JP2006500782A5 - - Google Patents
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- Publication number
- JP2006500782A5 JP2006500782A5 JP2004540039A JP2004540039A JP2006500782A5 JP 2006500782 A5 JP2006500782 A5 JP 2006500782A5 JP 2004540039 A JP2004540039 A JP 2004540039A JP 2004540039 A JP2004540039 A JP 2004540039A JP 2006500782 A5 JP2006500782 A5 JP 2006500782A5
- Authority
- JP
- Japan
- Prior art keywords
- web
- roll
- flexible circuit
- circuit
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000007639 printing Methods 0.000 claims 5
- 229920001940 conductive polymer Polymers 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 239000011248 coating agent Substances 0.000 claims 3
- 238000000576 coating method Methods 0.000 claims 3
- 239000000463 material Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 229920000106 Liquid crystal polymer Polymers 0.000 claims 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 claims 1
- 238000001035 drying Methods 0.000 claims 1
- 238000005516 engineering process Methods 0.000 claims 1
- 229920005570 flexible polymer Polymers 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 238000010023 transfer printing Methods 0.000 claims 1
Claims (3)
- 静電放電制限機構を組み込んだフレキシブル回路であって、前記回路が、その少なくとも1つの表面上に被覆された少なくとも1つの導電性トレースを有するポリイミドまたは液晶ポリマーフィルムからなる群から選択された誘電体基板を含み、前記放電制限機構が、前記回路の非臨界領域の少なくとも一部の上に選択的に適用された薄い導電性ポリマーコーティングを含み、前記機構が、前記回路の表面抵抗率を約104オーム〜約108オームに低減し、約50V未満の摩擦帯電を有する、フレキシブル回路。
- 静電放電制限機構を組み込んだフレキシブル回路を形成するための装置であって、前記回路が、その少なくとも1つの表面上に被覆された少なくとも1つのトレースを有する誘電体基板と、前記回路の非臨界領域の少なくとも一部の上に選択的に適用された薄い導電性ポリマーコーティングとを含み、フレキシブル回路ロールおよびインターレバーロールの両方のためのロールを有する印刷部の前のウェブ巻出部と、炉と、該炉の後のウェブ巻取部とを備える、約70mm〜約300mmの幅を有するウェブを処理することが可能な自動ウェブ処理システムによって形成される、装置。
- 複数のフレキシブル回路の非臨界領域の少なくとも一部の上に薄い導電性ポリマーコーティングを選択的に形成するための連続リールツーリール印刷方法であって、
インターレバー材料のロールと、ロールの横幅にわたって列に配置され、ロールの長手方向に沿って複数の列に配置された多数の回路を有するフレキシブル回路のロールとを提供し、前記インターレバー材料を前記ロールからウェブ上に巻出し、前記ウェブおよび前記インターレバー材料を設定速度でウェブ方向に移動させてフレキシブル回路の前記ロールを通過させ、複数のアイドラーロールによってウェブの張力を維持したまま前記ウェブ方向に同じ速度で前記フレキシブル回路を前記ロールから供給し、前記ウェブを印刷部に移動させ、前記フレキシブル回路の一列にわたって横方向に前記フレキシブル回路の非臨界領域の少なくとも一部に転写印刷技術によって導電性ポリマー組成物を適用し、前記ウェブを所定の間隔で前記ウェブ方向に移動させ、印刷工程をフレキシブル回路の隣接した列において繰り返し、前記印刷工程を各列が印刷されるような所定の間隔で繰り返し、前記ウェブを乾燥炉内に移動させることを含む、方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/255,507 US6815620B2 (en) | 2001-03-29 | 2002-09-26 | Flexible circuit with electrostatic damage limiting feature |
PCT/US2003/027362 WO2004030427A1 (en) | 2002-09-26 | 2003-08-29 | Flexible circuit with electrostatic damage limiting feature |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006500782A JP2006500782A (ja) | 2006-01-05 |
JP2006500782A5 true JP2006500782A5 (ja) | 2006-10-12 |
Family
ID=32041750
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004540039A Withdrawn JP2006500782A (ja) | 2002-09-26 | 2003-08-29 | 静電損傷制限機構を有するフレキシブル回路 |
Country Status (5)
Country | Link |
---|---|
US (2) | US6815620B2 (ja) |
JP (1) | JP2006500782A (ja) |
CN (1) | CN1685774A (ja) |
AU (1) | AU2003263041A1 (ja) |
WO (1) | WO2004030427A1 (ja) |
Families Citing this family (16)
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US6995954B1 (en) | 2001-07-13 | 2006-02-07 | Magnecomp Corporation | ESD protected suspension interconnect |
US7489493B2 (en) * | 2003-12-01 | 2009-02-10 | Magnecomp Corporation | Method to form electrostatic discharge protection on flexible circuits using a diamond-like carbon material |
US7223922B2 (en) * | 2004-07-28 | 2007-05-29 | International Business Machines Corporation | ESD dissipative coating on cables |
US7525047B2 (en) * | 2004-07-28 | 2009-04-28 | International Business Machines Corporation | Cable having translucent, semi-transparent or transparent ESD dissipative layer and/or metallic layer |
JP4326484B2 (ja) * | 2005-02-21 | 2009-09-09 | 日本発條株式会社 | ヘッドサスペンション |
JP4386863B2 (ja) * | 2005-02-21 | 2009-12-16 | 日本発條株式会社 | ヘッド・サスペンション |
JP4571013B2 (ja) * | 2005-05-30 | 2010-10-27 | 日東電工株式会社 | 配線回路基板 |
KR101312292B1 (ko) * | 2006-12-11 | 2013-09-27 | 엘아이지에이디피 주식회사 | 플라즈마 처리장치의 기판 파손 방지장치 및 그 방법 |
US8213120B2 (en) * | 2007-09-10 | 2012-07-03 | International Business Machines Corporation | Flexible cable comprising liquid crystal polymer |
JP5138549B2 (ja) | 2008-10-31 | 2013-02-06 | 日東電工株式会社 | 回路付サスペンション基板 |
US8493689B2 (en) * | 2009-06-15 | 2013-07-23 | Seagate Technology Llc | Protective layer on gimbal for scratch mitigation |
CN104078055B (zh) * | 2013-03-29 | 2018-10-26 | 东莞新科技术研究开发有限公司 | 挠性件及其制造方法、磁头折片组合以及磁盘驱动器 |
US8873192B1 (en) | 2013-07-30 | 2014-10-28 | Hewlett-Packard Development Company, L.P. | Magnetic tape heads |
US9681542B2 (en) * | 2014-11-14 | 2017-06-13 | Oracle International Corporation | Flexible circuit with partial ground path |
CN113382551A (zh) * | 2015-05-06 | 2021-09-10 | 哈钦森技术股份有限公司 | 用于硬盘驱动器的挠曲部的等离子体处理 |
CN113271719B (zh) * | 2021-06-23 | 2022-07-08 | 昆山丘钛生物识别科技有限公司 | 柔性电路板处理方法、装置及设备 |
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-
2002
- 2002-09-26 US US10/255,507 patent/US6815620B2/en not_active Expired - Fee Related
-
2003
- 2003-08-29 CN CNA038227762A patent/CN1685774A/zh active Pending
- 2003-08-29 JP JP2004540039A patent/JP2006500782A/ja not_active Withdrawn
- 2003-08-29 AU AU2003263041A patent/AU2003263041A1/en not_active Abandoned
- 2003-08-29 WO PCT/US2003/027362 patent/WO2004030427A1/en active Application Filing
-
2004
- 2004-07-22 US US10/897,139 patent/US7135203B2/en not_active Expired - Fee Related
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