JP2006509215A5 - - Google Patents

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Publication number
JP2006509215A5
JP2006509215A5 JP2004559258A JP2004559258A JP2006509215A5 JP 2006509215 A5 JP2006509215 A5 JP 2006509215A5 JP 2004559258 A JP2004559258 A JP 2004559258A JP 2004559258 A JP2004559258 A JP 2004559258A JP 2006509215 A5 JP2006509215 A5 JP 2006509215A5
Authority
JP
Japan
Prior art keywords
forming
socket
wire
contact element
depositing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004559258A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006509215A (ja
Filing date
Publication date
Priority claimed from US10/310,791 external-priority patent/US6920689B2/en
Application filed filed Critical
Publication of JP2006509215A publication Critical patent/JP2006509215A/ja
Publication of JP2006509215A5 publication Critical patent/JP2006509215A5/ja
Pending legal-status Critical Current

Links

JP2004559258A 2002-12-06 2003-12-02 集積回路上で試験を実施するためのソケット及びその製造方法 Pending JP2006509215A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/310,791 US6920689B2 (en) 2002-12-06 2002-12-06 Method for making a socket to perform testing on integrated circuits
PCT/US2003/038463 WO2004053976A2 (en) 2002-12-06 2003-12-02 Method of making a socket to perform testing on integrated circuits and such a socket

Publications (2)

Publication Number Publication Date
JP2006509215A JP2006509215A (ja) 2006-03-16
JP2006509215A5 true JP2006509215A5 (enExample) 2007-02-22

Family

ID=32468118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004559258A Pending JP2006509215A (ja) 2002-12-06 2003-12-02 集積回路上で試験を実施するためのソケット及びその製造方法

Country Status (9)

Country Link
US (3) US6920689B2 (enExample)
EP (1) EP1570277B1 (enExample)
JP (1) JP2006509215A (enExample)
KR (1) KR20050085387A (enExample)
CN (1) CN100538369C (enExample)
AU (1) AU2003298856A1 (enExample)
DE (1) DE60331243D1 (enExample)
TW (1) TWI362711B (enExample)
WO (1) WO2004053976A2 (enExample)

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US20060038576A1 (en) * 2004-08-19 2006-02-23 Pooya Tadayon Sort interface unit having probe capacitors
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WO2007017955A1 (ja) * 2005-08-09 2007-02-15 Kabushiki Kaisha Nihon Micronics 通電試験用プローブ
US7357644B2 (en) 2005-12-12 2008-04-15 Neoconix, Inc. Connector having staggered contact architecture for enhanced working range
US7172450B1 (en) * 2006-01-11 2007-02-06 Qualitau, Inc. High temperature open ended zero insertion force (ZIF) test socket
US7982290B2 (en) 2006-01-12 2011-07-19 Palo Alto Research Center, Inc. Contact spring application to semiconductor devices
US7528618B2 (en) * 2006-05-02 2009-05-05 Formfactor, Inc. Extended probe tips
KR100817054B1 (ko) 2006-07-13 2008-03-26 삼성전자주식회사 패키지 테스트용 소켓, 테스트 소켓용 러버 및 테스트소켓용 가이드
US7731503B2 (en) * 2006-08-21 2010-06-08 Formfactor, Inc. Carbon nanotube contact structures
KR100703043B1 (ko) * 2006-09-21 2007-04-09 (주)에이펙스 검사용 프로브 기판 및 그 제조 방법
KR100816843B1 (ko) * 2006-10-31 2008-03-26 삼성전기주식회사 인쇄회로기판
US8149007B2 (en) * 2007-10-13 2012-04-03 Formfactor, Inc. Carbon nanotube spring contact structures with mechanical and electrical components
CN101316014B (zh) * 2007-10-17 2012-02-01 番禺得意精密电子工业有限公司 电连接装置及其组装方法
KR101004911B1 (ko) * 2008-08-12 2010-12-28 삼성전기주식회사 마이크로 전자기계적 부품 제조방법
CN101750525B (zh) * 2008-12-22 2012-07-04 京元电子股份有限公司 测试插座的制作方法及其所使用的弹性测试探针
US20100252317A1 (en) * 2009-04-03 2010-10-07 Formfactor, Inc. Carbon nanotube contact structures for use with semiconductor dies and other electronic devices
US8272124B2 (en) * 2009-04-03 2012-09-25 Formfactor, Inc. Anchoring carbon nanotube columns
JP5333029B2 (ja) * 2009-08-10 2013-11-06 Ｊｓｒ株式会社 電気接続部材および電気接続部材の製造方法
US8476538B2 (en) * 2010-03-08 2013-07-02 Formfactor, Inc. Wiring substrate with customization layers
US8215966B2 (en) * 2010-04-20 2012-07-10 Tyco Electronics Corporation Interposer connector assembly
US8274798B2 (en) * 2010-07-28 2012-09-25 Unimicron Technology Corp. Carrier substrate and method for making the same
DE102010054782B4 (de) * 2010-12-16 2025-02-06 Snaptrack, Inc. Gehäustes elektrisches Bauelement
CN102175946A (zh) * 2011-03-07 2011-09-07 世盟科信（北京）国际科技发展有限公司 用于生产测试的治具
JP5809509B2 (ja) * 2011-09-29 2015-11-11 新光電気工業株式会社 スプリング端子付配線基板及びその実装構造とソケット
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US10788531B2 (en) * 2014-10-29 2020-09-29 Modus Test, Llc Reduced cost package device simulator, manufacturing method and method of use
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US11821918B1 (en) 2020-04-24 2023-11-21 Microfabrica Inc. Buckling beam probe arrays and methods for making such arrays including forming probes with lateral positions matching guide plate hole positions
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US11768227B1 (en) 2019-02-22 2023-09-26 Microfabrica Inc. Multi-layer probes having longitudinal axes and preferential probe bending axes that lie in planes that are nominally parallel to planes of probe layers
KR102855232B1 (ko) * 2021-05-20 2025-09-08 삼성디스플레이 주식회사 표시 패널 및 이를 포함하는 표시 장치

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US6920689B2 (en) * 2002-12-06 2005-07-26 Formfactor, Inc. Method for making a socket to perform testing on integrated circuits

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