JP2006500782A5 - - Google Patents
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- Publication number
- JP2006500782A5 JP2006500782A5 JP2004540039A JP2004540039A JP2006500782A5 JP 2006500782 A5 JP2006500782 A5 JP 2006500782A5 JP 2004540039 A JP2004540039 A JP 2004540039A JP 2004540039 A JP2004540039 A JP 2004540039A JP 2006500782 A5 JP2006500782 A5 JP 2006500782A5
- Authority
- JP
- Japan
- Prior art keywords
- web
- roll
- flexible circuit
- circuit
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000007639 printing Methods 0.000 claims 5
- 229920001940 conductive polymer Polymers 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 239000011248 coating agent Substances 0.000 claims 3
- 238000000576 coating method Methods 0.000 claims 3
- 239000000463 material Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 229920000106 Liquid crystal polymer Polymers 0.000 claims 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 claims 1
- 238000001035 drying Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 claims 1
- 229920005570 flexible polymer Polymers 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 238000010023 transfer printing Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/255,507 US6815620B2 (en) | 2001-03-29 | 2002-09-26 | Flexible circuit with electrostatic damage limiting feature |
| PCT/US2003/027362 WO2004030427A1 (en) | 2002-09-26 | 2003-08-29 | Flexible circuit with electrostatic damage limiting feature |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006500782A JP2006500782A (ja) | 2006-01-05 |
| JP2006500782A5 true JP2006500782A5 (enExample) | 2006-10-12 |
Family
ID=32041750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004540039A Withdrawn JP2006500782A (ja) | 2002-09-26 | 2003-08-29 | 静電損傷制限機構を有するフレキシブル回路 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US6815620B2 (enExample) |
| JP (1) | JP2006500782A (enExample) |
| CN (1) | CN1685774A (enExample) |
| AU (1) | AU2003263041A1 (enExample) |
| WO (1) | WO2004030427A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6995954B1 (en) | 2001-07-13 | 2006-02-07 | Magnecomp Corporation | ESD protected suspension interconnect |
| US7489493B2 (en) * | 2003-12-01 | 2009-02-10 | Magnecomp Corporation | Method to form electrostatic discharge protection on flexible circuits using a diamond-like carbon material |
| US7223922B2 (en) * | 2004-07-28 | 2007-05-29 | International Business Machines Corporation | ESD dissipative coating on cables |
| US7525047B2 (en) * | 2004-07-28 | 2009-04-28 | International Business Machines Corporation | Cable having translucent, semi-transparent or transparent ESD dissipative layer and/or metallic layer |
| JP4386863B2 (ja) * | 2005-02-21 | 2009-12-16 | 日本発條株式会社 | ヘッド・サスペンション |
| JP4326484B2 (ja) * | 2005-02-21 | 2009-09-09 | 日本発條株式会社 | ヘッドサスペンション |
| JP4571013B2 (ja) * | 2005-05-30 | 2010-10-27 | 日東電工株式会社 | 配線回路基板 |
| US7476339B2 (en) | 2006-08-18 | 2009-01-13 | Saint-Gobain Ceramics & Plastics, Inc. | Highly filled thermoplastic composites |
| KR101312292B1 (ko) * | 2006-12-11 | 2013-09-27 | 엘아이지에이디피 주식회사 | 플라즈마 처리장치의 기판 파손 방지장치 및 그 방법 |
| US8213120B2 (en) * | 2007-09-10 | 2012-07-03 | International Business Machines Corporation | Flexible cable comprising liquid crystal polymer |
| JP5138549B2 (ja) | 2008-10-31 | 2013-02-06 | 日東電工株式会社 | 回路付サスペンション基板 |
| US8493689B2 (en) * | 2009-06-15 | 2013-07-23 | Seagate Technology Llc | Protective layer on gimbal for scratch mitigation |
| CN104078055B (zh) * | 2013-03-29 | 2018-10-26 | 东莞新科技术研究开发有限公司 | 挠性件及其制造方法、磁头折片组合以及磁盘驱动器 |
| US8873192B1 (en) | 2013-07-30 | 2014-10-28 | Hewlett-Packard Development Company, L.P. | Magnetic tape heads |
| US9681542B2 (en) * | 2014-11-14 | 2017-06-13 | Oracle International Corporation | Flexible circuit with partial ground path |
| US12129567B2 (en) | 2015-05-06 | 2024-10-29 | Hutchinson Technology Incorporated | Plasma treatments for flexures of hard disk drives |
| CN113271719B (zh) * | 2021-06-23 | 2022-07-08 | 昆山丘钛生物识别科技有限公司 | 柔性电路板处理方法、装置及设备 |
Family Cites Families (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3562037A (en) | 1967-07-07 | 1971-02-09 | Electro Connective Systems Inc | Continuous method of producing indefinite lengths of flexible flat electrical conductors |
| US4231154A (en) | 1979-01-10 | 1980-11-04 | International Business Machines Corporation | Electronic package assembly method |
| DE3064976D1 (en) | 1979-11-20 | 1983-10-27 | Nat Res Dev | Infra red reflectors |
| EP0049032B1 (en) | 1980-08-21 | 1986-09-17 | National Research Development Corporation | Coating insulating materials by glow discharge |
| DE3200206A1 (de) | 1982-01-07 | 1983-07-21 | Henkel KGaA, 4000 Düsseldorf | Organopolysiloxane und deren verwendung als antischaummittel in waessrigen dispersionen und loesungen von kunstharzen |
| US4576964A (en) | 1982-03-16 | 1986-03-18 | Pfizer Inc. | Substituted hexahydrobenzo[e]indene and octahydrophenanthrene CNS agents and pharmaceutical compositions thereof |
| US4480288A (en) | 1982-12-27 | 1984-10-30 | International Business Machines Corporation | Multi-layer flexible film module |
| US4698256A (en) | 1984-04-02 | 1987-10-06 | American Cyanamid Company | Articles coated with adherent diamondlike carbon films |
| FR2592874B1 (fr) | 1986-01-14 | 1990-08-03 | Centre Nat Rech Scient | Procede pour tremper un objet en verre ou vitreux et objet ainsi trempe |
| US4809876A (en) | 1987-08-27 | 1989-03-07 | Aluminum Company Of America | Container body having improved gas barrier properties |
| US4913930A (en) * | 1988-06-28 | 1990-04-03 | Wacker Silicones Corporation | Method for coating semiconductor components on a dielectric film |
| US4914551A (en) | 1988-07-13 | 1990-04-03 | International Business Machines Corporation | Electronic package with heat spreader member |
| US4959752A (en) * | 1988-10-24 | 1990-09-25 | Digital Equipment Corporation | Electronic module RFI/EMI shielding |
| CA2031098A1 (en) | 1990-01-16 | 1991-07-17 | William F. Banholzer | Cvd diamond coated annulus components and method of their fabrication |
| US5527596A (en) | 1990-09-27 | 1996-06-18 | Diamonex, Incorporated | Abrasion wear resistant coated substrate product |
| JP3215423B2 (ja) * | 1992-01-18 | 2001-10-09 | ザ・ユニバーシティ・オブ・ニューキャッスル・アポン・タイン | 導電性ポリマーの製法 |
| US5227008A (en) | 1992-01-23 | 1993-07-13 | Minnesota Mining And Manufacturing Company | Method for making flexible circuits |
| DE4219410A1 (de) | 1992-06-13 | 1993-12-16 | Hoechst Ag | Heißsiegelfähige, antistatisch beschichtete Folien und Folienlaminate, Verfahren zu deren Herstellung und deren Verwendung |
| US5350594A (en) * | 1993-01-25 | 1994-09-27 | Tech Spray, Inc. | Conformally coated faraday cage |
| EP0615257B1 (en) | 1993-03-09 | 1999-06-02 | Koninklijke Philips Electronics N.V. | Method of manufactoring a laminated structure of a metal layer on a conductive polymer layer |
| EP0698275A4 (en) * | 1993-04-28 | 1996-09-04 | Mark Mitchnick | CONDUCTIVE POLYMERS |
| US5401913A (en) | 1993-06-08 | 1995-03-28 | Minnesota Mining And Manufacturing Company | Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board |
| US5643343A (en) | 1993-11-23 | 1997-07-01 | Selifanov; Oleg Vladimirovich | Abrasive material for precision surface treatment and a method for the manufacturing thereof |
| US5465186A (en) | 1994-01-26 | 1995-11-07 | International Business Machines Corporation | Shorted magnetoresistive head leads for electrical overstress and electrostatic discharge protection during manufacture of a magnetic storage system |
| US5559367A (en) | 1994-07-12 | 1996-09-24 | International Business Machines Corporation | Diamond-like carbon for use in VLSI and ULSI interconnect systems |
| US5551959A (en) | 1994-08-24 | 1996-09-03 | Minnesota Mining And Manufacturing Company | Abrasive article having a diamond-like coating layer and method for making same |
| US5700398A (en) | 1994-12-14 | 1997-12-23 | International Business Machines Corporation | Composition containing a polymer and conductive filler and use thereof |
| JP2855414B2 (ja) | 1995-04-13 | 1999-02-10 | 日本メクトロン株式会社 | 磁気ヘッド用中継基板及びその製造法 |
| US6099757A (en) | 1995-06-05 | 2000-08-08 | Americhem, Inc. | Tuned conductive coatings and blends from intrinisically conductive polymers and processes for making same |
| US5761009A (en) | 1995-06-07 | 1998-06-02 | International Business Machines Corporation | Having parastic shield for electrostatic discharge protection |
| DE19536844C1 (de) | 1995-10-02 | 1997-04-10 | Bayer Ag | Verfahren zur elektrostatischen Lackierung von nicht leitfähigen Oberflächen |
| JP3062435B2 (ja) * | 1995-11-10 | 2000-07-10 | 日本碍子株式会社 | フレキシブル基板並びにそれに用いるBe−Cu合金箔およびその製造方法 |
| US5644454A (en) | 1996-03-11 | 1997-07-01 | International Business Machines Corporation | Electrostatic discharge protection system for MR heads |
| US5699212A (en) * | 1996-05-01 | 1997-12-16 | International Business Machines Corporation | Method of electrostatic discharge protection of magnetic heads in a magnetic storage system |
| US6046886A (en) | 1997-10-09 | 2000-04-04 | Seagate Technology, Inc. | Flex circuit head interconnect with insulating spacer |
| KR100442408B1 (ko) * | 1998-11-05 | 2004-11-06 | 제일모직주식회사 | 고전도성및고투명성을갖는폴리티오펜계전도성고분자용액조성물 |
| US6125015A (en) * | 1998-12-04 | 2000-09-26 | Read-Rite Corporation | Head gimbal assembly with low stiffness flex circuit and ESD Protection |
| US6146813A (en) | 1999-01-13 | 2000-11-14 | Applied Kinetics Inc. | Method and shunting and deshunting an electrical component and a shuntable/shunted electrical component |
| US6316734B1 (en) | 2000-03-07 | 2001-11-13 | 3M Innovative Properties Company | Flexible circuits with static discharge protection and process for manufacture |
| US6687097B1 (en) * | 2000-03-22 | 2004-02-03 | Pemstar, Inc. | Electrostatic protection for magnetic heads |
| US6482521B1 (en) | 2000-07-31 | 2002-11-19 | Hughes Electronics Corp. | Structure with blended polymer conformal coating of controlled electrical resistivity |
| US6927951B2 (en) * | 2001-03-09 | 2005-08-09 | Seagate Technology Llc | Flex on suspension with dissipative polymer substrate acting as bleed resistor for minimizing ESD damage |
| US6459043B1 (en) | 2001-03-29 | 2002-10-01 | 3M Innovative Properties Company | Flexible circuit with electrostatic damage limiting feature and method of manufacture |
-
2002
- 2002-09-26 US US10/255,507 patent/US6815620B2/en not_active Expired - Fee Related
-
2003
- 2003-08-29 AU AU2003263041A patent/AU2003263041A1/en not_active Abandoned
- 2003-08-29 JP JP2004540039A patent/JP2006500782A/ja not_active Withdrawn
- 2003-08-29 WO PCT/US2003/027362 patent/WO2004030427A1/en not_active Ceased
- 2003-08-29 CN CNA038227762A patent/CN1685774A/zh active Pending
-
2004
- 2004-07-22 US US10/897,139 patent/US7135203B2/en not_active Expired - Fee Related
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