JP2006332649A - 垂直構造半導体発光素子およびその製造方法 - Google Patents
垂直構造半導体発光素子およびその製造方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 159
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 187
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 94
- 239000000956 alloy Substances 0.000 claims abstract description 94
- 229910002796 Si–Al Inorganic materials 0.000 claims abstract description 89
- 150000001875 compounds Chemical class 0.000 claims abstract description 47
- 229910052594 sapphire Inorganic materials 0.000 claims description 38
- 239000010980 sapphire Substances 0.000 claims description 38
- 239000002184 metal Substances 0.000 claims description 27
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 16
- 229910052737 gold Inorganic materials 0.000 claims description 11
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 8
- 229910052738 indium Inorganic materials 0.000 claims description 6
- 239000011368 organic material Substances 0.000 claims description 6
- 229910052718 tin Inorganic materials 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 127
- 238000000926 separation method Methods 0.000 description 11
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 230000007547 defect Effects 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 230000005496 eutectics Effects 0.000 description 4
- 238000000879 optical micrograph Methods 0.000 description 4
- 229910052745 lead Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6835—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used as a support during build up manufacturing of active devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Abstract
【解決手段】本発明による垂直構造半導体発光素子は、Si−Al合金基板と、上記Si−Al合金基板上に順次積層されているp型III−V族化合物半導体層、活性層及びn型III−V族化合物半導体層を含む。
【選択図】図2
Description
102 導電性接合層
103 金属反射層
104 p型半導体層
105 活性層
106 n型半導体層
107 n側電極
Claims (27)
- Si−Al合金基板と、
上記Si−Al合金基板上に順次積層されているp型III−V族化合物半導体層、活性層及びn型III−V族化合物半導体層と、
を含むことを特徴とする垂直構造半導体発光素子。 - 上記Si−Al合金基板は、Siを50ないし90重量%含むことを特徴とする請求項1に記載の垂直構造半導体発光素子。
- 上記Si−Al合金基板は、Siを60ないし80重量%含むことを特徴とする請求項1に記載の垂直構造半導体発光素子。
- 上記Si−Al合金基板は、Siを70ないし75重量%含むことを特徴とする請求項1に記載の垂直構造半導体発光素子。
- 上記Si−Al合金基板と上記p型III−V族化合物半導体層との間に、導電性接合層をさらに含むことを特徴とする請求項1に記載の垂直構造半導体発光素子。
- 上記導電性接合層は、Auから成ることを特徴とする請求項5に記載の垂直構造半導体発光素子。
- 上記導電性接合層は、Au/Ge、Au/In、Au/SnまたはPb/Snから成ることを特徴とする請求項5に記載の垂直構造半導体発光素子。
- 上記導電性接合層は、導電性有機物質から成ることを特徴とする請求項5に記載の垂直構造半導体発光素子。
- 上記導電性接合層と上記p型III−V族化合物半導体層との間に形成された金属反射層をさらに含んでいることを特徴とする請求項5に記載の垂直構造半導体発光素子。
- 上記金属反射層は、Au、Ag、Al、Rh及びいずれか2種以上の合金で構成された群より選択された金属から成ることを特徴とする請求項9に記載の垂直構造半導体発光素子。
- 上記p型及びn型III−V族化合物半導体層と活性層は、AlxGayIn(1−x−y)N(0≦x≦1、0≦y≦1、0≦x+y≦1)半導体材料から成ることを特徴とする請求項1に記載の垂直構造半導体発光素子。
- 上記p型及びn型III−V族化合物半導体層と活性層は、AlxGayIn(1−x−y)P(0≦x≦1、0≦y≦1、0≦x+y≦1)半導体材料から成ることを特徴とする請求項1に記載の垂直構造半導体発光素子。
- 上記p型及びn型III−V族化合物半導体層と活性層は、AlxGa(1−x)As(0≦x≦1)系半導体材料から成ることを特徴とする請求項1に記載の垂直構造半導体発光素子。
- 成長用基板上にn型III−V族化合物半導体層、活性層及びp型III−V族化合物半導体層を順次形成する段階と、
上記p型III−V族化合物半導体層上にSi−Al合金基板を接合する段階と、
上記成長用基板を上記III−V族化合物半導体層から分離する段階と、
を含むことを特徴とする垂直構造半導体発光素子の製造方法。 - 上記Si−Al合金基板は、Siを50ないし90重量%含んだSi−Al合金基板を用いることを特徴とする請求項14に記載の垂直構造半導体発光素子の製造方法。
- 上記Si−Al合金基板は、Siを60ないし80重量%含んだSi−Al合金基板を用いることを特徴とする請求項14に記載の垂直構造半導体発光素子の製造方法。
- 上記Si−Al合金基板は、Siを70ないし75重量%含んだSi−Al合金基板を用いることを特徴とする請求項14に記載の垂直構造半導体発光素子の製造方法。
- 上記Si−Al合金基板を接合する段階は、導電性接合層を利用して上記p型III−V族化合物半導体層上に上記Si−Al合金基板を接合することにより行われることを特徴とする請求項14に記載の垂直構造半導体発光素子の製造方法。
- 上記導電性接合層は、Auを用いることを特徴とする請求項18に記載の垂直構造半導体発光素子の製造方法。
- 上記導電性接合層は、Au/Ge、Au/In、Au/SnまたはPb/Snを用いることを特徴とする請求項18に記載の垂直構造半導体発光素子の製造方法。
- 上記導電性接合層は、導電性有機物質を用いることを特徴とする請求項18に記載の垂直構造半導体発光素子の製造方法。
- 上記p型III−V族化合物半導体層を形成する段階と、導電性接合層を利用して上記Si−Al合金基板を接合する段階との間に、上記p型III−V族化合物半導体層上に金属反射層を形成する段階をさらに含むことを特徴とする請求項14に記載の垂直構造半導体発光素子の製造方法。
- 上記Si−Al合金基板を接合する段階は、上記Si−Al合金基板を上記p型III−V族化合物半導体層上に直接接合することにより行われることを特徴とする請求項14に記載の垂直構造半導体発光素子の製造方法。
- 上記p型及びn型III−V族化合物半導体層と活性層は、AlxGayIn(1−x−y)N(0≦x≦1、0≦y≦1、0≦x+y≦1)半導体材料から成り、上記成長用基板ではサファイア基板を用いることを特徴とする請求項14に記載の垂直構造半導体発光素子の製造方法。
- 上記p型及びn型III−V族化合物半導体層と活性層は、AlxGayIn(1−x−y)P(0≦x≦1、0≦y≦1、0≦x+y≦1)半導体材料から成り、上記成長用基板ではGaAs基板を用いることを特徴とする請求項14に記載の垂直構造半導体発光素子の製造方法。
- 上記p型及びn型III−V族化合物半導体層と活性層は、AlxGa(1−x)As(0≦x≦1)半導体材料から成り、上記成長用基板ではGaAs基板を用いることを特徴とする請求項14に記載の垂直構造半導体発光素子の製造方法。
- 上記成長用基板を分離する段階は、レーザーリフトオフによって行われることを特徴とする請求項14に記載の垂直構造半導体発光素子の製造方法。
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KR1020050043228A KR100638825B1 (ko) | 2005-05-23 | 2005-05-23 | 수직구조 반도체 발광 소자 및 그 제조 방법 |
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JP2006332649A true JP2006332649A (ja) | 2006-12-07 |
JP4452253B2 JP4452253B2 (ja) | 2010-04-21 |
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US (1) | US20060268955A1 (ja) |
EP (2) | EP1727215A3 (ja) |
JP (1) | JP4452253B2 (ja) |
KR (1) | KR100638825B1 (ja) |
Cited By (7)
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JP2008147672A (ja) * | 2006-12-08 | 2008-06-26 | Samsung Electro-Mechanics Co Ltd | 垂直構造led素子及びその製造方法 |
JP2010114411A (ja) * | 2008-11-06 | 2010-05-20 | Samsung Electro-Mechanics Co Ltd | 化合物半導体発光素子及びその製造方法 |
WO2011077748A1 (ja) * | 2009-12-24 | 2011-06-30 | Dowaエレクトロニクス株式会社 | バーチカル型iii族窒化物半導体発光素子およびその製造方法 |
US8188496B2 (en) | 2008-11-06 | 2012-05-29 | Samsung Led Co., Ltd. | Semiconductor light emitting device including substrate having protection layers and method for manufacturing the same |
WO2013105634A1 (ja) * | 2012-01-12 | 2013-07-18 | 信越化学工業株式会社 | 熱酸化異種複合基板及びその製造方法 |
KR101423908B1 (ko) * | 2012-12-11 | 2014-07-28 | 광전자 주식회사 | 텍스처된 n형 AlAs 전류 확산층을 가진 웨이퍼 본딩형 AlGaInP 발광다이오드 및 제조 방법 |
WO2024034480A1 (ja) * | 2022-08-10 | 2024-02-15 | 信越半導体株式会社 | マイクロled用接合型ウェーハの製造方法 |
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WO2011069242A1 (en) * | 2009-12-09 | 2011-06-16 | Cooledge Lighting Inc. | Semiconductor dice transfer-enabling apparatus and method for manufacturing transfer-enabling apparatus |
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- 2006-05-17 JP JP2006137590A patent/JP4452253B2/ja not_active Expired - Fee Related
- 2006-05-23 EP EP06252684A patent/EP1727215A3/en not_active Withdrawn
- 2006-05-23 US US11/438,231 patent/US20060268955A1/en not_active Abandoned
- 2006-05-23 EP EP11189765A patent/EP2439798A1/en not_active Withdrawn
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US20060268955A1 (en) | 2006-11-30 |
EP1727215A3 (en) | 2010-10-06 |
KR100638825B1 (ko) | 2006-10-27 |
JP4452253B2 (ja) | 2010-04-21 |
EP1727215A2 (en) | 2006-11-29 |
EP2439798A1 (en) | 2012-04-11 |
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