JP2006326754A - ポリシング装置 - Google Patents

ポリシング装置 Download PDF

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Publication number
JP2006326754A
JP2006326754A JP2005153923A JP2005153923A JP2006326754A JP 2006326754 A JP2006326754 A JP 2006326754A JP 2005153923 A JP2005153923 A JP 2005153923A JP 2005153923 A JP2005153923 A JP 2005153923A JP 2006326754 A JP2006326754 A JP 2006326754A
Authority
JP
Japan
Prior art keywords
polishing
substrate
head
polishing head
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005153923A
Other languages
English (en)
Japanese (ja)
Inventor
Takashi Ujihara
孝志 氏原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Tokki Corp
Original Assignee
Tokki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokki Corp filed Critical Tokki Corp
Priority to JP2005153923A priority Critical patent/JP2006326754A/ja
Priority to TW095105248A priority patent/TW200640608A/zh
Priority to KR1020060018261A priority patent/KR20060122686A/ko
Priority to KR1020077030408A priority patent/KR20080016680A/ko
Priority to PCT/JP2006/310017 priority patent/WO2006126455A1/ja
Publication of JP2006326754A publication Critical patent/JP2006326754A/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B24D13/145—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face having a brush-like working surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Electroluminescent Light Sources (AREA)
JP2005153923A 2005-05-26 2005-05-26 ポリシング装置 Pending JP2006326754A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005153923A JP2006326754A (ja) 2005-05-26 2005-05-26 ポリシング装置
TW095105248A TW200640608A (en) 2005-05-26 2006-02-16 Polishing device
KR1020060018261A KR20060122686A (ko) 2005-05-26 2006-02-24 폴리싱 장치
KR1020077030408A KR20080016680A (ko) 2005-05-26 2006-05-19 폴리싱 장치
PCT/JP2006/310017 WO2006126455A1 (ja) 2005-05-26 2006-05-19 ポリシング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005153923A JP2006326754A (ja) 2005-05-26 2005-05-26 ポリシング装置

Publications (1)

Publication Number Publication Date
JP2006326754A true JP2006326754A (ja) 2006-12-07

Family

ID=37451880

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005153923A Pending JP2006326754A (ja) 2005-05-26 2005-05-26 ポリシング装置

Country Status (4)

Country Link
JP (1) JP2006326754A (ko)
KR (2) KR20060122686A (ko)
TW (1) TW200640608A (ko)
WO (1) WO2006126455A1 (ko)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012111023A (ja) * 2010-11-26 2012-06-14 Sanshin Co Ltd 板状部材研磨装置
JP2012218132A (ja) * 2011-04-13 2012-11-12 Mitsutoyo Corp バリ取り装置
JP2013043222A (ja) * 2011-08-22 2013-03-04 Disco Corp 研磨パッド
WO2017013935A1 (ja) * 2015-07-17 2017-01-26 株式会社フジミインコーポレーテッド 研磨パッド及び研磨方法
CN109997216A (zh) * 2016-11-22 2019-07-09 株式会社荏原制作所 处理装置、具备该处理装置的镀敷装置、输送装置、以及处理方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100780090B1 (ko) * 2006-08-23 2007-11-30 서영정밀주식회사 브레이크시스템용 솔레노이드밸브의 밸브시트 가공방법 및그 지그시스템

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5115793U (ko) * 1974-07-23 1976-02-04
JPH0324772U (ko) * 1989-07-21 1991-03-14
WO1995022435A1 (fr) * 1994-02-22 1995-08-24 Nihon Micro Coating Co., Ltd. Feuille abrasive et son procede de fabrication
JPH07276247A (ja) * 1994-04-11 1995-10-24 Nippon Micro Kooteingu Kk 研磨部材およびその製造方法
JPH1158205A (ja) * 1997-08-25 1999-03-02 Unique Technol Internatl Pte Ltd 電解研磨併用ポリシング・テクスチャー加工装置および加工方法ならびにそれに使用する電解研磨併用ポリシング・テクスチャーテープ
JP2001062696A (ja) * 1999-08-24 2001-03-13 Nihon Micro Coating Co Ltd 研掃方法及び装置
JP2001341058A (ja) * 2000-03-29 2001-12-11 Nihon Micro Coating Co Ltd 磁気ディスク用ガラス基板表面加工方法及び加工用砥粒懸濁液
JP2003165045A (ja) * 2001-11-29 2003-06-10 Seiko Epson Corp 研磨用部材及びその製造方法並びに研磨方法
JP2003273046A (ja) * 2002-03-13 2003-09-26 Nihon Micro Coating Co Ltd 研磨装置及びテープ並びに方法
JP2003275951A (ja) * 2002-03-20 2003-09-30 Sony Corp 研磨方法および研磨装置
JP2004322305A (ja) * 2003-04-11 2004-11-18 Tokki Corp 基板表面平坦化・洗浄装置

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5115793U (ko) * 1974-07-23 1976-02-04
JPH0324772U (ko) * 1989-07-21 1991-03-14
WO1995022435A1 (fr) * 1994-02-22 1995-08-24 Nihon Micro Coating Co., Ltd. Feuille abrasive et son procede de fabrication
JPH07276247A (ja) * 1994-04-11 1995-10-24 Nippon Micro Kooteingu Kk 研磨部材およびその製造方法
JPH1158205A (ja) * 1997-08-25 1999-03-02 Unique Technol Internatl Pte Ltd 電解研磨併用ポリシング・テクスチャー加工装置および加工方法ならびにそれに使用する電解研磨併用ポリシング・テクスチャーテープ
JP2001062696A (ja) * 1999-08-24 2001-03-13 Nihon Micro Coating Co Ltd 研掃方法及び装置
JP2001341058A (ja) * 2000-03-29 2001-12-11 Nihon Micro Coating Co Ltd 磁気ディスク用ガラス基板表面加工方法及び加工用砥粒懸濁液
JP2003165045A (ja) * 2001-11-29 2003-06-10 Seiko Epson Corp 研磨用部材及びその製造方法並びに研磨方法
JP2003273046A (ja) * 2002-03-13 2003-09-26 Nihon Micro Coating Co Ltd 研磨装置及びテープ並びに方法
JP2003275951A (ja) * 2002-03-20 2003-09-30 Sony Corp 研磨方法および研磨装置
JP2004322305A (ja) * 2003-04-11 2004-11-18 Tokki Corp 基板表面平坦化・洗浄装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012111023A (ja) * 2010-11-26 2012-06-14 Sanshin Co Ltd 板状部材研磨装置
JP2012218132A (ja) * 2011-04-13 2012-11-12 Mitsutoyo Corp バリ取り装置
JP2013043222A (ja) * 2011-08-22 2013-03-04 Disco Corp 研磨パッド
WO2017013935A1 (ja) * 2015-07-17 2017-01-26 株式会社フジミインコーポレーテッド 研磨パッド及び研磨方法
JPWO2017013935A1 (ja) * 2015-07-17 2017-11-16 株式会社フジミインコーポレーテッド 研磨パッド及び研磨方法
US10882157B2 (en) 2015-07-17 2021-01-05 Fujimi Incorporated Polishing pad and polishing method
CN109997216A (zh) * 2016-11-22 2019-07-09 株式会社荏原制作所 处理装置、具备该处理装置的镀敷装置、输送装置、以及处理方法

Also Published As

Publication number Publication date
KR20080016680A (ko) 2008-02-21
TW200640608A (en) 2006-12-01
WO2006126455A1 (ja) 2006-11-30
KR20060122686A (ko) 2006-11-30

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