorganic materials 0.000 description 1
- 229920000271 Kevlar® Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- SOWHJXWFLFBSIK-UHFFFAOYSA-N aluminum beryllium Chemical compound [Be].[Al] SOWHJXWFLFBSIK-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000002918 waste heat Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US5958697P | 1997-09-19 | 1997-09-19 | |
| US09/154,253 US6131651A (en) | 1998-09-16 | 1998-09-16 | Flexible heat transfer device and method |
| PCT/US1998/019601 WO1999014805A1 (en) | 1997-09-19 | 1998-09-21 | Flexible heat transfer device and method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004500692A JP2004500692A (ja) | 2004-01-08 |
| JP2004500692A5 JP2004500692A5 (enExample) | 2005-10-27 |
| JP4051402B2 true JP4051402B2 (ja) | 2008-02-27 |
Family
ID=30447824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000512246A Expired - Lifetime JP4051402B2 (ja) | 1997-09-19 | 1998-09-21 | 可撓性を有する伝熱装置およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4051402B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9961809B1 (en) | 2016-10-31 | 2018-05-01 | Shinwha Intertek Corp | Heat radiation sheet and method for manufacturing of the same |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090165302A1 (en) * | 2007-12-31 | 2009-07-02 | Slaton David S | Method of forming a heatsink |
| US8085531B2 (en) * | 2009-07-14 | 2011-12-27 | Specialty Minerals (Michigan) Inc. | Anisotropic thermal conduction element and manufacturing method |
| JP5361852B2 (ja) * | 2010-12-17 | 2013-12-04 | 株式会社カネカ | フィルム状グラファイトとその製造方法 |
| US10347559B2 (en) * | 2011-03-16 | 2019-07-09 | Momentive Performance Materials Inc. | High thermal conductivity/low coefficient of thermal expansion composites |
| JP5938577B2 (ja) * | 2012-04-19 | 2016-06-22 | パナソニックＩｐマネジメント株式会社 | 熱伝導シートおよびその製造方法およびこれを用いた熱伝導体 |
| JP2016198937A (ja) * | 2015-04-09 | 2016-12-01 | 株式会社デンソー | 炭素材料層含有複合材料および熱交換器 |
| JP6738193B2 (ja) * | 2016-05-09 | 2020-08-12 | 昭和電工株式会社 | 伝熱構造体、絶縁積層材、絶縁回路基板およびパワーモジュール用ベース |
-
1998
- 1998-09-21 JP JP2000512246A patent/JP4051402B2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9961809B1 (en) | 2016-10-31 | 2018-05-01 | Shinwha Intertek Corp | Heat radiation sheet and method for manufacturing of the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004500692A (ja) | 2004-01-08 |
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