JP2006515953A - 密閉された集積ｍｅｍｓスイッチ - Google Patents

密閉された集積ｍｅｍｓスイッチ Download PDF

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Publication number
JP2006515953A
JP2006515953A JP2005506093A JP2005506093A JP2006515953A JP 2006515953 A JP2006515953 A JP 2006515953A JP 2005506093 A JP2005506093 A JP 2005506093A JP 2005506093 A JP2005506093 A JP 2005506093A JP 2006515953 A JP2006515953 A JP 2006515953A
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Prior art keywords
seesaw
mems switch
layer
conductor
mems
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JP2005506093A
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Japanese (ja)
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JP2006515953A5 (enExample
Inventor
ギャリー・ジョゼフ・パッシュビー
ティモシー・ジー・スレイター
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シヴァータ・インコーポレーテッド
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Publication of JP2006515953A5 publication Critical patent/JP2006515953A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/10—Auxiliary devices for switching or interrupting
    • H01P1/12—Auxiliary devices for switching or interrupting by mechanical chopper
    • H01P1/127—Strip line switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/04—Networks or arrays of similar microstructural devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • H01H2059/0054—Rocking contacts or actuating members

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
JP2005506093A 2002-08-03 2003-08-04 密閉された集積ｍｅｍｓスイッチ Pending JP2006515953A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US40131102P 2002-08-03 2002-08-03
US41532502P 2002-10-02 2002-10-02
US44295803P 2003-01-29 2003-01-29
PCT/US2003/024255 WO2004013898A2 (en) 2002-08-03 2003-08-04 Sealed integral mems switch

Publications (2)

Publication Number Publication Date
JP2006515953A true JP2006515953A (ja) 2006-06-08
JP2006515953A5 JP2006515953A5 (enExample) 2006-09-21

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ID=31499336

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005506093A Pending JP2006515953A (ja) 2002-08-03 2003-08-04 密閉された集積ｍｅｍｓスイッチ

Country Status (6)

Country Link
US (1) US7123119B2 (enExample)
EP (1) EP1547189A4 (enExample)
JP (1) JP2006515953A (enExample)
KR (1) KR100997929B1 (enExample)
AU (1) AU2003258020A1 (enExample)
WO (1) WO2004013898A2 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
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WO2008069202A1 (ja) * 2006-12-07 2008-06-12 Omron Corporation 高周波リレー及びその接続構造
JP2011501460A (ja) * 2007-10-25 2011-01-06 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 偏光発光装置
JP2011129369A (ja) * 2009-12-17 2011-06-30 Fujifilm Corp 圧電ｍｅｍｓスイッチ及びその製造方法

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US20060232365A1 (en) * 2002-10-25 2006-10-19 Sumit Majumder Micro-machined relay
US7275292B2 (en) * 2003-03-07 2007-10-02 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Method for fabricating an acoustical resonator on a substrate
US7190245B2 (en) 2003-04-29 2007-03-13 Medtronic, Inc. Multi-stable micro electromechanical switches and methods of fabricating same
US7388459B2 (en) 2003-10-28 2008-06-17 Medtronic, Inc. MEMs switching circuit and method for an implantable medical device
KR100530010B1 (ko) * 2003-11-13 2005-11-22 한국과학기술원 전자기력과 정전기력을 이용하여 구동하는 토글방식의저전압, 저전력 초고주파 ｓｐｄｔ 마이크로 스위치
WO2005099410A2 (en) 2004-04-12 2005-10-27 Siverta, Inc. Single-pole, double-throw mems switch
US7615833B2 (en) * 2004-07-13 2009-11-10 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Film bulk acoustic resonator package and method of fabricating same
US7521363B2 (en) * 2004-08-09 2009-04-21 Analog Devices, Inc. MEMS device with non-standard profile
US7388454B2 (en) 2004-10-01 2008-06-17 Avago Technologies Wireless Ip Pte Ltd Acoustic resonator performance enhancement using alternating frame structure
US8981876B2 (en) 2004-11-15 2015-03-17 Avago Technologies General Ip (Singapore) Pte. Ltd. Piezoelectric resonator structures and electrical filters having frame elements
US7202560B2 (en) 2004-12-15 2007-04-10 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Wafer bonding of micro-electro mechanical systems to active circuitry
US7791434B2 (en) 2004-12-22 2010-09-07 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Acoustic resonator performance enhancement using selective metal etch and having a trench in the piezoelectric
KR100661350B1 (ko) * 2004-12-27 2006-12-27 삼성전자주식회사 Ｍｅｍｓ 소자 패키지 및 그 제조방법
JP4417861B2 (ja) * 2005-01-31 2010-02-17 富士通株式会社 マイクロスイッチング素子
US7369013B2 (en) 2005-04-06 2008-05-06 Avago Technologies Wireless Ip Pte Ltd Acoustic resonator performance enhancement using filled recessed region
US7611919B2 (en) * 2005-04-21 2009-11-03 Hewlett-Packard Development Company, L.P. Bonding interface for micro-device packaging
US7528691B2 (en) * 2005-08-26 2009-05-05 Innovative Micro Technology Dual substrate electrostatic MEMS switch with hermetic seal and method of manufacture
US7737807B2 (en) 2005-10-18 2010-06-15 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Acoustic galvanic isolator incorporating series-connected decoupled stacked bulk acoustic resonators
GB0523713D0 (en) * 2005-11-22 2005-12-28 Cavendish Kinetics Ltd Enclosure method
JP2007149370A (ja) * 2005-11-24 2007-06-14 Fujitsu Media Device Kk スイッチ
KR100697652B1 (ko) 2005-12-01 2007-03-20 주식회사 에이스테크놀로지 알에프 스위치
JP4628275B2 (ja) * 2006-01-31 2011-02-09 富士通株式会社 マイクロスイッチング素子およびマイクロスイッチング素子製造方法
US7746677B2 (en) 2006-03-09 2010-06-29 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. AC-DC converter circuit and power supply
US7479685B2 (en) 2006-03-10 2009-01-20 Avago Technologies General Ip (Singapore) Pte. Ltd. Electronic device on substrate with cavity and mitigated parasitic leakage path
US8120133B2 (en) * 2006-09-11 2012-02-21 Alcatel Lucent Micro-actuator and locking switch
JP4855233B2 (ja) * 2006-12-07 2012-01-18 富士通株式会社 マイクロスイッチング素子およびマイクロスイッチング素子製造方法
ITTO20060907A1 (it) * 2006-12-20 2008-06-21 St Microelectronics Srl Procedimento di fabbricazione di un sistema di interazione microelettromeccanico per un supporto di memorizzazione
US7732977B2 (en) 2008-04-30 2010-06-08 Avago Technologies Wireless Ip (Singapore) Transceiver circuit for film bulk acoustic resonator (FBAR) transducers
US7855618B2 (en) 2008-04-30 2010-12-21 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Bulk acoustic resonator electrical impedance transformers
DE102008043790B4 (de) * 2008-11-17 2017-04-06 Robert Bosch Gmbh Mikromechanisches Bauelement
WO2010138717A1 (en) * 2009-05-27 2010-12-02 King Abdullah University Of Science And Technology Mems mass spring damper systems using an out-of-plane suspension scheme
US8248185B2 (en) 2009-06-24 2012-08-21 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Acoustic resonator structure comprising a bridge
US8902023B2 (en) 2009-06-24 2014-12-02 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator structure having an electrode with a cantilevered portion
JP5398411B2 (ja) * 2009-08-10 2014-01-29 株式会社東芝 マイクロ可動デバイスおよびマイクロ可動デバイスの製造方法
US8193877B2 (en) 2009-11-30 2012-06-05 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Duplexer with negative phase shifting circuit
US9243316B2 (en) 2010-01-22 2016-01-26 Avago Technologies General Ip (Singapore) Pte. Ltd. Method of fabricating piezoelectric material with selected c-axis orientation
US8796904B2 (en) 2011-10-31 2014-08-05 Avago Technologies General Ip (Singapore) Pte. Ltd. Bulk acoustic resonator comprising piezoelectric layer and inverse piezoelectric layer
US8962443B2 (en) 2011-01-31 2015-02-24 Avago Technologies General Ip (Singapore) Pte. Ltd. Semiconductor device having an airbridge and method of fabricating the same
US9203374B2 (en) 2011-02-28 2015-12-01 Avago Technologies General Ip (Singapore) Pte. Ltd. Film bulk acoustic resonator comprising a bridge
US9048812B2 (en) 2011-02-28 2015-06-02 Avago Technologies General Ip (Singapore) Pte. Ltd. Bulk acoustic wave resonator comprising bridge formed within piezoelectric layer
US9425764B2 (en) 2012-10-25 2016-08-23 Avago Technologies General Ip (Singapore) Pte. Ltd. Accoustic resonator having composite electrodes with integrated lateral features
US9136818B2 (en) 2011-02-28 2015-09-15 Avago Technologies General Ip (Singapore) Pte. Ltd. Stacked acoustic resonator comprising a bridge
US9148117B2 (en) 2011-02-28 2015-09-29 Avago Technologies General Ip (Singapore) Pte. Ltd. Coupled resonator filter comprising a bridge and frame elements
US9154112B2 (en) 2011-02-28 2015-10-06 Avago Technologies General Ip (Singapore) Pte. Ltd. Coupled resonator filter comprising a bridge
US9083302B2 (en) 2011-02-28 2015-07-14 Avago Technologies General Ip (Singapore) Pte. Ltd. Stacked bulk acoustic resonator comprising a bridge and an acoustic reflector along a perimeter of the resonator
US9490771B2 (en) 2012-10-29 2016-11-08 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator comprising collar and frame
US8575820B2 (en) 2011-03-29 2013-11-05 Avago Technologies General Ip (Singapore) Pte. Ltd. Stacked bulk acoustic resonator
US9490418B2 (en) 2011-03-29 2016-11-08 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator comprising collar and acoustic reflector with temperature compensating layer
US9401692B2 (en) 2012-10-29 2016-07-26 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator having collar structure
US9444426B2 (en) 2012-10-25 2016-09-13 Avago Technologies General Ip (Singapore) Pte. Ltd. Accoustic resonator having integrated lateral feature and temperature compensation feature
US8350445B1 (en) 2011-06-16 2013-01-08 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Bulk acoustic resonator comprising non-piezoelectric layer and bridge
US8922302B2 (en) 2011-08-24 2014-12-30 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator formed on a pedestal
US8940586B2 (en) * 2011-11-23 2015-01-27 Taiwan Semiconductor Manufacturing Co., Ltd. Mechanism for MEMS bump side wall angle improvement
US9165723B2 (en) 2012-08-23 2015-10-20 Harris Corporation Switches for use in microelectromechanical and other systems, and processes for making same
US9053873B2 (en) * 2012-09-20 2015-06-09 Harris Corporation Switches for use in microelectromechanical and other systems, and processes for making same
US9053874B2 (en) 2012-09-20 2015-06-09 Harris Corporation MEMS switches and other miniaturized devices having encapsulating enclosures, and processes for fabricating same
US8907849B2 (en) 2012-10-12 2014-12-09 Harris Corporation Wafer-level RF transmission and radiation devices
US9203133B2 (en) 2012-10-18 2015-12-01 Harris Corporation Directional couplers with variable frequency response
US9385684B2 (en) 2012-10-23 2016-07-05 Avago Technologies General Ip (Singapore) Pte. Ltd. Acoustic resonator having guard ring
US9330874B2 (en) * 2014-08-11 2016-05-03 Innovative Micro Technology Solder bump sealing method and device
US11083837B2 (en) 2016-03-22 2021-08-10 International Business Machines Corporation Secure medication delivery
US10376444B2 (en) * 2016-03-22 2019-08-13 International Business Machines Corporation Secure medication delivery
CN106771667B (zh) * 2016-12-29 2019-05-03 西北核技术研究所 基于相心旋转的微波测量方法及测量系统

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JPH052977A (ja) * 1991-06-25 1993-01-08 Matsushita Electric Works Ltd 静電リレー
JPH052978A (ja) * 1991-06-25 1993-01-08 Matsushita Electric Works Ltd 静電リレー
JPH0714479A (ja) * 1993-03-29 1995-01-17 Seiko Epson Corp 基板導通装置および圧力検出装置とそれを用いた流体吐出装置およびインクジェットヘッド
JPH0917483A (ja) * 1995-06-27 1997-01-17 Yokogawa Electric Corp マイクロマシンデバイスの電極取出構造
JPH09180616A (ja) * 1995-12-28 1997-07-11 Omron Corp 静電継電器および静電継電器の製造方法
JPH11273529A (ja) * 1998-03-20 1999-10-08 Nec Corp 高周波リレー
JP2001076605A (ja) * 1999-07-01 2001-03-23 Advantest Corp 集積型マイクロスイッチおよびその製造方法
WO2002058092A1 (en) * 2001-01-18 2002-07-25 Arizona State University Micro-magnetic latching switch with relaxed permanent magnet alignment requirements

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JPH052977A (ja) * 1991-06-25 1993-01-08 Matsushita Electric Works Ltd 静電リレー
JPH052978A (ja) * 1991-06-25 1993-01-08 Matsushita Electric Works Ltd 静電リレー
JPH0714479A (ja) * 1993-03-29 1995-01-17 Seiko Epson Corp 基板導通装置および圧力検出装置とそれを用いた流体吐出装置およびインクジェットヘッド
JPH0917483A (ja) * 1995-06-27 1997-01-17 Yokogawa Electric Corp マイクロマシンデバイスの電極取出構造
JPH09180616A (ja) * 1995-12-28 1997-07-11 Omron Corp 静電継電器および静電継電器の製造方法
JPH11273529A (ja) * 1998-03-20 1999-10-08 Nec Corp 高周波リレー
JP2001076605A (ja) * 1999-07-01 2001-03-23 Advantest Corp 集積型マイクロスイッチおよびその製造方法
WO2002058092A1 (en) * 2001-01-18 2002-07-25 Arizona State University Micro-magnetic latching switch with relaxed permanent magnet alignment requirements

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WO2008069202A1 (ja) * 2006-12-07 2008-06-12 Omron Corporation 高周波リレー及びその接続構造
US8421561B2 (en) 2006-12-07 2013-04-16 Omron Corporation High frequency relay and its connection structure
JP2011501460A (ja) * 2007-10-25 2011-01-06 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 偏光発光装置
JP2011129369A (ja) * 2009-12-17 2011-06-30 Fujifilm Corp 圧電ｍｅｍｓスイッチ及びその製造方法

Also Published As

Publication number Publication date
WO2004013898A2 (en) 2004-02-12
KR20050083613A (ko) 2005-08-26
AU2003258020A8 (en) 2004-02-23
WO2004013898A3 (en) 2004-06-10
KR100997929B1 (ko) 2010-12-02
AU2003258020A1 (en) 2004-02-23
US7123119B2 (en) 2006-10-17
EP1547189A2 (en) 2005-06-29
US20050206483A1 (en) 2005-09-22
EP1547189A4 (en) 2006-11-08

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