JP2020527461A5 - - Google Patents
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- Publication number
- JP2020527461A5 JP2020527461A5 JP2019567274A JP2019567274A JP2020527461A5 JP 2020527461 A5 JP2020527461 A5 JP 2020527461A5 JP 2019567274 A JP2019567274 A JP 2019567274A JP 2019567274 A JP2019567274 A JP 2019567274A JP 2020527461 A5 JP2020527461 A5 JP 2020527461A5
- Authority
- JP
- Japan
- Prior art keywords
- weight
- soldering material
- copper
- soldering
- titanium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000463 material Substances 0.000 claims 19
- 238000005476 soldering Methods 0.000 claims 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 10
- 229910052802 copper Inorganic materials 0.000 claims 10
- 239000010949 copper Substances 0.000 claims 10
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 7
- 239000010936 titanium Substances 0.000 claims 7
- 229910052719 titanium Inorganic materials 0.000 claims 7
- 229910052751 metal Inorganic materials 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 6
- 229910052738 indium Inorganic materials 0.000 claims 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 4
- 239000011248 coating agent Substances 0.000 claims 4
- 238000000576 coating method Methods 0.000 claims 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 4
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 229910052735 hafnium Inorganic materials 0.000 claims 1
- 239000012535 impurity Substances 0.000 claims 1
- 229910052748 manganese Inorganic materials 0.000 claims 1
- 239000011572 manganese Substances 0.000 claims 1
- 230000013011 mating Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 229910052758 niobium Inorganic materials 0.000 claims 1
- 229910052706 scandium Inorganic materials 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 229910052720 vanadium Inorganic materials 0.000 claims 1
- 229910052727 yttrium Inorganic materials 0.000 claims 1
- 229910052726 zirconium Inorganic materials 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102017114893.0 | 2017-07-04 | ||
| DE102017114893.0A DE102017114893B4 (de) | 2017-07-04 | 2017-07-04 | Lötmaterial zum Aktivlöten und Verfahren zum Aktivlöten |
| PCT/EP2018/068020 WO2019008003A1 (de) | 2017-07-04 | 2018-07-04 | Lötmaterial zum aktivlöten und verfahren zum aktivlöten |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020527461A JP2020527461A (ja) | 2020-09-10 |
| JP2020527461A5 true JP2020527461A5 (enExample) | 2020-11-26 |
| JP7093796B2 JP7093796B2 (ja) | 2022-06-30 |
Family
ID=62816572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019567274A Active JP7093796B2 (ja) | 2017-07-04 | 2018-07-04 | 活性ハンダ付けのためのハンダ付け材料、及び活性ハンダ付け方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11338397B2 (enExample) |
| EP (1) | EP3609647B1 (enExample) |
| JP (1) | JP7093796B2 (enExample) |
| KR (1) | KR20200027529A (enExample) |
| CN (1) | CN110891733B (enExample) |
| DE (1) | DE102017114893B4 (enExample) |
| WO (1) | WO2019008003A1 (enExample) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102020111698A1 (de) | 2020-04-29 | 2021-11-04 | Rogers Germany Gmbh | Verfahren zur Herstellung eines Metall-Keramik-Substrats und ein Metall-Keramik-Substrat hergestellt mit einem solchen Verfahren |
| DE102020120188B4 (de) | 2020-07-30 | 2024-08-01 | Rogers Germany Gmbh | Verfahren zur Herstellung eines Trägersubstrats und ein Trägersubstrat hergestellt mit einem solchen Verfahren |
| CN112059470A (zh) * | 2020-09-08 | 2020-12-11 | 中物院成都科学技术发展中心 | 钛酸盐微波介质陶瓷与金属钎焊用活性钎料及其制备方法 |
| CN112427759B (zh) * | 2020-10-27 | 2022-08-26 | 哈尔滨工业大学 | 一种ZrC-SiC陶瓷与TC4钛合金钎焊方法 |
| EP4032870A1 (de) | 2021-01-22 | 2022-07-27 | Heraeus Deutschland GmbH & Co. KG | Verfahren zur strukturierung von metall-keramik-substraten und strukturiertes metall-keramik-substrat |
| CN116982416A (zh) * | 2021-03-30 | 2023-10-31 | 株式会社东芝 | 陶瓷电路基板的制造方法 |
| JP7707671B2 (ja) * | 2021-06-10 | 2025-07-15 | 三菱マテリアル株式会社 | 銅合金粉末、および、積層造形物 |
| EP4112586A1 (de) | 2021-06-29 | 2023-01-04 | Heraeus Deutschland GmbH & Co. KG | Verfahren zur herstellung eines metall-keramik-substrats mittels einem durchlaufofen |
| EP4112587A1 (de) * | 2021-06-29 | 2023-01-04 | Heraeus Deutschland GmbH & Co. KG | Verfahren zur herstellung eines metall-keramik-substrats mittels schnellem heizen |
| CN118160416A (zh) * | 2021-10-25 | 2024-06-07 | 株式会社东芝 | 陶瓷铜电路基板及使用了其的半导体装置 |
| EP4186880A1 (de) * | 2021-11-26 | 2023-05-31 | Heraeus Deutschland GmbH & Co. KG | Metall-keramik-substrat, verfahren zu dessen herstellung und modul |
| CN114952077B (zh) * | 2022-04-14 | 2024-06-21 | 天诺光电材料股份有限公司 | 一种复合钎焊膏及其制备方法和应用 |
| EP4311819A1 (de) | 2022-07-29 | 2024-01-31 | Heraeus Electronics GmbH & Co. KG | Metall-keramik-substrat mit kontaktbereich |
| EP4311818A1 (de) | 2022-07-29 | 2024-01-31 | Heraeus Electronics GmbH & Co. KG | Metall-keramik-substrat mit kontaktbereich |
| EP4332267B1 (de) | 2022-09-05 | 2025-05-14 | Heraeus Electronics GmbH & Co. KG | Verfahren zur herstellung eines metall-keramik-substrats |
| EP4421055A1 (de) | 2023-02-23 | 2024-08-28 | Heraeus Electronics GmbH & Co. KG | Kupfer-keramik-substrat mit sinterbarer oberseite |
| EP4421056A1 (de) | 2023-02-23 | 2024-08-28 | Heraeus Electronics GmbH & Co. KG | Metall-keramik-substrat mit sinterbarer oberseite |
| DE102023104436A1 (de) | 2023-02-23 | 2024-08-29 | Heraeus Deutschland GmbH & Co. KG | Metall-Keramik-Substrat mit sinterbarer Oberseite |
| EP4421054A1 (de) | 2023-02-23 | 2024-08-28 | Heraeus Electronics GmbH & Co. KG | Kupfer-keramik-substrat mit sinterbarer oberseite |
| EP4593076A1 (de) | 2024-01-24 | 2025-07-30 | Heraeus Electronics GmbH & Co. KG | Metall-keramik-substrat mit kontaktbereich |
| EP4593075A1 (de) | 2024-01-24 | 2025-07-30 | Heraeus Electronics GmbH & Co. KG | Metall-keramik-substrat mit kontaktbereich |
| TWI863823B (zh) * | 2024-02-06 | 2024-11-21 | 同欣電子工業股份有限公司 | 活性金屬陶瓷基板的製造方法 |
| TWI876868B (zh) * | 2024-02-06 | 2025-03-11 | 同欣電子工業股份有限公司 | 金屬陶瓷基板及其製造方法 |
| KR20250155381A (ko) * | 2024-04-23 | 2025-10-30 | 주식회사 케이씨씨 | 금속 페이스트 조성물 및 이를 포함하는 금속-세라믹 복합 기판 |
| EP4663620A1 (de) | 2024-06-11 | 2025-12-17 | Heraeus Electronics GmbH & Co. KG | Verfahren zur herstellung eines metall-keramik-substrats und metall-keramik-substrat |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
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| DE2457198C2 (de) * | 1974-12-04 | 1983-10-20 | Institut problem materialovedenija Akademii Nauk Ukrainskoj SSR, Kiev | Legierung zum Metallisieren und Löten von überharten Werkstoffen |
| FR2298609A1 (fr) * | 1975-01-22 | 1976-08-20 | Inst Materialovedeni | Alliage pour la metallisation et le brasage des materiaux abrasifs |
| US4603990A (en) | 1982-09-10 | 1986-08-05 | Kotobuki & Co., Ltd. | Mechanical pencil with refill cartridge |
| US4426033A (en) * | 1982-09-20 | 1984-01-17 | Gte Products Corporation | Ductile titanium-copper brazing alloy |
| US4603090A (en) * | 1984-04-05 | 1986-07-29 | Gte Products Corporation | Ductile titanium-indium-copper brazing alloy |
| US4661416A (en) | 1984-04-05 | 1987-04-28 | Gte Products Corporation | Ductile reactive metal-indium-copper brazing alloy article |
| EP0185954B1 (de) | 1984-12-22 | 1990-03-14 | Vacuumschmelze GmbH | Rasch abgeschreckte duktile Lötfolie |
| DE3608559A1 (de) * | 1986-03-14 | 1987-09-17 | Kernforschungsanlage Juelich | Verfahren zum verbinden von formteilen aus sic mit keramik oder metall und zur oberflaechenbehandlung von sisic sowie eine zum verbinden brauchbare legierung |
| US5013612A (en) * | 1989-11-13 | 1991-05-07 | Ford Motor Company | Braze material for joining ceramic to metal and ceramic to ceramic surfaces and joined ceramic to metal and ceramic to ceramic article |
| US5102621A (en) | 1990-12-21 | 1992-04-07 | Ucar Carbon Technology Corporation | Ternary brazing alloy for carbon or graphite |
| JPH04238877A (ja) | 1991-01-08 | 1992-08-26 | Sumitomo Metal Ind Ltd | ＡｌＮ部材とＣｕ部材の接合体とその製造方法 |
| JP3095187B2 (ja) | 1991-07-30 | 2000-10-03 | 同和鉱業株式会社 | 金属・セラミックス接合用ろう材 |
| CN1027797C (zh) | 1992-03-25 | 1995-03-08 | 中国科学院金属研究所 | 可焊接陶瓷的耐氧化型活性金属钎料 |
| JP3790000B2 (ja) * | 1997-01-27 | 2006-06-28 | 日本碍子株式会社 | セラミックス部材と電力供給用コネクターとの接合構造 |
| DE19729545A1 (de) * | 1997-07-10 | 1999-01-14 | Euromat Gmbh | Lotlegierung |
| US5832360A (en) * | 1997-08-28 | 1998-11-03 | Norton Company | Bond for abrasive tool |
| US6187071B1 (en) * | 1999-01-14 | 2001-02-13 | Norton Company | Bond for abrasive tool |
| JP2003283064A (ja) | 2002-03-26 | 2003-10-03 | Ngk Spark Plug Co Ltd | セラミック回路基板及びその製造方法 |
| JP2003305588A (ja) | 2002-04-11 | 2003-10-28 | Fujitsu Ltd | 接合材料 |
| EP2055725A1 (en) | 2007-11-05 | 2009-05-06 | Total Petrochemicals Research Feluy | Reduced blockage when transferring polymer product from one reactor to another |
| CN103619779B (zh) | 2011-06-30 | 2015-07-01 | 日立金属株式会社 | 钎料、钎料膏、陶瓷电路板、陶瓷主电路板及功率半导体模块 |
| CN102554385B (zh) | 2011-12-13 | 2013-09-04 | 河南科技大学 | 一种金属陶瓷复合衬板的钎焊铸接工艺 |
| JP6359455B2 (ja) * | 2012-10-04 | 2018-07-18 | 株式会社東芝 | 半導体回路基板およびそれを用いた半導体装置並びに半導体回路基板の製造方法 |
| DE102012110322B4 (de) | 2012-10-29 | 2014-09-11 | Rogers Germany Gmbh | Metall-Keramik-Substrat sowie Verfahren zum Herstellen eines Metall-Keramik-Substrates |
| JP5664679B2 (ja) * | 2013-03-07 | 2015-02-04 | 三菱マテリアル株式会社 | パワーモジュール用基板の製造方法 |
| JP6127833B2 (ja) * | 2013-08-26 | 2017-05-17 | 三菱マテリアル株式会社 | 接合体の製造方法及びパワーモジュール用基板の製造方法 |
| US10103035B2 (en) * | 2014-02-12 | 2018-10-16 | Mitsubishi Materials Corporation | Copper-ceramic bonded body and power module substrate |
| CN105829266A (zh) * | 2014-03-20 | 2016-08-03 | 三菱综合材料株式会社 | 接合体、功率模块用基板、功率模块及接合体的制造方法 |
| DE102015108668B4 (de) * | 2015-06-02 | 2018-07-26 | Rogers Germany Gmbh | Verfahren zur Herstellung eines Verbundmaterials |
-
2017
- 2017-07-04 DE DE102017114893.0A patent/DE102017114893B4/de active Active
-
2018
- 2018-07-04 JP JP2019567274A patent/JP7093796B2/ja active Active
- 2018-07-04 KR KR1020207003138A patent/KR20200027529A/ko not_active Ceased
- 2018-07-04 EP EP18737251.1A patent/EP3609647B1/de active Active
- 2018-07-04 US US16/628,554 patent/US11338397B2/en active Active
- 2018-07-04 CN CN201880044903.6A patent/CN110891733B/zh active Active
- 2018-07-04 WO PCT/EP2018/068020 patent/WO2019008003A1/de not_active Ceased
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