JP2006505116A - 半導体デバイス製造のためのゲート材料 - Google Patents
半導体デバイス製造のためのゲート材料 Download PDFInfo
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- JP2006505116A JP2006505116A JP2004547063A JP2004547063A JP2006505116A JP 2006505116 A JP2006505116 A JP 2006505116A JP 2004547063 A JP2004547063 A JP 2004547063A JP 2004547063 A JP2004547063 A JP 2004547063A JP 2006505116 A JP2006505116 A JP 2006505116A
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7842—Field effect transistors with field effect produced by an insulated gate means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/28079—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor the final conductor layer next to the insulator being a single metal, e.g. Ta, W, Mo, Al
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
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- H01L29/1029—Channel region of field-effect devices of field-effect transistors
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Abstract
Description
本出願は、2002年10月22日に出願された米国特許仮出願第60/420227号の利益を主張し、その開示内容全体は、参照により本明細書に組み込まれている。
技術分野
本発明は、一般的には半導体デバイスに関し、特に歪み層を備えている半導体基板上に形成された半導体構造に関する。
半導体層を予めドーピングし、ゲート画定前にドーパント分布のためのアニールを行う。浅いソースおよびドレインは、その後に形成されるので、ゲートのアニールステップの影響を受けない。
手段
一実施態様では、本発明は、構造を形成する方法に関し、この方法は、基板上に、約2nm(約20Å)より薄い厚みを有する空乏領域を備えている層を形成することを含む。そして、層の一部を除去してトランジスタのゲートを画定し、このゲートがチャンネル長さを規定する。複数のドーパントをゲート付近の基板に導入してソースおよびドレインを画定し、導入された複数のドーパントが活性化する温度に基板を加熱する。この温度は、複数のドーパントの少なくとも一部が拡散して高いOFF電流が生じてしまうことを防止するには十分に低くなっている。
Claims (63)
- 構造を形成する方法であって、
基板上に、厚みが約2nm(約20オングストローム)より小さな空乏領域を備えている層を形成すること、
前記層の一部を除去してトランジスタのゲートを画定して、該ゲートがチャンネル長さを画定すること、
前記ゲートに隣接している前記基板に複数のドーパントを導入してソースおよびドレインを画定すること、および
前記基板を、複数のドーパントが活性化する温度に加熱することを含み、
前記温度が十分に低く、これにより、前記複数のドーパントの少なくとも一部が拡散して高いOFF電流が誘導されることが防止される、方法。 - 前記基板が絶縁体層を含む、請求項1に記載の方法。
- 前記基板が、前記絶縁体層上に設けられた歪み層を含む、請求項2に記載の方法。
- 前記基板が歪み層を含む、請求項1に記載の方法。
- 前記歪み層が引張り歪みを有している、請求項4に記載の方法。
- 前記歪み層が圧縮歪みを有している、請求項4に記載の方法。
- 前記基板が緩和層を含む、請求項1に記載の方法。
- 前記基板がゲルマニウムからなっている、請求項1に記載の方法。
- 誘導されたOFF電流が、1マイクロメートルあたり10−6アンペアより小さい、請求項1に記載の方法。
- 前記誘導されたOFF電流が、1マイクロメートルあたり10−9アンペアより小さい、請求項9に記載の方法。
- 複数のドーパントを導入した後、前記ソースの領域に導入された複数のドーパントの一部が、チャンネル付近でソース限界を画定し、基板の加熱後、該ソース限界がゲート下で広がり、その広がる距離はチャンネル長さの12.5%よりも短い、請求項1に記載の方法。
- 前記ソース限界におけるドーパント成分の濃度が、少なくとも約1018原子/立方センチメートルである、請求項11に記載の方法。
- 複数のドーパントが導入された後、前記ドレインの領域に導入された複数のドーパントの一部が、チャンネル付近でドレイン限界を画定し、基板の加熱後、該ドレイン限界がゲート下で広がり、その広がる距離はチャンネル長さの12.5%よりも小さい、請求項1に記載の方法。
- 前記ドレイン限界におけるドーパント成分の濃度が、少なくとも約1018原子/立方センチメートルである、請求項13に記載の方法。
- 前記層が半導体からなっており、該層を形成するステップが、当該層内に複数のゲートドーパントを導入することと、当該層内のゲートドーパントの分布を変化させるために該層を第1の温度に加熱することとを含む、請求項1に記載の方法。
- 前記半導体がシリコンからなっている、請求項15に記載の方法。
- 前記半導体がゲルマニウムからなっている、請求項1に記載の方法。
- 前記層が金属元素からなっている、請求項1に記載の方法。
- 前記金属元素が、モリブデン、チタン、タンタル、タングステン、イリジウム、ニッケル、コバルトおよび白金のうちの少なくとも1つを含む、請求項18に記載の方法。
- 構造を形成する方法であって、
基板上に設けられたゲート電極層に、第1の複数のドーパントを導入すること、
前記ゲート電極層内の第1の複数のドーパントの分布を変化させるために、当該ゲート電極層を第1の温度に加熱すること、
前記ゲート電極層の一部を除去して、トランジスタのゲートを画定すること、
第2の複数のドーパントを前記ゲートに隣接する基板に導入して、ソースおよびドレインを画定すること、および
前記第2の複数のドーパントを活性化させるために、基板を第2の温度に加熱することを含み、
前記第2の温度が前記第1の温度よりも低い方法。 - 前記基板が絶縁体層を含む、請求項20に記載の方法。
- 前記基板が、前記絶縁体層上に設けられた歪み層を含む、請求項21に記載の方法。
- 前記基板が歪み層を含む、請求項20に記載の方法。
- 前記歪み層が引張り歪みを有している、請求項23に記載の方法。
- 前記歪み層が圧縮歪みを有している、請求項23に記載の方法。
- 前記基板が緩和層を含む、請求項20に記載の方法。
- 前記基板がゲルマニウムからなっている、請求項20に記載の方法。
- 前記第1の温度が1273K(1000℃)よりも高い、請求項20に記載の方法。
- 前記第2の温度が1273K(1000℃)よりも低い、請求項20に記載の方法。
- 前記ゲート電極層が半導体層を含む、請求項20に記載の方法。
- 前記半導体層がシリコンからなっている、請求項30に記載の方法。
- 前記半導体層がゲルマニウムからなっている、請求項30に記載の方法。
- 前記第1の複数のドーパントおよび第2の複数のドーパントが、n型ドーパントからなっている、請求項20に記載の方法。
- 前記第1の複数のドーパントおよび第2の複数のドーパントが、p型ドーパントからなっている、請求項20に記載の方法。
- 構造を形成する方法であって、
基板上に設けられたゲート電極層に、第1の複数のドーパントを導入すること、
前記ゲート電極層内の前記第1の複数のドーパントの分布を変化させるために、半導体層を第1の時間加熱すること、
前記ゲート電極層の一部を除去して、トランジスタのゲートを画定すること、
第2の複数のドーパントを前記ゲートに隣接する基板に導入して、ソースおよびドレインを画定すること、
前記第2の複数のドーパントを活性化させるために、前記基板を第2の時間加熱することを含み、
前記第2の時間が前記第1の時間よりも短い方法。 - 前記基板が絶縁体層を含む、請求項35に記載の方法。
- 前記基板が、前記絶縁体層上に設けられた歪み層を含む、請求項36に記載の方法。
- 前記基板が歪み層を含む、請求項35に記載の方法。
- 前記歪み層が引張り歪みを有している、請求項38に記載の方法。
- 前記歪み層が圧縮歪みを有している、請求項38に記載の方法。
- 前記基板が緩和層を含む、請求項35に記載の方法。
- 前記基板が、シリコンおよびゲルマニウムの少なくとも1つを含む、請求項35に記載の方法。
- 前記第1の時間が5秒よりも長い、請求項35に記載の方法。
- 前記第1の時間が30秒より長い、請求項35に記載の方法。
- 前記ゲート電極層が半導体層を含む、請求項35に記載の方法。
- 前記半導体層がシリコンからなっている、請求項45に記載の方法。
- 前記半導体層がゲルマニウムからなっている、請求項45に記載の方法。
- 前記第1の複数のドーパントがn型ドーパントからなっている、請求項35に記載の方法。
- 前記第2の複数のドーパントがp型ドーパントからなっている、請求項35に記載の方法。
- 基板上に設けられた歪み層と、第1のトランジスタとを有する構造であって、
該第1のトランジスタが、
第1のソースおよび第1のドレインであって、該第1のソースの少なくとも一部および該第1のドレインの少なくとも一部が、前記歪み層の第1の部分に設けられている、第1のソースおよび第1のドレインと、
前記歪み層上にかつ前記ソースと前記ドレインとの間に設けられていて、第1の金属を含んでいる第1のゲートと、
前記第1のゲートと前記歪み層との間に設けられている第1のゲート誘電体層とを有している、構造。 - 前記基板が誘電体材料を含み、前記歪み層が、該誘電体材料と接触して設けられている、請求項50に記載の構造。
- 前記第1の金属が、チタン、タングステン、モリブデン、タンタル、ニッケル、コバルトおよび白金からなる群から選択される、請求項50に記載の構造。
- 前記歪み層がシリコンからなっている、請求項50に記載の構造。
- 前記ゲートが金属-半導体合金からなっている、請求項50に記載の構造。
- 前記ゲートが本質的に金属-半導体合金からなっている、請求項54に記載の構造。
- 前記ゲート下に形成されたチャンネルをさらに有している、請求項50に記載の構造。
- 前記ソースが、チャンネル付近にソース限界を有しており、該ソース限界が、ゲート下で広がり、その広がる距離がチャンネル長さの12.5%より短い、請求項56に記載の構造。
- 前記ソース限界のドーパントの濃度が、少なくとも約1018原子/立方センチメートルである、請求項57に記載の構造。
- 前記ドレインが、チャンネル付近でドレイン限界を有しており、該ドレイン限界が、ゲート下でチャンネル長さの12.5%よりも短い距離を延びている、請求項56に記載の構造。
- 前記ドレイン限界のドーパントの濃度が、少なくとも約約1018原子/立方センチメートルである、請求項59に記載の構造。
- 第2のトランジスタをさらに含む構造であって、
該第2のトランジスタが、
第2のソースおよび第2のドレインであって、該第2のソースの少なくとも一部および該第2のドレインの少なくとも一部が、歪み層の第2の部分に設けられている、第2のソースおよび第2のドレインと、
前記歪み層上にかつ前記第2のソースと前記第2のドレインとの間に設けられていて、第2の金属を含んでいる第2のゲートと、
前記第2のゲートと前記歪み層との間に設けられている前記第2のゲート誘電体層とを有しており、
前記第1のトランジスタが、n型金属-酸化物-半導体電界効果トランジスタであり、前記第1のソースおよび前記第1のドレインがn型ドーパントを有しており、前記第2のトランジスタが、p型金属-酸化物-半導体電界効果トランジスタであり、前記第2のソースおよび前記第2のドレインがp型ドーパントを有している、請求項50に記載の構造。 - 前記第1のゲートが第1の仕事関数を有しており、前記第2のゲートが第2の仕事関数を有しており、当該第1の仕事関数が、実質的に該第2の仕事関数に等しい、請求項61に記載の構造。
- 前記第1のゲートが第1の仕事関数を有しており、前記第2のゲートが第2の仕事関数を有しており、当該第1の仕事関数が、実質的に該第2の仕事関数と異なる、請求項61に記載の構造。
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AU2003301603A1 (en) | 2004-05-13 |
EP1561238A1 (en) | 2005-08-10 |
US7074655B2 (en) | 2006-07-11 |
US6991972B2 (en) | 2006-01-31 |
US20040137685A1 (en) | 2004-07-15 |
JP4796771B2 (ja) | 2011-10-19 |
WO2004038778A1 (en) | 2004-05-06 |
US20060258075A1 (en) | 2006-11-16 |
US20060024869A1 (en) | 2006-02-02 |
US7326599B2 (en) | 2008-02-05 |
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