JP2006500782A5 - - Google Patents

Download PDF

Info

Publication number
JP2006500782A5
JP2006500782A5 JP2004540039A JP2004540039A JP2006500782A5 JP 2006500782 A5 JP2006500782 A5 JP 2006500782A5 JP 2004540039 A JP2004540039 A JP 2004540039A JP 2004540039 A JP2004540039 A JP 2004540039A JP 2006500782 A5 JP2006500782 A5 JP 2006500782A5
Authority
JP
Japan
Prior art keywords
web
roll
flexible circuit
circuit
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2004540039A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006500782A (ja
Filing date
Publication date
Priority claimed from US10/255,507 external-priority patent/US6815620B2/en
Application filed filed Critical
Publication of JP2006500782A publication Critical patent/JP2006500782A/ja
Publication of JP2006500782A5 publication Critical patent/JP2006500782A5/ja
Withdrawn legal-status Critical Current

Links

JP2004540039A 2002-09-26 2003-08-29 静電損傷制限機構を有するフレキシブル回路 Withdrawn JP2006500782A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/255,507 US6815620B2 (en) 2001-03-29 2002-09-26 Flexible circuit with electrostatic damage limiting feature
PCT/US2003/027362 WO2004030427A1 (en) 2002-09-26 2003-08-29 Flexible circuit with electrostatic damage limiting feature

Publications (2)

Publication Number Publication Date
JP2006500782A JP2006500782A (ja) 2006-01-05
JP2006500782A5 true JP2006500782A5 (enExample) 2006-10-12

Family

ID=32041750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004540039A Withdrawn JP2006500782A (ja) 2002-09-26 2003-08-29 静電損傷制限機構を有するフレキシブル回路

Country Status (5)

Country Link
US (2) US6815620B2 (enExample)
JP (1) JP2006500782A (enExample)
CN (1) CN1685774A (enExample)
AU (1) AU2003263041A1 (enExample)
WO (1) WO2004030427A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6995954B1 (en) 2001-07-13 2006-02-07 Magnecomp Corporation ESD protected suspension interconnect
US7489493B2 (en) * 2003-12-01 2009-02-10 Magnecomp Corporation Method to form electrostatic discharge protection on flexible circuits using a diamond-like carbon material
US7223922B2 (en) * 2004-07-28 2007-05-29 International Business Machines Corporation ESD dissipative coating on cables
US7525047B2 (en) * 2004-07-28 2009-04-28 International Business Machines Corporation Cable having translucent, semi-transparent or transparent ESD dissipative layer and/or metallic layer
JP4386863B2 (ja) * 2005-02-21 2009-12-16 日本発條株式会社 ヘッド・サスペンション
JP4326484B2 (ja) * 2005-02-21 2009-09-09 日本発條株式会社 ヘッドサスペンション
JP4571013B2 (ja) * 2005-05-30 2010-10-27 日東電工株式会社 配線回路基板
US7476339B2 (en) 2006-08-18 2009-01-13 Saint-Gobain Ceramics & Plastics, Inc. Highly filled thermoplastic composites
KR101312292B1 (ko) * 2006-12-11 2013-09-27 엘아이지에이디피 주식회사 플라즈마 처리장치의 기판 파손 방지장치 및 그 방법
US8213120B2 (en) * 2007-09-10 2012-07-03 International Business Machines Corporation Flexible cable comprising liquid crystal polymer
JP5138549B2 (ja) 2008-10-31 2013-02-06 日東電工株式会社 回路付サスペンション基板
US8493689B2 (en) * 2009-06-15 2013-07-23 Seagate Technology Llc Protective layer on gimbal for scratch mitigation
CN104078055B (zh) * 2013-03-29 2018-10-26 东莞新科技术研究开发有限公司 挠性件及其制造方法、磁头折片组合以及磁盘驱动器
US8873192B1 (en) 2013-07-30 2014-10-28 Hewlett-Packard Development Company, L.P. Magnetic tape heads
US9681542B2 (en) * 2014-11-14 2017-06-13 Oracle International Corporation Flexible circuit with partial ground path
US12129567B2 (en) 2015-05-06 2024-10-29 Hutchinson Technology Incorporated Plasma treatments for flexures of hard disk drives
CN113271719B (zh) * 2021-06-23 2022-07-08 昆山丘钛生物识别科技有限公司 柔性电路板处理方法、装置及设备

Family Cites Families (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3562037A (en) 1967-07-07 1971-02-09 Electro Connective Systems Inc Continuous method of producing indefinite lengths of flexible flat electrical conductors
US4231154A (en) 1979-01-10 1980-11-04 International Business Machines Corporation Electronic package assembly method
DE3064976D1 (en) 1979-11-20 1983-10-27 Nat Res Dev Infra red reflectors
EP0049032B1 (en) 1980-08-21 1986-09-17 National Research Development Corporation Coating insulating materials by glow discharge
DE3200206A1 (de) 1982-01-07 1983-07-21 Henkel KGaA, 4000 Düsseldorf Organopolysiloxane und deren verwendung als antischaummittel in waessrigen dispersionen und loesungen von kunstharzen
US4576964A (en) 1982-03-16 1986-03-18 Pfizer Inc. Substituted hexahydrobenzo[e]indene and octahydrophenanthrene CNS agents and pharmaceutical compositions thereof
US4480288A (en) 1982-12-27 1984-10-30 International Business Machines Corporation Multi-layer flexible film module
US4698256A (en) 1984-04-02 1987-10-06 American Cyanamid Company Articles coated with adherent diamondlike carbon films
FR2592874B1 (fr) 1986-01-14 1990-08-03 Centre Nat Rech Scient Procede pour tremper un objet en verre ou vitreux et objet ainsi trempe
US4809876A (en) 1987-08-27 1989-03-07 Aluminum Company Of America Container body having improved gas barrier properties
US4913930A (en) * 1988-06-28 1990-04-03 Wacker Silicones Corporation Method for coating semiconductor components on a dielectric film
US4914551A (en) 1988-07-13 1990-04-03 International Business Machines Corporation Electronic package with heat spreader member
US4959752A (en) * 1988-10-24 1990-09-25 Digital Equipment Corporation Electronic module RFI/EMI shielding
CA2031098A1 (en) 1990-01-16 1991-07-17 William F. Banholzer Cvd diamond coated annulus components and method of their fabrication
US5527596A (en) 1990-09-27 1996-06-18 Diamonex, Incorporated Abrasion wear resistant coated substrate product
JP3215423B2 (ja) * 1992-01-18 2001-10-09 ザ・ユニバーシティ・オブ・ニューキャッスル・アポン・タイン 導電性ポリマーの製法
US5227008A (en) 1992-01-23 1993-07-13 Minnesota Mining And Manufacturing Company Method for making flexible circuits
DE4219410A1 (de) 1992-06-13 1993-12-16 Hoechst Ag Heißsiegelfähige, antistatisch beschichtete Folien und Folienlaminate, Verfahren zu deren Herstellung und deren Verwendung
US5350594A (en) * 1993-01-25 1994-09-27 Tech Spray, Inc. Conformally coated faraday cage
EP0615257B1 (en) 1993-03-09 1999-06-02 Koninklijke Philips Electronics N.V. Method of manufactoring a laminated structure of a metal layer on a conductive polymer layer
EP0698275A4 (en) * 1993-04-28 1996-09-04 Mark Mitchnick CONDUCTIVE POLYMERS
US5401913A (en) 1993-06-08 1995-03-28 Minnesota Mining And Manufacturing Company Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board
US5643343A (en) 1993-11-23 1997-07-01 Selifanov; Oleg Vladimirovich Abrasive material for precision surface treatment and a method for the manufacturing thereof
US5465186A (en) 1994-01-26 1995-11-07 International Business Machines Corporation Shorted magnetoresistive head leads for electrical overstress and electrostatic discharge protection during manufacture of a magnetic storage system
US5559367A (en) 1994-07-12 1996-09-24 International Business Machines Corporation Diamond-like carbon for use in VLSI and ULSI interconnect systems
US5551959A (en) 1994-08-24 1996-09-03 Minnesota Mining And Manufacturing Company Abrasive article having a diamond-like coating layer and method for making same
US5700398A (en) 1994-12-14 1997-12-23 International Business Machines Corporation Composition containing a polymer and conductive filler and use thereof
JP2855414B2 (ja) 1995-04-13 1999-02-10 日本メクトロン株式会社 磁気ヘッド用中継基板及びその製造法
US6099757A (en) 1995-06-05 2000-08-08 Americhem, Inc. Tuned conductive coatings and blends from intrinisically conductive polymers and processes for making same
US5761009A (en) 1995-06-07 1998-06-02 International Business Machines Corporation Having parastic shield for electrostatic discharge protection
DE19536844C1 (de) 1995-10-02 1997-04-10 Bayer Ag Verfahren zur elektrostatischen Lackierung von nicht leitfähigen Oberflächen
JP3062435B2 (ja) * 1995-11-10 2000-07-10 日本碍子株式会社 フレキシブル基板並びにそれに用いるBe−Cu合金箔およびその製造方法
US5644454A (en) 1996-03-11 1997-07-01 International Business Machines Corporation Electrostatic discharge protection system for MR heads
US5699212A (en) * 1996-05-01 1997-12-16 International Business Machines Corporation Method of electrostatic discharge protection of magnetic heads in a magnetic storage system
US6046886A (en) 1997-10-09 2000-04-04 Seagate Technology, Inc. Flex circuit head interconnect with insulating spacer
KR100442408B1 (ko) * 1998-11-05 2004-11-06 제일모직주식회사 고전도성및고투명성을갖는폴리티오펜계전도성고분자용액조성물
US6125015A (en) * 1998-12-04 2000-09-26 Read-Rite Corporation Head gimbal assembly with low stiffness flex circuit and ESD Protection
US6146813A (en) 1999-01-13 2000-11-14 Applied Kinetics Inc. Method and shunting and deshunting an electrical component and a shuntable/shunted electrical component
US6316734B1 (en) 2000-03-07 2001-11-13 3M Innovative Properties Company Flexible circuits with static discharge protection and process for manufacture
US6687097B1 (en) * 2000-03-22 2004-02-03 Pemstar, Inc. Electrostatic protection for magnetic heads
US6482521B1 (en) 2000-07-31 2002-11-19 Hughes Electronics Corp. Structure with blended polymer conformal coating of controlled electrical resistivity
US6927951B2 (en) * 2001-03-09 2005-08-09 Seagate Technology Llc Flex on suspension with dissipative polymer substrate acting as bleed resistor for minimizing ESD damage
US6459043B1 (en) 2001-03-29 2002-10-01 3M Innovative Properties Company Flexible circuit with electrostatic damage limiting feature and method of manufacture

Similar Documents

Publication Publication Date Title
JP2006500782A5 (enExample)
US9873276B2 (en) Microcontact printing stamps with functional features
CN104870105B (zh) 在后续处理期间实现精确配准的多种油墨的印刷
US7135203B2 (en) Flexible circuit with electrostatic damage limiting feature
KR20180124835A (ko) 연속 도포 장치 및 연속 도포 방법
JPH0330851A (ja) 基板上に液状被覆を静電噴霧し乾燥させる方法および装置
US9302464B2 (en) Inking system for flexographic printing
US9938614B2 (en) Air skive with vapor injection
JP2003002497A (ja) 基材搬送機構
KR101433805B1 (ko) 구조개선된 반도체 제조용 필름 코팅장치
JP2919063B2 (ja) プリント配線板の製造方法
JP5821944B2 (ja) 搬送装置、製造システム
JP3130903U (ja) ソーラーパネルへの多層印刷装置
US20100129612A1 (en) Electrically conducting layer structure and process for the production thereof
US6715858B1 (en) Image-forming device
JPS61283194A (ja) はんだ塗布装置
JPH0627986Y2 (ja) 写真現像型液状レジストインク塗布装置
JP7677203B2 (ja) 印刷装置及び印刷方法
JP5493959B2 (ja) パターン形成装置、パターン形成方法及び表示素子の製造装置
JP2740061B2 (ja) プリント配線板の製造方法
JPH0939198A (ja) スクリーン印刷機
US20070221329A1 (en) Apparatus and method for distributing a liquid onto a surface of an item
EP0610832B1 (en) Squeeze rollers
JP4784848B2 (ja) グラビア印刷装置
JP4703823B2 (ja) チップ型抵抗器の製造方法