JP2006500782A - 静電損傷制限機構を有するフレキシブル回路 - Google Patents

静電損傷制限機構を有するフレキシブル回路 Download PDF

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Publication number
JP2006500782A
JP2006500782A JP2004540039A JP2004540039A JP2006500782A JP 2006500782 A JP2006500782 A JP 2006500782A JP 2004540039 A JP2004540039 A JP 2004540039A JP 2004540039 A JP2004540039 A JP 2004540039A JP 2006500782 A JP2006500782 A JP 2006500782A
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JP
Japan
Prior art keywords
flexible circuit
circuit
web
conductive polymer
roll
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2004540039A
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English (en)
Japanese (ja)
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JP2006500782A5 (enExample
Inventor
ロバート・エス・ドッズワース
ジョン・ビー・シャイブナー
ケ・ジャン
チー・タット・エー
ジュアン・メン・モク
ヨン・ペン・リー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2006500782A publication Critical patent/JP2006500782A/ja
Publication of JP2006500782A5 publication Critical patent/JP2006500782A5/ja
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/40—Protective measures on heads, e.g. against excessive temperature 
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/484—Integrated arm assemblies, e.g. formed by material deposition or by etching from single piece of metal or by lamination of materials forming a single arm/suspension/head unit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0067—Devices for protecting against damage from electrostatic discharge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0534—Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2004540039A 2002-09-26 2003-08-29 静電損傷制限機構を有するフレキシブル回路 Withdrawn JP2006500782A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/255,507 US6815620B2 (en) 2001-03-29 2002-09-26 Flexible circuit with electrostatic damage limiting feature
PCT/US2003/027362 WO2004030427A1 (en) 2002-09-26 2003-08-29 Flexible circuit with electrostatic damage limiting feature

Publications (2)

Publication Number Publication Date
JP2006500782A true JP2006500782A (ja) 2006-01-05
JP2006500782A5 JP2006500782A5 (enExample) 2006-10-12

Family

ID=32041750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004540039A Withdrawn JP2006500782A (ja) 2002-09-26 2003-08-29 静電損傷制限機構を有するフレキシブル回路

Country Status (5)

Country Link
US (2) US6815620B2 (enExample)
JP (1) JP2006500782A (enExample)
CN (1) CN1685774A (enExample)
AU (1) AU2003263041A1 (enExample)
WO (1) WO2004030427A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8587904B2 (en) 2008-10-31 2013-11-19 Nitto Denko Corporation Suspension board with circuit having a light emitting device exposed from a surface thereof opposite to that on which a slider is mounted
JP2018518047A (ja) * 2015-05-06 2018-07-05 ハッチンソン テクノロジー インコーポレイテッドＨｕｔｃｈｉｎｓｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃｏｒｐｏｒａｔｅｄ ハードディスクドライブのフレクシャのプラズマ処理

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US6995954B1 (en) 2001-07-13 2006-02-07 Magnecomp Corporation ESD protected suspension interconnect
US7489493B2 (en) * 2003-12-01 2009-02-10 Magnecomp Corporation Method to form electrostatic discharge protection on flexible circuits using a diamond-like carbon material
US7223922B2 (en) * 2004-07-28 2007-05-29 International Business Machines Corporation ESD dissipative coating on cables
US7525047B2 (en) * 2004-07-28 2009-04-28 International Business Machines Corporation Cable having translucent, semi-transparent or transparent ESD dissipative layer and/or metallic layer
JP4386863B2 (ja) * 2005-02-21 2009-12-16 日本発條株式会社 ヘッド・サスペンション
JP4326484B2 (ja) * 2005-02-21 2009-09-09 日本発條株式会社 ヘッドサスペンション
JP4571013B2 (ja) * 2005-05-30 2010-10-27 日東電工株式会社 配線回路基板
US7476339B2 (en) 2006-08-18 2009-01-13 Saint-Gobain Ceramics & Plastics, Inc. Highly filled thermoplastic composites
KR101312292B1 (ko) * 2006-12-11 2013-09-27 엘아이지에이디피 주식회사 플라즈마 처리장치의 기판 파손 방지장치 및 그 방법
US8213120B2 (en) * 2007-09-10 2012-07-03 International Business Machines Corporation Flexible cable comprising liquid crystal polymer
US8493689B2 (en) * 2009-06-15 2013-07-23 Seagate Technology Llc Protective layer on gimbal for scratch mitigation
CN104078055B (zh) * 2013-03-29 2018-10-26 东莞新科技术研究开发有限公司 挠性件及其制造方法、磁头折片组合以及磁盘驱动器
US8873192B1 (en) 2013-07-30 2014-10-28 Hewlett-Packard Development Company, L.P. Magnetic tape heads
US9681542B2 (en) * 2014-11-14 2017-06-13 Oracle International Corporation Flexible circuit with partial ground path
CN113271719B (zh) * 2021-06-23 2022-07-08 昆山丘钛生物识别科技有限公司 柔性电路板处理方法、装置及设备

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8587904B2 (en) 2008-10-31 2013-11-19 Nitto Denko Corporation Suspension board with circuit having a light emitting device exposed from a surface thereof opposite to that on which a slider is mounted
US8767352B2 (en) 2008-10-31 2014-07-01 Nitto Denko Corporation Suspension board with circuit having an opening extending therethrough in the thickness direction for light emitted from a light emitting device
JP2018518047A (ja) * 2015-05-06 2018-07-05 ハッチンソン テクノロジー インコーポレイテッドＨｕｔｃｈｉｎｓｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃｏｒｐｏｒａｔｅｄ ハードディスクドライブのフレクシャのプラズマ処理
US12129567B2 (en) 2015-05-06 2024-10-29 Hutchinson Technology Incorporated Plasma treatments for flexures of hard disk drives

Also Published As

Publication number Publication date
US20040257729A1 (en) 2004-12-23
US20030062194A1 (en) 2003-04-03
US6815620B2 (en) 2004-11-09
CN1685774A (zh) 2005-10-19
US7135203B2 (en) 2006-11-14
AU2003263041A1 (en) 2004-04-19
WO2004030427A1 (en) 2004-04-08

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