JP4051402B2 - 可撓性を有する伝熱装置およびその製造方法 - Google Patents

可撓性を有する伝熱装置およびその製造方法 Download PDF

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Publication number
JP4051402B2
JP4051402B2 JP2000512246A JP2000512246A JP4051402B2 JP 4051402 B2 JP4051402 B2 JP 4051402B2 JP 2000512246 A JP2000512246 A JP 2000512246A JP 2000512246 A JP2000512246 A JP 2000512246A JP 4051402 B2 JP4051402 B2 JP 4051402B2
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Prior art keywords
transfer device
heat transfer
core material
heat
sheets
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JP2000512246A
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Japanese (ja)
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JP2004500692A5 (enExample
JP2004500692A (ja
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ビー． リッチー，ジョセフ
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モーメンティブ・パフォーマンス・マテリアルズ・インク
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Priority claimed from US09/154,253 external-priority patent/US6131651A/en
Application filed by モーメンティブ・パフォーマンス・マテリアルズ・インク filed Critical モーメンティブ・パフォーマンス・マテリアルズ・インク
Priority claimed from PCT/US1998/019601 external-priority patent/WO1999014805A1/en
Publication of JP2004500692A publication Critical patent/JP2004500692A/ja
Publication of JP2004500692A5 publication Critical patent/JP2004500692A5/ja
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JP2000512246A 1997-09-19 1998-09-21 可撓性を有する伝熱装置およびその製造方法 Expired - Lifetime JP4051402B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US5958697P 1997-09-19 1997-09-19
US09/154,253 US6131651A (en) 1998-09-16 1998-09-16 Flexible heat transfer device and method
PCT/US1998/019601 WO1999014805A1 (en) 1997-09-19 1998-09-21 Flexible heat transfer device and method

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JP2004500692A JP2004500692A (ja) 2004-01-08
JP2004500692A5 JP2004500692A5 (enExample) 2005-10-27
JP4051402B2 true JP4051402B2 (ja) 2008-02-27

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9961809B1 (en) 2016-10-31 2018-05-01 Shinwha Intertek Corp Heat radiation sheet and method for manufacturing of the same

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090165302A1 (en) * 2007-12-31 2009-07-02 Slaton David S Method of forming a heatsink
US8085531B2 (en) * 2009-07-14 2011-12-27 Specialty Minerals (Michigan) Inc. Anisotropic thermal conduction element and manufacturing method
JP5361852B2 (ja) * 2010-12-17 2013-12-04 株式会社カネカ フィルム状グラファイトとその製造方法
US10347559B2 (en) * 2011-03-16 2019-07-09 Momentive Performance Materials Inc. High thermal conductivity/low coefficient of thermal expansion composites
JP5938577B2 (ja) * 2012-04-19 2016-06-22 パナソニックＩｐマネジメント株式会社 熱伝導シートおよびその製造方法およびこれを用いた熱伝導体
JP2016198937A (ja) * 2015-04-09 2016-12-01 株式会社デンソー 炭素材料層含有複合材料および熱交換器
JP6738193B2 (ja) * 2016-05-09 2020-08-12 昭和電工株式会社 伝熱構造体、絶縁積層材、絶縁回路基板およびパワーモジュール用ベース

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9961809B1 (en) 2016-10-31 2018-05-01 Shinwha Intertek Corp Heat radiation sheet and method for manufacturing of the same

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JP2004500692A (ja) 2004-01-08

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