WO2017013935A1 - 研磨パッド及び研磨方法 - Google Patents
研磨パッド及び研磨方法 Download PDFInfo
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- WO2017013935A1 WO2017013935A1 PCT/JP2016/064775 JP2016064775W WO2017013935A1 WO 2017013935 A1 WO2017013935 A1 WO 2017013935A1 JP 2016064775 W JP2016064775 W JP 2016064775W WO 2017013935 A1 WO2017013935 A1 WO 2017013935A1
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- Prior art keywords
- polishing
- polishing pad
- acid
- polished
- fiber
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
- B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
- B32B5/12—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer characterised by the relative arrangement of fibres or filaments of different layers, e.g. the fibres or filaments being parallel or perpendicular to each other
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/245—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it being a foam layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2305/00—Condition, form or state of the layers or laminate
- B32B2305/22—Fibres of short length
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/72—Density
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
Definitions
- the present invention relates to a polishing pad and a polishing method.
- the present invention solves the problems of the prior art as described above, and in polishing of a polishing object having at least one of a convex part and a concave part on the surface, the vicinity of the convex part on the surface of the polishing object and It is an object of the present invention to provide a polishing pad and a polishing method capable of sufficiently polishing the inner surface of the recess.
- a polishing pad is used for polishing an object to be polished that contains a metal, an alloy, or a metal oxide material and has at least one of a convex portion and a concave portion on the surface.
- the gist is that a plurality of fibers having a length of 2 mm or more have napped portions raised on the surface of the base, and the mass of the fibers is 250 g / m 2 or more.
- the gist of a polishing method is to polish an object to be polished using the polishing pad according to the above aspect.
- the present invention in polishing of a polishing object having at least one of a convex part and a concave part on the surface, it is possible to sufficiently polish the vicinity of the convex part and the inner surface of the concave part among the surface of the polishing object. .
- the polishing pad of this embodiment has a raised portion 1 in which a plurality of fibers 12 having a length L of 2 mm or more are raised on the surface of the base 11.
- the mass of the fiber 12 having a length L of 2 mm or more raised on the surface of the base 11 is 250 g / m 2 or more.
- polishing object 2 having a convex portion 21 on the surface as shown in FIG. 2, or polishing having a concave portion 22 on the surface as shown in FIG.
- polishing pad since the deformability of the polishing pad is insufficient, the shape of the polishing pad cannot follow the shape of the convex part 21 and the concave part 22, and the vicinity of the convex part 21 on the surface of the polishing object 2 In other words, the polishing pad does not come into contact with the inner surface of the concave portion 22 (that is, the peripheral portion of the base end portion of the convex portion 21), and polishing may not be possible.
- the polishing object 2 having at least one of the convex portion 21 and the concave portion 22 on the surface is polished using the polishing pad of the present embodiment having the above-described configuration, the fiber 12 is deformed and the napped portion 1 is formed.
- the polishing pad also comes into contact with the vicinity of the convex portion 21 and the inner surface of the concave portion 22 on the surface of the polishing object 2, so that it can be sufficiently polished. is there.
- the suede does not have a raised portion, and a foamed polyurethane layer having a large number of pores is provided on a substrate.
- the thickness of the polyurethane foam layer is usually 1 mm or less, and at most less than 2 mm.
- the length L of the fiber 12 is such that the convex portion 21 and the concave portion 22 can sufficiently polish the vicinity of the convex portion 21 and the inner surface of the concave portion 22 in the surface of the polishing object 2. Can be selected according to the shape and size. If the length L of the fiber 12 is 2 mm or more (more preferably 10 mm or more), the polishing pad is sufficiently deformable, so that it follows the convex portions 21 and concave portions 22 of various shapes and sizes. Thus, the polishing pad is deformed, and the portion near the convex portion 21 and the inner surface of the concave portion 22 in the surface of the polishing object 2 can be sufficiently polished.
- the length L of the fiber 12 is selected depending on the height of the convex portion 21 and the depth of the concave portion 22. For example, if the height of the convex portion 21 and the depth of the concave portion 22 are as large as 1 mm or more, the fiber length L is 5 It is preferable that the length is as long as .5 mm or more, and the length L of the fiber may be as short as 3 mm or more as long as the height of the convex portion 21 and the depth of the concave portion 22 are as small as 0.5 mm or less. Regarding the length of the fibers raised on the surface of the base portion 11, all the fibers may have the same length, but fibers having different lengths may be mixed.
- the fibers raised on the surface of the base 11 may be only the fibers 12 having a length L of 2 mm or more, but both the fibers 12 having a length L of 2 mm or more and the fibers having a length L of less than 2 mm. There may be.
- the mass of the fiber 12 having a length L of 2 mm or more raised on the surface of the base 11 is 250 g / m 2 or more, the amount of the long fiber 12 is sufficient, so Of these, the vicinity of the convex portion 21 and the inner surface of the concave portion 22 can be sufficiently polished.
- the mass of the fiber 12 having a length L of 2 mm or more that is raised on the surface of the base 11 is preferably 500 g / m 2 or more, and more preferably 800 g / m 2 or more.
- the number of fibers 12 having a length L of 2 mm or more raised on the surface of the base 11 may be 1000 / cm 2 or more. Since the amount (density) of the long fibers 12 is sufficient when the number of the fibers 12 having a length L of 2 mm or more that is raised on the surface of the base 11 is 1000 / cm 2 or more, the amount of the long fibers 12 is sufficient. Of the surface, the vicinity of the convex portion 21 and the inner surface of the concave portion 22 can be sufficiently polished. In addition, the number of the fibers 12 having a length L of 2 mm or more raised on the surface of the base 11 is preferably 2000 / cm 2 or more, more preferably 4000 / cm 2 or more, and 5000.
- the fibers 12 may be attached to the base 11 individually one by one, or a plurality of fibers 12 are bundled to form a bundle, or a plurality of strands are twisted to form a string, and this bundle or string May be attached to the base 11. If multiple fibers are twisted together, the strength increases, so the polishing speed improves. If the fibers are not twisted, the number of times the fibers come into contact with the object to be polished increases. May increase. When attaching a bundle or a string-like object to the base 11, the number of the fibers 12 means not the number of the bundles and the string-like substances but the number of the fibers 12.
- the length L of the fibers 12 raised on the surface of the base portion 11 may be 5.5 times or more the height of the convex portion 21 or the depth of the concave portion 22.
- the length of the fibers 12 raised on the surface of the base portion 11 is sufficiently large with respect to the height of the convex portion 21 or the depth of the concave portion 22. Deformability becomes higher. Therefore, the polishing pad is sufficiently deformed following the convex portion 21 and the concave portion 22, and the portion near the convex portion 21 and the inner surface of the concave portion 22 can be more sufficiently polished among the surface of the polishing object 2.
- the length L of the fibers 12 raised on the surface of the base 11 is more preferably 7 times or more the height of the convex portion 21 or the depth of the concave portion 22.
- the material of the base 11 is not particularly limited, and a cloth such as a nonwoven fabric, a natural material such as hemp, a resin such as rubber, or the like can be used.
- the type of the fiber 12 is not particularly limited, and natural fibers such as wool, silk, hemp, cotton, horse hair, pig hair, goat hair, vera hair, pakin, palm, and fern, and polyester (polyethylene terephthalate).
- the synthetic fibers are more preferable than the natural fibers, and thus the synthetic fibers are preferable.
- nylon, polyester, and polypropylene are more preferable. preferable.
- the fiber 12 is within the range that does not impair the object of the present invention. 1 type or more chosen from inorganic fine particles, abrasive grains, and resin may be contained.
- the thickness and shape of the fiber 12 are not particularly limited, the thickness of the fiber 12 is preferably 200 ⁇ m or less, and more preferably 100 ⁇ m or less. In addition to the fact that the finer fibers 12 are less likely to damage the object 2 to be polished, it is easier to follow the shape of the convex portions 21 and the concave portions 22 of the target object 2. Further, the thickness of the fiber 12 is preferably 10 ⁇ m or more, more preferably 15 ⁇ m or more, and further preferably 20 ⁇ m or more. If the fiber 12 is too thin, the polishing force becomes weak, and a sufficient polishing rate may not be obtained.
- the thicker fibers 12 are more resistant to abrasion and less likely to wear, and the life as an abrasive cloth may be prolonged.
- the thickness of the fiber 12 may be uniform over the entire length direction of the fiber 12, but may not be uniform.
- the fiber 12 may have a different thickness at the base and the tip, such as a thin tip, a thick tip, or a round tip.
- the fiber which carried out the linear form the fiber which makes a wave shape
- the loop-shaped fiber The part which bent one fiber and was formed in the substantially elliptical shape or the substantially inverted U shape, and curved at the acute angle. Or the like attached to the base 11 so that the tip becomes the tip.
- the polishing speed is high when the corner is formed at the tip, and the object to be polished is scratched when the tip is round. Hateful. Since the loop-shaped fiber has a round tip, it is difficult to damage the object to be polished.
- a fiber extending in a straight line and a fiber having a corrugated shape are preferable to a fiber having a straight shape, and a fiber having a straight shape or a corrugated shape, and the tip of the fiber is not twisted and has a tuft shape. More preferably, the shape is unraveled. Since the loop-shaped fibers are in line contact with the object to be polished, the contact area is wide and the polishing rate may be improved. In addition, since the loop-like fiber has cushioning properties due to its shape, the fiber may not fall easily. However, since the loop-shaped fiber has high friction, the surface roughness of the polished object after polishing may be deteriorated as compared with a fiber extending in a straight line or a fiber having a wave shape.
- the cross-sectional shape of the fiber 12 is not particularly limited, and is circular, elliptical, polygonal (triangle, quadrangle, pentagon, hexagon, etc.), flat (linear), hollow (the number of hollow portions is particularly large) It is not limited and may be one or more).
- the cross-sectional shape of the fiber 12 is C-shaped, H-shaped, I-shaped, L-shaped, N-shaped, S-shaped, T-shaped, U-shaped, V-shaped, W-shaped, X
- a letter shape, a Y shape, a star shape (the number of sides of the star shape may be any number as long as it is three or more), and the like may be used.
- the cross-sectional shape of the fiber 12 may be a shape in which the fin portion extends radially from the outer periphery of a circular or polygonal core portion (may be hollow) or a shape in which the fin portion extends radially from the center point.
- the number of fin portions is not particularly limited, and may be one or more.
- the shape of the fin portion is not particularly limited, and examples thereof include a straight line shape, a curved line shape, a bent line shape, and a branched line shape.
- the cross-sectional shape of the fiber 12 may be a shape in which a plurality of (for example, two or three) unit portions are combined (that is, a shape divided into a plurality of portions).
- the plurality of unit portions may all have the same cross-sectional shape or may have different cross-sectional shapes.
- the cross-sectional shape of the unit portion is not particularly limited, and the cross-sectional shapes listed above can be adopted as the cross-sectional shape of the fiber 12.
- the cross-sectional shape of the fiber 12 may be a shape in which a plurality of unit parts such as a C shape, a V shape, a Y shape, and a Z shape are combined.
- the same shape may be sufficient as the front-end
- the surface of the fiber 12 may be flat or may have irregularities.
- the fibers 12 may be individually attached to the base 11 one by one, or a plurality of fibers 12 may be bundled to form a bundle, or a plurality of strands may be twisted to form a string, and this bundle or string May be attached to the base 11.
- a carpet can be used.
- the type of carpet is not particularly limited, and carpets manufactured using methods such as woven fabric, embroidery, adhesion, knitting, compression, and flocking can be used.
- carpets made of woven fabric include machine-woven carpets such as tufted carpet, Wilson weave, jacquard weave, and Akisminster carpet, and hand-woven carpets such as China Unicom and Pakistan carpet.
- Examples of carpets manufactured by embroidery include hook drags.
- Examples of the carpet manufactured by bonding include a bonded carpet.
- Examples of the carpet manufactured by knitting include a knitted carpet.
- Examples of the carpet manufactured by compression include a needle punch carpet.
- carpets manufactured by flocking include electrostatic flocking carpets.
- the polishing pad of the present embodiment a material in which fibers are implanted in a base (base) like a brush can be used.
- the method of flocking is not particularly limited, but a hole is formed in the pedestal, one end of the fiber is inserted into the hole, and it is fixed with a metal or resin pin, or bonded with heat or an adhesive. You may fix by.
- the polishing pad of the present embodiment may have a multilayer structure in which an elastic layer made of an elastic body is provided on the side opposite to the side where the fibers 12 of the base 11 are raised. Referring to FIG.
- an elastic layer (not shown) made of an elastic body is formed on a main surface opposite to a main surface on which fibers 12 are raised among two main surfaces of a sheet-like base 11. ) May be laminated.
- Examples of elastic bodies include resins such as polyurethane, polyvinyl chloride, chloroprene rubber, ethylene / propylene rubber, butyl rubber, polybutadiene, polyisoprene, EPDM polymer, ethylene-vinyl acetate, neoprene, melamine, polyethylene, styrene / butadiene copolymer, etc. And a sponge made of a resin foam obtained by foaming the above. The number of cells of the sponge, the compression ratio to the original thickness, the shape, and the density of the resin before foaming are not particularly limited, and may be appropriately selected according to the use of the polishing pad.
- the elastic layer may be composed of a single sponge, or may be configured in combination with other materials such as a cushioning material and a reinforcing material as necessary.
- the thickness of the elastic layer is not particularly limited, but is preferably 0.1 mm or more, and more preferably 1 mm or more. If the elastic layer is thin, sufficient cushioning properties may not be exhibited.
- the thickness of the elastic layer is preferably 20 mm or less, and more preferably 15 mm or less. If the elastic layer is thick, it may be difficult to attach the polishing pad to the polishing apparatus. In addition, heat generated during polishing is stored, and the polishing temperature may become too high.
- the thickness of the elastic layer may be changed according to the height and size of the unevenness of the object to be polished, and the thickness of the elastic layer can be outside the numerical range shown above. Further, the fiber 12 may be subjected to the following treatment on its surface after being attached to the base 11.
- the surface of the fiber 12 may be subjected to steam treatment, shearing, mercerization, coating, softening treatment, splitting treatment, raising treatment, and the like. By performing these treatments, a specific function is imparted to the fiber 12, the surface of the fiber 12 is made uniform, the surface of the fiber 12 is smoothed, the fiber 12 is softened, It is compressed.
- polishing object 2 The shape of the convex part 21 and the recessed part 22 which are formed in the surface of the grinding
- polishing object 2 is not specifically limited, If the polishing pad of this embodiment is used, it will be a convex part of various shapes. The vicinity of 21 and the inner surface of the recess 22 can be sufficiently polished.
- Examples of the shape of the convex portion 21 and the concave portion 22 include a cone shape, a truncated cone shape, a columnar shape, a pyramid shape, a truncated pyramid shape, a prismatic shape, a spherical shape, a hemispherical shape, a needle shape, and an indefinite shape.
- the size of the convex portion 21 and the concave portion 22 formed on the surface of the polishing object 2 is not particularly limited, and if the polishing pad of the present embodiment is used, the vicinity of the convex portion 21 of various sizes is used.
- the portion and the inner surface of the recess 22 can be sufficiently polished.
- the projected area of the convex portion 21 or the concave portion 22 in the vertical projection view when the convex portion 21 or the concave portion 22 is viewed from the viewpoint of a position perpendicular to the surface of the polishing object 2 is 0.1 cm 2 or more. Even if it is the convex part 21 or the recessed part 22 of such a magnitude
- the convex part and recessed part in this invention are limited to a thing with said projection area smaller than the polishing pad used for grinding
- the height of the convex portion 21 formed on the surface of the polishing object 2 and the depth of the concave portion 22 are not particularly limited. If the polishing pad of this embodiment is used, the convex portion 21 having various heights is used. And the inner surface of the recess 22 having various depths can be sufficiently polished.
- the height of the convex portion 21 and the depth of the concave portion 22 may be 0.1 mm or more, 0.5 mm or more, or 1 mm or more.
- the polishing pad of this embodiment is particularly suitable when the height of the convex portion 21 or the depth of the concave portion 22 is 0.5 mm or more.
- the polishing pad of this embodiment is used, even if it is the grinding
- the vicinity of the convex portion 21 and the inner surface of the concave portion 22 can be sufficiently polished.
- the polishing pad of the present embodiment can also be suitably used for polishing a polishing object (a polishing object whose entire surface is flat) that does not have convex portions and concave portions on the surface.
- the material of the object to be polished is not particularly limited, and examples thereof include simple silicon, silicon compounds, metals, alloys, metal oxides, single crystal compounds (for example, sapphire, gallium nitride), and glass.
- Examples of the single silicon include single crystal silicon, polycrystalline silicon (polysilicon), and amorphous silicon.
- Examples of the silicon compound include silicon nitride, silicon dioxide (for example, a silicon dioxide interlayer insulating film formed using tetraethoxysilane (TEOS)), silicon carbide, and the like.
- the metal examples include tungsten, copper, aluminum, hafnium, cobalt, nickel, titanium, tantalum, gold, silver, platinum, palladium, rhodium, ruthenium, iridium, osmium, iron, chromium, and magnesium. These metals may be included in the form of an alloy (for example, stainless steel) or a metal compound.
- the alloy material is given a name based on the metal species as the main component.
- the main component of the metal or alloy material include aluminum, titanium, iron, nickel, and copper.
- the alloy material include aluminum alloy, titanium alloy, stainless steel (mainly iron), nickel alloy, and copper alloy.
- the aluminum alloy contains aluminum as a main component and further contains at least one of silicon, iron, copper, manganese, magnesium, zinc, and chromium as a metal species different from the main metal species.
- species other than aluminum in aluminum alloy is 0.1 mass% or more, for example, More preferably, it is 0.1 mass% or more and 10 mass% or less.
- Examples of aluminum alloys include alloy numbers 2000 series, 3000 series, 4000 series, 5000 series, 6000 series, 7000 series described in Japanese Industrial Standards (JIS) H4000: 2006, H4040: 2006, and H4100: 2006. 8000 series.
- Titanium alloys contain titanium as a main component and contain, for example, aluminum, iron, vanadium, etc. as elements having Vickers hardness that is significantly different from the metal species as the main component.
- the titanium alloy preferably contains 3.5 to 30% by mass of an element having a Vickers hardness greatly different from that of the metal species as a main component with respect to titanium.
- 11 to 23 types, 50 types, 60 types, 61 types, 80 types and the like are known in the types according to JIS H4600: 2012.
- Stainless steel contains iron as a main component and contains, for example, chromium, nickel, molybdenum, manganese, and the like as elements having Vickers hardness that is significantly different from the metal species as the main component.
- the stainless steel preferably contains 10 to 50% by mass of an element having a Vickers hardness that is significantly different from that of the main metal species.
- Examples of such stainless steel include SUS201, 303, 303Se, 304, 304L, 304NI, 305, 305JI, 309S, 310S, 316, 316L, 321, 347, 384, JIS G4303: 2005.
- XM7, 303F, 303C, 430, 430F, 434, 410, 416, 420J1, 420J2, 420F, 420C, 631J1, etc. are known.
- Nickel alloys contain nickel as a main component and contain, for example, iron, chromium, molybdenum, cobalt, etc. as elements having Vickers hardness that is significantly different from the metal species as the main component.
- the nickel alloy preferably contains 20 to 75% by mass of an element having a Vickers hardness greatly different from that of the metal species as a main component with respect to nickel.
- a nickel alloy for example, NCF600, 601, 625, 750, 800, 800H, 825, NW0276, 4400, 6002, 6022, etc. are known in the alloy number according to JIS H4551: 2000.
- the copper alloy contains copper as a main component and contains, for example, iron, lead, zinc, tin, etc. as elements having Vickers hardness that is significantly different from the metal species as the main component.
- the copper alloy preferably contains 3 to 50% by mass of an element having a Vickers hardness greatly different from that of the metal species as the main component.
- a copper alloy for example, in the alloy number according to JIS H3100: 2006, C2100, 2200, 2300, 2400, 2600, 2680, 2720, 2801, 3560, 3561, 3710, 3713, 4250, 4430, 4621, 4640, 6140, 6161, 6280, 6301, 7060, 7150, 1401, 2051, 6711, 6712 and the like are known.
- the magnesium alloy contains magnesium as a main component and further contains at least one of aluminum, zinc, manganese, zirconium, and rare earth elements as a metal species different from the metal species of the main component.
- species other than magnesium in a magnesium alloy is 0.3 mass% or more and 10 mass% or less, for example.
- Examples of magnesium alloys include alloy numbers AZ10, 31, 61, 63, 80, 81, 91, and 92 described in Japanese Industrial Standard (JIS) H4201: 2011, H4203: 2011, and H4204: 2011. can give.
- the metal oxide is a metal or semi-metal oxide or a composite oxide thereof, for example, one or more metals or semi-metals selected from the elements of Group 3, Group 4, and Group 13 of the periodic table.
- metal oxides and composite oxides thereof include silicon oxide (silica), aluminum oxide (alumina), titanium oxide (titania), zirconium oxide (zirconia), gallium oxide, yttrium oxide (yttria), germanium oxide, and composite oxides thereof. It is done.
- silicon oxide, aluminum oxide (corundum, etc.), zirconium oxide, and yttrium oxide are particularly preferable.
- the metal oxide contained in the object to be polished may be a mixture of a plurality of metals or metalloid oxides, a mixture of a plurality of complex oxides, or a metal or metalloid. It may be a mixture of an oxide and a complex oxide. Further, the metal oxide contained in the object to be polished may be a composite material of a metal or metalloid oxide or composite oxide and other types of materials (for example, metal, carbon, ceramic).
- the metal oxide contained in the object to be polished may be in the form of single crystal, polycrystal, sintered body (ceramic) or the like.
- the entire polishing object can be made of a metal oxide.
- the metal oxide contained in the object to be polished may be in the form of an anodized film formed by anodizing a pure metal or alloy. That is, the metal oxide contained in the object to be polished may be an oxide formed on the surface of the metal and oxidized by the metal itself, such as an anodized film of pure metal or alloy.
- the polishing object can be made of a part of the metal oxide and the other part of another material.
- the object to be polished includes a part including the surface thereof made of a metal oxide, and the other part made of a pure metal or an alloy.
- the anodized film include a film made of aluminum oxide, titanium oxide, magnesium oxide, or zirconium oxide.
- spraying for example, plasma spraying, flame spraying
- plating for example, chemical vapor deposition (CVD), physical vapor deposition (PVD) on the surface of a base material of a material different from metal oxide (for example, metal, carbon, ceramic).
- the object to be polished may be formed by forming a film by a film treatment such as).
- Examples of the coating formed by thermal spraying include a metal oxide coating made of aluminum oxide, zirconium oxide, or yttrium oxide.
- Examples of the film formed by plating include a metal film made of zinc, nickel, chromium, tin, copper, or an alloy thereof.
- Examples of the film formed by chemical vapor deposition include a ceramic film made of silicon oxide, aluminum oxide, or silicon nitride.
- Examples of the film formed by physical vapor deposition include a metal film composed of copper, chromium, titanium, a copper alloy, a nickel alloy, or an iron alloy.
- polishing of the polishing object using the polishing pad of this embodiment can be performed by a polishing apparatus and polishing conditions used for normal polishing. For example, as shown in FIG. 3, when the surface of the polishing object 2 on which the convex portion 21 is formed is pressed against the napped portion 1 of the polishing pad, the fiber 12 is deformed and a part of the napped portion 1 is dented, and the convex portion. In order to follow the shape of 21, the polishing pad (fiber 12) also contacts the vicinity of the convex portion 21 on the surface of the polishing object 2.
- the polishing object 2 and the polishing pad are relatively moved and rubbed in this state, the entire surface of the polishing object 2 including the vicinity of the convex portion 21 is polished. Further, as shown in FIG. 5, when the surface of the polishing object 2 on which the concave portion 22 is formed is pressed against the napped portion 1 of the polishing pad, the fiber 12 is deformed, and a portion of the raised portion 1 is depressed, In order to follow the shape, the polishing pad (fiber 12) also contacts the inner surface of the recess 22 in the surface of the polishing object 2. Therefore, when the polishing object 2 and the polishing pad are relatively moved and rubbed in this state, the entire surface of the polishing object 2 including the inner surface of the recess 22 is polished.
- a polishing composition containing abrasive grains, additives, liquid medium, etc. is interposed between the polishing object 2 and the polishing pad. And polishing may be performed.
- the type of abrasive grains is not particularly limited, and aluminum oxide, silicon oxide, cerium oxide, zirconium oxide, zircon, titanium oxide, manganese oxide, silicon carbide, boron carbide, titanium carbide, titanium nitride, silicon nitride, boride Examples thereof include titanium and tungsten boride.
- aluminum oxide, zirconium oxide, zircon (zircon sand), silicon carbide, and silicon oxide are preferable from the viewpoint of availability and cost, and aluminum oxide and silicon oxide are particularly preferable.
- the average secondary particle diameter of the abrasive grains is preferably 10 ⁇ m or less, more preferably 5 ⁇ m or less, further preferably 3 ⁇ m or less, and particularly preferably 1 ⁇ m or less.
- the average secondary particle diameter of the abrasive grains can be measured by, for example, a dynamic light scattering method, a laser diffraction method, a laser scattering method, a pore electrical resistance method, or the like.
- the surface roughness Ra of the object to be polished using the above abrasive grains is, for example, 50 nm or less when using alumina abrasive grains, and 20 nm or less when using silica abrasive grains. .
- the surface roughness Ra can be measured using a stylus type or laser type measuring machine.
- the concentration of the abrasive grains in the polishing composition is preferably 45% by mass or less, and more preferably 25% by mass or less. The lower the abrasive concentration, the better the dispersibility and the lower the cost. Further, the concentration of the abrasive grains in the polishing composition is preferably 2% by mass or more, and more preferably 10% by mass or more. The higher the abrasive concentration, the higher the polishing rate.
- the type of additive is not particularly limited.
- a pH adjuster for example, a pH adjuster, a complexing agent, an etching agent, an oxidizing agent, a water-soluble polymer, an anticorrosive, a chelating agent, a dispersion aid, a preservative,
- An additive such as a glaze may be added to the polishing composition as desired.
- These various additives are known in many patent documents and the like as those that can be usually added to the polishing composition, and the type and amount of the additive are not particularly limited. However, the addition amount in the case of adding these additives is preferably less than 1% by mass and more preferably less than 0.5% by mass with respect to the entire polishing composition. These additives may be used individually by 1 type, and may use 2 or more types together.
- pH of polishing composition Although there is no restriction
- the pH can be controlled by an acid or a salt thereof which is one component of the polishing composition, but can also be controlled by using other known acids, bases or salts thereof.
- PH adjuster As the pH adjuster, known acids, bases, or salts thereof can be used.
- the acid that can be used as the pH adjuster include inorganic acids and organic acids.
- the inorganic acid include hydrochloric acid, sulfuric acid, nitric acid, hydrofluoric acid, boric acid, carbonic acid, hypophosphorous acid, phosphorous acid, and phosphoric acid.
- organic acids include formic acid, acetic acid, propionic acid, butyric acid, valeric acid, 2-methylbutyric acid, n-hexanoic acid, 3,3-dimethylbutyric acid, 2-ethylbutyric acid, 4-methylpentanoic acid, n -Heptanoic acid, 2-methylhexanoic acid, n-octanoic acid, 2-ethylhexanoic acid, benzoic acid, glycolic acid, salicylic acid, glyceric acid, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, Maleic acid, phthalic acid, malic acid, tartaric acid, citric acid, lactic acid, diglycolic acid, 2-furancarboxylic acid, 2,5-furandicarboxylic acid, 3-furancarboxylic acid, 2-tetrahydrofurancarboxylic acid, methoxyacetic acid,
- Bases that can be used as pH adjusters include amines such as aliphatic amines and aromatic amines, organic bases such as quaternary ammonium hydroxide, alkali metal hydroxides such as potassium hydroxide, and hydroxides of alkaline earth metals. And ammonia and the like.
- a salt such as an ammonium salt or an alkali metal salt of the acid may be used as a pH adjuster in place of the acid or in combination with the acid.
- a pH buffering action can be expected.
- the addition amount of the pH adjuster is not particularly limited, and may be appropriately adjusted so that the polishing composition has a desired pH.
- complexing agent examples include inorganic acids, organic acids, amino acids, nitrile compounds, and chelating agents.
- Specific examples of the inorganic acid include sulfuric acid, nitric acid, boric acid, carbonic acid and the like.
- organic acids include formic acid, acetic acid, propionic acid, butyric acid, valeric acid, 2-methylbutyric acid, n-hexanoic acid, 3,3-dimethylbutyric acid, 2-ethylbutyric acid, 4-methylpentanoic acid, n- Heptanoic acid, 2-methylhexanoic acid, n-octanoic acid, 2-ethylhexanoic acid, benzoic acid, glycolic acid, salicylic acid, glyceric acid, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, malein Examples include acid, phthalic acid, malic acid, tartaric acid, citric acid, and lactic acid.
- Organic sulfuric acids such as methanesulfonic acid, ethanesulfonic acid, and isethionic acid can also be used.
- a salt such as an alkali metal salt of an inorganic acid or an organic acid may be used instead of the inorganic acid or the organic acid or in combination with the inorganic acid or the organic acid.
- these complexing agents glycine, alanine, malic acid, tartaric acid, citric acid, glycolic acid, isethionic acid, or salts thereof are preferable.
- chelating agents include carboxylic acid chelating agents such as gluconic acid, amine chelating agents such as ethylenediamine, diethylenetriamine, trimethyltetraamine, ethylenediaminetetraacetic acid, nitrilotriacetic acid, hydroxyethylethylenediaminetriacetic acid, triethylenetetramine. And polyaminopolycarboxylic acid chelating agents such as hexaacetic acid and diethylenetriaminepentaacetic acid.
- carboxylic acid chelating agents such as gluconic acid
- amine chelating agents such as ethylenediamine, diethylenetriamine, trimethyltetraamine, ethylenediaminetetraacetic acid, nitrilotriacetic acid, hydroxyethylethylenediaminetriacetic acid, triethylenetetramine.
- polyaminopolycarboxylic acid chelating agents such as hexaacetic acid and diethylenetriaminepentaace
- etching agent An etching agent that promotes dissolution of an object to be polished (for example, an alloy material) may be further added to the polishing composition as necessary.
- etchants include inorganic acids such as nitric acid, sulfuric acid, phosphoric acid, organic acids such as acetic acid, citric acid, tartaric acid, methanesulfonic acid, inorganic alkalis such as potassium hydroxide and sodium hydroxide, ammonia, Examples thereof include organic alkalis such as amines and quaternary ammonium hydroxides.
- an oxidizing agent that oxidizes the surface of the object to be polished may be further added to the polishing composition.
- the oxidizing agent include hydrogen peroxide, peracetic acid, percarbonate, urea peroxide, perchlorate, persulfate, nitric acid, potassium permanganate and the like.
- water-soluble polymer examples include polycarboxylic acids such as polyacrylic acid, polysulfonic acids such as polyphosphonic acid and polystyrene sulfonic acid, polysaccharides such as chitansan gum and sodium alginate, cellulose derivatives such as hydroxyethyl cellulose and carboxymethyl cellulose, polyethylene glycol , Polyvinyl alcohol, polyvinyl pyrrolidone, polyoxyethylene alkyl ether, polyoxyethylene alkyl phenyl ether, sorbitan monooleate, and oxyalkylene polymers having a single kind or plural kinds of oxyalkylene units.
- the salt of said compound can also be used suitably as a water-soluble polymer.
- an anticorrosive agent that suppresses the corrosion of the surface of the object to be polished may be further added to the polishing composition.
- the anticorrosive include amines, pyridines, tetraphenylphosphonium salts, benzotriazoles, triazoles, tetrazoles, benzoic acid and the like.
- a dispersion aid that facilitates redispersion of the aggregate of abrasive grains may be added to the polishing composition.
- the dispersion aid include condensed phosphates such as pyrophosphate and hexametaphosphate.
- surfactant examples include nonionic surfactants, anionic surfactants, cationic surfactants, and amphoteric surfactants.
- Nonionic surfactants include ether types, ether ester types, ester types, and nitrogen-containing types.
- Anionic surfactants include carboxylates, sulfonates, sulfate esters, and phosphate ester salts. can give.
- Examples of cationic surfactants include aliphatic amine salts, aliphatic quaternary ammonium salts, benzalkonium chloride salts, benzethonium chloride, pyridinium salts, and imidazolinium salts
- amphoteric surfactants include carboxy surfactants. Examples include betaine type, aminocarboxylate, imidazolinium betaine, lecithin, and alkylamine oxide.
- An antiseptic and an antifungal agent may be further added to the polishing composition as necessary.
- preservatives include sodium hypochlorite and the like.
- antifungal agents include oxazolines such as oxazolidine-2,5-dione.
- the polishing composition contains a liquid medium as a dispersion medium or solvent for dispersing or dissolving each component.
- the type of the liquid medium is not particularly limited, and examples thereof include water and organic solvents.
- the liquid medium may be used alone or in combination of two or more, but preferably contains water. From the viewpoint of suppressing the inhibition of the action of other components, water containing as little impurities as possible is preferable. Specifically, after removing impurity ions with an ion exchange resin, pure water from which foreign matters are removed through a filter is used. Water, ultrapure water, or distilled water is preferred.
- polishing using a general polishing pad made of suede, nonwoven fabric, polyurethane, or the like may be performed.
- preliminary polishing may be performed in the previous process
- final polishing may be performed in the subsequent process.
- the polishing method of the present embodiment is more suitable for a method in which the surface plate is on the lower side and the object to be polished is on the upper side, and polishing is performed while continuously supplying the aqueous polishing composition. . From the viewpoint of productivity, it is desirable that a plurality of objects to be polished can be polished by one polishing.
- the surface plate diameter to which the polishing pad is attached is preferably 300 mm or more, and more preferably 600 mm or more. Furthermore, a single-side polishing apparatus, a double-side polishing apparatus, or the like can be used for polishing an object to be polished using the polishing pad of this embodiment.
- the single-side polishing apparatus includes a holder that holds an object to be polished, one surface plate on which a polishing pad is mounted, and a rotation mechanism that rotates the holder and the surface plate. Further, the size of the polishing pad and the surface plate is larger than that of the object to be polished. Then, holding the polishing object in the holder, mounting the polishing pad of the present embodiment on the surface plate, and rotating the holder and the surface plate by the rotation mechanism, the polishing object is brought into contact with the polishing pad, Of the plurality of surfaces of the object to be polished, only the surface facing the polishing pad can be polished.
- Polishing of an object to be polished using the polishing pad of this embodiment can be performed using not only a single-side polishing apparatus but also a double-side polishing apparatus, a hand polisher, a polishing tape, etc., from the viewpoint of productivity, single-side polishing. It is preferable to use an apparatus or a double-side polishing apparatus.
- Examples will be shown below, and the present invention will be described more specifically with reference to Table 1.
- a polishing object having a convex portion on the surface was polished.
- Examples 1 and 2 are examples in which a carpet is used as a polishing pad, in which polyester fibers have napped portions raised on the surface of the base.
- the thickness (diameter), length, mass, and number of fibers are as shown in Table 1.
- Example 3 is an example in which a carpet is used as a polishing pad, and a wool fiber has a raised portion that is raised on the surface of the base portion.
- the thickness, length, mass, and number of fibers are as shown in Table 1.
- Example 4 is an example in which a carpet is used as a polishing pad, and two kinds of wool fibers have a raised portion that is raised on the surface of the base portion. That is, one wool fiber is a linearly extending fiber, and the other wool fiber is a loop-like fiber.
- the thickness, length, mass, and number of fibers are as shown in Table 1.
- Example 5 is an example in which a carpet is used as a polishing pad, and an acrylic fiber has a raised portion that is raised on the surface of the base portion.
- the thickness, length, mass, and number of fibers are as shown in Table 1.
- Example 6 is an example in which a carpet is used as a polishing pad, and a nylon fiber has a raised portion that is raised on the surface of the base portion.
- the thickness, length, mass, and number of fibers are as shown in Table 1.
- Examples 7 to 9 and Examples 11 to 13 are examples in which a carpet is used as a polishing pad, and two main surfaces of a sheet-like base portion having a raised portion in which polyester fibers are raised on the surface of the base portion.
- an elastic layer made of polyurethane foam is laminated on the main surface opposite to the main surface on the side where the fibers are raised.
- the thickness, length, mass, number of fibers, and thickness of the elastic layer are as shown in Table 1.
- Example 10 is an example in which a carpet is used as a polishing pad, and a polyester fiber has a raised portion that is raised on the surface of the base portion.
- the thickness, length, mass, and number of fibers are as shown in Table 1.
- Example 14 is an example in which a carpet is used as a polishing pad. Nylon fibers have napped portions raised on the surface of the base portion, and the fibers on the side of the two main surfaces of the sheet-like base portion are raised. An elastic layer made of polyurethane foam is laminated on the main surface opposite to the main surface. The thickness, length, mass, number of fibers, and thickness of the elastic layer are as shown in Table 1.
- Example 15 is an example in which a carpet is used as a polishing pad, and a wool fiber has a raised portion that is raised on the surface of the base, and the fiber is raised on the two main surfaces of the sheet-like base. An elastic layer made of polyurethane foam is laminated on the main surface opposite to the main surface. The thickness, length, mass, number of fibers, and thickness of the elastic layer are as shown in Table 1.
- Comparative Example 1 is an example using a general suede polishing pad.
- the length and mass of the fibers in Comparative Example 1 shown in Table 1 mean the thickness and mass of the suede foam polyurethane layer.
- Comparative Example 2 is an example in which a carpet is used as a polishing pad, and a polyester fiber has a raised portion that is raised on the surface of the base portion. The length, mass, and number of fibers are as shown in Table 1.
- the shape of the object to be polished is a plate shape having a length of 60 mm, a width of 60 mm, and a thickness of 10 mm, and the material thereof is an aluminum alloy having an alloy number of 7000.
- two substantially cylindrical convex portions having a diameter of 10 mm and a height of 1 mm are formed on the plate surface of the object to be polished.
- the two convex portions are respectively formed in the vicinity of two corner portions on the diagonal line among the four corner portions of the plate surface.
- the plate surface on the side where the projections of such an object to be polished were formed was polished using the polishing pads of Examples 1 to 15 and Comparative Examples 1 and 2, respectively.
- a slurry-like polishing composition was interposed between the object to be polished and the polishing pad.
- alumina powder having an average secondary particle size of 1.3 ⁇ m is dispersed in water, and citric acid is dissolved therein so as to have a concentration of 3.5 g / L.
- polishing conditions are as follows. (Polishing conditions) Polishing device: Single-side polishing device (surface plate diameter: 380 mm) Polishing load: 18.1 kPa (185 gf / cm 2 ) Surface plate rotation speed: 90 min -1 Polishing speed (linear speed): 71.5 m / min Polishing time: 10 minutes Supply speed of polishing composition: 40 mL / min
- the polishing rate was calculated from the mass difference before and after polishing of the object to be polished.
- the polishing rate is shown in Table 1. Further, the surface of the polishing object was visually observed to confirm whether or not there was a part that was not sufficiently polished on the surface of the polishing object. When there was a part that was not sufficiently polished in the vicinity of the convex part of the surface of the object to be polished, the distance between the sufficiently polished part and the base end of the convex part was measured. . And based on the following reference
- the distance between the sufficiently polished portion and the base end of the convex portion is 3 mm or more, it is evaluated that the followability of the polishing pad is poor. Indicated. Further, when the distance was 2 mm or more and less than 3 mm, it was evaluated that the followability of the polishing pad was good. Furthermore, when the same distance was 0.5 mm or more and less than 2 mm, it was evaluated that the followability of the polishing pad was better. Furthermore, when the distance was less than 0.5 mm, it was evaluated that the followability of the polishing pad was particularly good.
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Abstract
Description
繊維が立毛した立毛部を有する布帛(例えば特許文献1を参照)を研磨パッドとして用いれば、立毛部は変形性が高いため、研磨対象物の表面のうち凸部の近傍部分にも立毛部が接触する可能性がある。しかしながら、特許文献1に開示の布帛を研磨パッドとして用いた研磨では、凸部の形状や大きさによっては、研磨対象物の表面のうち凸部の近傍部分を十分に研磨することができない場合があった。
表面に凹部を有する研磨対象物を研磨する場合も同様であり、スウェードで構成された従来の研磨パッドを用いた研磨や特許文献1に開示の布帛を研磨パッドとして用いた研磨では、凹部の内面まで十分に研磨することができない場合があった。
また、本発明の他の態様に係る研磨方法は、上記一態様に係る研磨パッドを用いて研磨対象物を研磨することを要旨とする。
図1に示すように、本実施形態の研磨パッドは、長さLが2mm以上の繊維12の複数が基部11の表面に立毛した立毛部1を有している。基部11の表面に立毛している長さLが2mm以上の繊維12の質量は、250g/m2以上である。
なお、スウェードは立毛部を有しておらず、多数のポアを有する発泡ポリウレタン層が基材上に設けられたものである。この発泡ポリウレタン層の厚さは、通常は1mm以下、大きくても2mm未満である。
(1)研磨パッドについて
繊維12の長さLは、研磨対象物2の表面のうち凸部21の近傍部分や凹部22の内面を十分に研磨することができるように、凸部21や凹部22の形状や大きさに応じて選択することができる。繊維12の長さLが2mm以上であれば(より好ましくは10mm以上であれば)、研磨パッドの変形性が十分となるため、種々の形状、大きさの凸部21や凹部22に追従して研磨パッドが変形し、研磨対象物2の表面のうち凸部21の近傍部分や凹部22の内面を十分に研磨することができる。
なお、基部11の表面に立毛している長さLが2mm以上の繊維12の本数は、2000本/cm2以上とすることが好ましく、4000本/cm2以上とすることがより好ましく、5000本/cm2以上とすることがさらに好ましい。また、繊維12は、1本1本別々に基部11に取り付けてもよいし、複数本を束ねて結束物とするか又は複数本を撚り合わせて紐状物とし、この結束物又は紐状物の複数を基部11に取り付けてもよい。複数本の繊維を撚り合わせると強度が増すため研磨速度が向上し、撚らないと繊維が研磨対象物に接触する回数が増すため、研磨後の研磨対象物の表面粗さが低減し光沢度が増す場合がある。結束物又は紐状物を基部11に取り付ける場合には、上記の繊維12の本数は、結束物、紐状物の数ではなく、繊維12の本数を意味する。
また、繊維12の種類は特に限定されるものではなく、ウール、絹、麻、木綿、馬毛、豚毛、ヤギ毛、ベラ毛、パキン、パーム、シダ等の天然繊維や、ポリエステル(ポリエチレンテレフタレート、ポリトリメチレンテレフタレート、ポリブチレンテレフタレート、ポリエチレンナフタレート、ポリブチレンナフタレート、ポリ乳酸等)、ポリアミド(ナイロン、アラミド等)、ポリイミド、ポリビニルアルコール、ポリオレフィン(ポリエチレン、超高分子量ポリエチレン、ポリエチレンマルチフィラメント、ポリプロピレン等)、ポリウレタン、ポリアクリレート、ポリパラフェニレンベンゾビスオキサゾール、ポリフェニレンサルファイド、フッ素樹脂(ポリフッ化ビニリデン等)等の合成繊維や、金属繊維、炭素繊維等を用いることができる。
さらには、繊維12の断面形状は、円形又は多角形のコア部(中空でもよい)の外周からフィン部が放射状に伸びた形状や、中心点からフィン部が放射状に伸びた形状でもよい。フィン部の数は特に限定されるものではなく、1個でもよいし複数でもよい。また、フィン部の形状は特に限定されるものではなく、直線状、曲線状、屈曲線状、分岐線状があげられる。
繊維12の先端の形状については、全ての繊維の先端が同一の形状であってもよいし、異なる先端形状を有する繊維が混在していてもよい。
さらに、繊維12の表面は、平坦状でもよいが凹凸を有していてもよい。
このような本実施形態の研磨パッドとして、カーペット(絨毯)を利用することができる。カーペットの種類は特に限定されるものではなく、織物、刺繍、接着、編み、圧縮、植毛等の方法を用いて製造されたものを利用することができる。織物で製造されたカーペットとしては、タフテッドカーペット、ウィルソン織り、ジャガード織り、アキスミンスターカーペット等の機械織りカーペットや、中国緞通、パキスタン絨毯等の手織りカーペットがあげられる。刺繍で製造されたカーペットとしてはフックドラグ等があげられる。接着で製造されたカーペットとしてはボンデッドカーペット等があげられる。編みで製造されたカーペットとしてはニットカーペット等があげられる。圧縮で製造されたカーペットとしてはニードルパンチカーペット等があげられる。植毛で製造されたカーペットとしては静電植毛カーペット等があげられる。
また、本実施形態の研磨パッドは、基部11の繊維12が立毛する側とは反対側に弾性体からなる弾性層を設けた多層構造を有していてもよい。図1を参照して説明すると、シート状の基部11が有する2つの主面のうち繊維12が立毛する側の主面とは反対側の主面に、弾性体からなる弾性層(図示せず)が積層されていてもよい。弾性層が設けられていることにより、研磨対象物2の凸部21や凹部22の形状に対する研磨パッドの追従性(変形性)が向上する。
スポンジのセル数、元厚に対する圧縮比、形状、発泡前の樹脂の密度は特に限定されるものではなく、研磨パッドの用途等に合わせて適宜選択すればよい。
弾性層は、スポンジ単体で構成してもよいし、必要に応じてクッション材や補強材等の他の素材と組み合わせて構成してもよい。
さらに、繊維12には、基部11に取り付けた後に、その表面に下記のような処理を施してもよい。すなわち、繊維12の表面に、蒸気処理、シャーリング、マーセライズ、コーティング、柔軟化処理、毛割処理、起毛処理等を施してもよい。これらの処理を施すことにより、繊維12に特定の機能が付与されたり、繊維12の表面が均一化されたり、繊維12の表面が平滑化されたり、繊維12が柔軟化されたり、繊維12が圧縮されたりする。
研磨対象物2の表面に形成される凸部21及び凹部22の形状は特に限定されるものではなく、本実施形態の研磨パッドを用いれば、種々の形状の凸部21の近傍部分や凹部22の内面を十分に研磨することができる。凸部21及び凹部22の形状の例としては、円錐状、円錐台状、円柱状、角錐状、角錐台状、角柱状、球状、半球状、針状、不定形状等があげられる。
なお、本発明における凸部及び凹部は、上記の投影面積が、研磨に使用される研磨パッドよりも小さいものに限定される。すなわち、研磨対象物の表面に形成されている大きなうねり形状や大きな波長の曲面は、上記の投影面積が研磨パッドよりも大きい場合があるので、本発明における凸部及び凹部には包含されないものとする。
単体シリコンとしては、例えば単結晶シリコン、多結晶シリコン(ポリシリコン)、アモルファスシリコン等があげられる。また、シリコン化合物としては、例えば窒化ケイ素、二酸化ケイ素(例えば、テトラエトキシシラン(TEOS)を用いて形成される二酸化ケイ素層間絶縁膜)、炭化ケイ素等があげられる。
合金材料は、主成分となる金属種に基づいて名称が付される。金属や合金材料の主成分としては、例えばアルミニウム、チタン、鉄、ニッケル、銅があげられる。合金材料としては、例えば、アルミニウム合金、チタン合金、ステンレス鋼(鉄を主成分とする)、ニッケル合金、銅合金があげられる。
なお、研磨対象物が含有する金属酸化物は、複数の金属又は半金属の酸化物の混合物であってもよいし、複数の複合酸化物の混合物であってもよいし、金属又は半金属の酸化物と複合酸化物との混合物であってもよい。また、研磨対象物が含有する金属酸化物は、金属若しくは半金属の酸化物又は複合酸化物と、それ以外の種類の材料(例えば金属、炭素、セラミック)との複合材料であってもよい。
陽極酸化皮膜の例としては、酸化アルミニウム、酸化チタン、酸化マグネシウム、又は酸化ジルコニウムで構成される皮膜があげられる。
また、金属酸化物とは異なる種類の材質(例えば金属、炭素、セラミック)の基材の表面に、溶射(例えばプラズマ溶射、フレーム溶射)、めっき、化学的蒸着(CVD)、物理的蒸着(PVD)等の皮膜処理によって皮膜を形成することにより、研磨対象物を構成してもよい。
めっきで形成される皮膜の例としては、亜鉛、ニッケル、クロム、錫、銅、又はその合金で構成される金属皮膜があげられる。
化学的蒸着で形成される皮膜の例としては、酸化ケイ素、酸化アルミニウム、又は窒化ケイ素で構成されるセラミック皮膜があげられる。
物理的蒸着で形成される皮膜の例としては、銅、クロム、チタン、銅合金、ニッケル合金、又は鉄合金で構成される金属皮膜があげられる。
本実施形態の研磨パッドを用いた研磨対象物の研磨は、通常の研磨に用いられる研磨装置や研磨条件により行うことができる。
例えば、図3に示すように、研磨対象物2の凸部21が形成された表面を研磨パッドの立毛部1に押し当てると、繊維12が変形して立毛部1の一部分が凹み、凸部21の形状に追従するため、研磨対象物2の表面のうち凸部21の近傍部分にも研磨パッド(繊維12)が接触する。よって、この状態で研磨対象物2と研磨パッドとを相対移動させて摩擦すると、凸部21の近傍部分を含む研磨対象物2の表面全体が研磨される。
また、図5に示すように、研磨対象物2の凹部22が形成された表面を研磨パッドの立毛部1に押し当てると、繊維12が変形して立毛部1の一部分が凹み、凹部22の形状に追従するため、研磨対象物2の表面のうち凹部22の内面にも研磨パッド(繊維12)が接触する。よって、この状態で研磨対象物2と研磨パッドとを相対移動させて摩擦すると、凹部22の内面を含む研磨対象物2の表面全体が研磨される。
砥粒の種類は特に限定されるものではなく、酸化アルミニウム、酸化ケイ素、酸化セリウム、酸化ジルコニウム、ジルコン、酸化チタン、酸化マンガン、炭化ケイ素、炭化ホウ素、炭化チタン、窒化チタン、窒化ケイ素、ホウ化チタン、ホウ化タングステン等があげられる。
これらの中でも、入手のしやすさとコストから、酸化アルミニウム、酸化ジルコニウム、ジルコン(ジルコンサンド)、炭化ケイ素、酸化ケイ素が好ましく、酸化アルミニウム、酸化ケイ素が特に好ましい。
また、限定はされないが、上記砥粒を用いて研磨された研磨対象物の表面粗さRaは、例えばアルミナ砥粒を用いた際は50nm以下、シリカ砥粒を用いた際は20nm以下になる。なお、表面粗さRaは、触針式やレーザー式の測定機を用いて測定することができる。
また、添加剤の種類は特に限定されるものではなく、例えば、pH調整剤、錯化剤、エッチング剤、酸化剤、水溶性高分子、防食剤、キレート剤、分散助剤、防腐剤、防黴剤等の添加剤を、所望により研磨用組成物に添加してもよい。
これらの各種添加剤は、研磨用組成物において通常添加できるものとして多くの特許文献等において公知であり、添加剤の種類及び添加量は特に限定されるものではない。ただし、これらの添加剤を添加する場合の添加量は、研磨用組成物全体に対して、それぞれ1質量%未満であることが好ましく、それぞれ0.5質量%未満であることがより好ましい。これらの添加剤は、1種を単独で用いてもよいし、2種以上を併用してもよい。
研磨用組成物のpHに特に制限はないが、酸性又はアルカリ性であることが好ましい。具体的には、酸性の場合はpH5以下が好ましく、pH3以下がより好ましい。アルカリ性の場合はpH8以上が好ましく、pH9.5以上がより好ましい。
pHは、研磨用組成物の一成分である酸又はその塩により制御することができるが、それ以外の公知の酸、塩基、又はそれらの塩を使用することによっても制御することができる。
pH調整剤として、公知の酸、塩基、又はそれらの塩を使用することができる。pH調整剤として使用できる酸としては、無機酸及び有機酸があげられる。無機酸としては、例えば、塩酸、硫酸、硝酸、フッ酸、ホウ酸、炭酸、次亜リン酸、亜リン酸、及びリン酸等があげられる。また、有機酸としては、例えば、ギ酸、酢酸、プロピオン酸、酪酸、吉草酸、2-メチル酪酸、n-ヘキサン酸、3,3-ジメチル酪酸、2-エチル酪酸、4-メチルペンタン酸、n-ヘプタン酸、2-メチルヘキサン酸、n-オクタン酸、2-エチルヘキサン酸、安息香酸、グリコール酸、サリチル酸、グリセリン酸、シュウ酸、マロン酸、コハク酸、グルタル酸、アジピン酸、ピメリン酸、マレイン酸、フタル酸、リンゴ酸、酒石酸、クエン酸、乳酸、ジグリコール酸、2-フランカルボン酸、2,5-フランジカルボン酸、3-フランカルボン酸、2-テトラヒドロフランカルボン酸、メトキシ酢酸、メトキシフェニル酢酸、及びフェノキシ酢酸等があげられる。
また、前記の酸の代わりに、又は前記の酸と組み合わせて、前記酸のアンモニウム塩やアルカリ金属塩等の塩をpH調整剤として用いてもよい。特に、弱酸と強塩基の塩、強酸と弱塩基の塩、又は弱酸と弱塩基の塩の場合には、pHの緩衝作用を期待することができ、さらに強酸と強塩基の塩の場合には、少量で、pHだけでなく電導度の調整が可能である。pH調整剤の添加量は特に限定されるものではなく、研磨用組成物が所望のpHとなるように適宜調整すればよい。
錯化剤の例としては、無機酸、有機酸、アミノ酸、ニトリル化合物、及びキレート剤等があげられる。無機酸の具体例としては、硫酸、硝酸、ホウ酸、炭酸等があげられる。有機酸の具体例としては、ギ酸、酢酸、プロピオン酸、酪酸、吉草酸、2-メチル酪酸、n-ヘキサン酸、3,3-ジメチル酪酸、2-エチル酪酸、4-メチルペンタン酸、n-ヘプタン酸、2-メチルヘキサン酸、n-オクタン酸、2-エチルヘキサン酸、安息香酸、グリコール酸、サリチル酸、グリセリン酸、シュウ酸、マロン酸、コハク酸、グルタル酸、アジピン酸、ピメリン酸、マレイン酸、フタル酸、リンゴ酸、酒石酸、クエン酸、乳酸等があげられる。メタンスルホン酸、エタンスルホン酸、及びイセチオン酸等の有機硫酸も使用可能である。無機酸又は有機酸の代わりに、あるいは、無機酸又は有機酸と組み合わせて、無機酸又は有機酸のアルカリ金属塩等の塩を用いてもよい。これらの錯化剤の中でもグリシン、アラニン、リンゴ酸、酒石酸、クエン酸、グリコール酸、イセチオン酸、又はそれらの塩が好ましい。
研磨用組成物には、必要に応じて、研磨対象物(例えば合金材料)の溶解を促進するエッチング剤をさらに添加してもよい。
エッチング剤の例としては、硝酸、硫酸、リン酸等の無機酸や、酢酸、クエン酸、酒石酸、メタンスルホン酸等の有機酸や、水酸化カリウム、水酸化ナトリウム等の無機アルカリや、アンモニア、アミン、第四級アンモニウム水酸化物等の有機アルカリ等があげられる。
研磨用組成物には、必要に応じて、研磨対象物(例えば合金材料)の表面を酸化させる酸化剤をさらに添加してもよい。
酸化剤の例としては、過酸化水素、過酢酸、過炭酸塩、過酸化尿素、過塩素酸塩、過硫酸塩、硝酸、過マンガン酸カリウム等があげられる。
水溶性高分子としては、例えば、ポリアクリル酸等のポリカルボン酸、ポリホスホン酸、ポリスチレンスルホン酸等のポリスルホン酸、キタンサンガム、アルギン酸ナトリウム等の多糖類、ヒドロキシエチルセルロース、カルボキシメチルセルロース等のセルロース誘導体、ポリエチレングリコール、ポリビニルアルコール、ポリビニルピロリドン、ポリオキシエチレンアルキルエーテル、ポリオキシエチレンアルキルフェニルエーテル、ソルビタンモノオレエート、単一種又は複数種のオキシアルキレン単位を有するオキシアルキレン系重合体等があげられる。また、上記の化合物の塩も水溶性高分子として好適に用いることができる。
研磨用組成物には、必要に応じて、研磨対象物(例えば合金材料)の表面の腐食を抑制する防食剤をさらに添加してもよい。
防食剤の例としては、アミン類、ピリジン類、テトラフェニルホスホニウム塩、ベンゾトリアゾール類、トリアゾール類、テトラゾール類、安息香酸等があげられる。
研磨用組成物には、必要に応じて、砥粒の凝集体の再分散を容易にする分散助剤をさらに添加してもよい。
分散助剤の例としては、ピロリン酸塩、ヘキサメタリン酸塩等の縮合リン酸塩等があげられる。
界面活性剤としては、ノニオン性界面活性剤、アニオン性界面活性剤、カチオン性界面活性剤、両性界面活性剤があげられる。ノニオン性界面活性剤としては、エーテル型、エーテルエステル型、エステル型、含窒素型があげられ、アニオン性界面活性剤としては、カルボン酸塩、スルホン酸塩、硫酸エステル塩、リン酸エステル塩があげられる。また、カチオン性界面活性剤としては、脂肪族アミン塩、脂肪族四級アンモニウム塩、塩化ベンザルコニウム塩、塩化ベンゼトニウム、ピリジニウム塩、イミダゾリニウム塩があげられ、両性界面活性剤としては、カルボキシベタイン型、アミノカルボン酸塩、イミダゾリニウムベタイン、レシチン、アルキルアミンオキサイドがあげられる。
研磨用組成物には、必要に応じて、防腐剤、防黴剤をさらに添加してもよい。
防腐剤の例としては、次亜塩素酸ナトリウム等があげられる。
防黴剤の例としては、オキサゾリジン-2,5-ジオン等のオキサゾリン等があげられる。
また、本実施形態の研磨方法は、定盤が下側にあり、研磨対象物は上側にあり、水系の研磨用組成物を連続的に供給しながら研磨する方法に対して、より適している。生産性の観点から、研磨対象物は1回の研磨で複数個研磨できることが望ましい。また、生産性の観点から、研磨パッドを貼り付ける定盤径は、300mm以上が好ましく、600mm以上がさらに好ましい。
さらに、本実施形態の研磨パッドを用いた研磨対象物の研磨には、片面研磨装置、両面研磨装置等を使用することができる。
以下に実施例を示し、表1を参照しながら本発明をさらに具体的に説明する。種々の研磨パッドを用いて、表面に凸部を有する研磨対象物の研磨を行った。
実施例1、2は、研磨パッドとしてカーペットを利用した例であり、ポリエステル製繊維が基部の表面に立毛した立毛部を有するものである。繊維の太さ(直径)、長さ、質量、本数は、表1に示す通りである。
実施例4は、研磨パッドとしてカーペットを利用した例であり、2種のウール製繊維が基部の表面に立毛した立毛部を有するものである。すなわち、一方のウール製繊維は直線状に延びた繊維であり、他方のウール製繊維はループ状の繊維である。繊維の太さ、長さ、質量、本数は、表1に示す通りである。
実施例6は、研磨パッドとしてカーペットを利用した例であり、ナイロン製繊維が基部の表面に立毛した立毛部を有するものである。繊維の太さ、長さ、質量、本数は、表1に示す通りである。
実施例10は、研磨パッドとしてカーペットを利用した例であり、ポリエステル製繊維が基部の表面に立毛した立毛部を有するものである。繊維の太さ、長さ、質量、本数は、表1に示す通りである。
実施例15は、研磨パッドとしてカーペットを利用した例であり、ウール製繊維が基部の表面に立毛した立毛部を有し、シート状の基部が有する2つの主面のうち繊維が立毛する側の主面とは反対側の主面に、発泡ポリウレタンからなる弾性層が積層されたものである。繊維の太さ、長さ、質量、本数と、弾性層の厚さは、表1に示す通りである。
比較例2は、研磨パッドとしてカーペットを利用した例であり、ポリエステル製繊維が基部の表面に立毛した立毛部を有するものである。繊維の長さ、質量、本数は、表1に示す通りである。
このような研磨対象物の凸部が形成されている側の板面を、実施例1~15及び比較例1、2の研磨パッドを用いてそれぞれ研磨した。研磨においては、研磨対象物と研磨パッドの間にスラリー状の研磨用組成物を介在させた。この研磨用組成物は、平均二次粒子径1.3μmのアルミナ粉末を水に分散させ、そこにクエン酸を濃度が3.5g/Lとなるように溶解させたものである。
(研磨条件)
研磨装置:片面研磨装置(定盤の直径:380mm)
研磨荷重:18.1kPa(185gf/cm2)
定盤の回転速度:90min-1
研磨速度(線速度):71.5m/分
研磨時間:10分間
研磨用組成物の供給速度:40mL/分
また、研磨対象物の表面を目視で観察し、研磨対象物の表面のうち十分に研磨されていない部分が存在するか否かを確認した。研磨対象物の表面のうち凸部の近傍部分に、十分に研磨されていない部分が存在した場合には、十分に研磨されている部分と凸部の基端部との間の距離を測定した。そして、その測定結果(距離)から、下記の基準に基づいて、凸部の形状に対する研磨パッドの追従性(研磨パッドの変形性)を評価した。
2 研磨対象物
11 基部
12 繊維
21 凸部
22 凹部
Claims (14)
- 金属、合金、又は金属酸化物材料を含有し且つ表面に凸部及び凹部の少なくとも一方を有する研磨対象物の研磨に使用され、長さ2mm以上の繊維の複数が基部の表面に立毛した立毛部を有し、前記繊維の質量が250g/m2以上である研磨パッド。
- 前記繊維の長さが10mm以上である請求項1に記載の研磨パッド。
- 前記繊維の質量が800g/m2以上である請求項1又は請求項2に記載の研磨パッド。
- 前記繊維の本数が1000本/cm2以上である請求項1から請求項3のいずれか一項に記載の研磨パッド。
- 前記繊維の本数が4000本/cm2以上である請求項1から請求項3のいずれか一項に記載の研磨パッド。
- 前記基部の前記繊維が立毛する側とは反対側に弾性体からなる弾性層を設けた多層構造を有する請求項1から請求項5のいずれか一項に記載の研磨パッド。
- 前記凸部の高さ又は前記凹部の深さが0.1mm以上である請求項1から請求項6のいずれか一項に記載の研磨パッド。
- 前記繊維の長さが前記凸部の高さ又は前記凹部の深さの5.5倍以上である請求項1から請求項7のいずれか一項に記載の研磨パッド。
- 前記研磨対象物の表面に対して垂直をなす位置の視点から前記凸部又は前記凹部を見た場合の垂直投影図における前記凸部又は前記凹部の投影面積が0.1cm2以上である請求項1から請求項8のいずれか一項に記載の研磨パッド。
- 平均二次粒子径5μm以下の砥粒及び水を含有する研磨用組成物を用いた前記研磨対象物の研磨に使用される請求項1から請求項9のいずれか一項に記載の研磨パッド。
- 研磨パッドが装着される定盤と、前記定盤を回転させる回転機構と、を備え、前記研磨パッド及び前記定盤の大きさが研磨対象物よりも大きく、前記研磨対象物を前記研磨パッドに接触させて、前記研磨対象物が有する複数の面のうち前記研磨パッドに向かい合う面のみを研磨する研磨装置に使用される請求項1から請求項10のいずれか一項に記載の研磨パッド。
- 請求項1から請求項11のいずれか一項に記載の研磨パッドを用いて研磨対象物を研磨する研磨方法。
- 請求項1から請求項11のいずれか一項に記載の研磨パッドと、平均二次粒子径5μm以下の砥粒及び水を含有する研磨用組成物とを用いて、金属、合金、又は金属酸化物材料を含有し且つ表面に凸部及び凹部の少なくとも一方を有する研磨対象物を研磨する研磨方法。
- 前記研磨パッドが装着される定盤と、前記定盤を回転させる回転機構と、を備え、前記研磨パッド及び前記定盤の大きさが前記研磨対象物よりも大きい研磨装置を用いて、前記研磨対象物を前記研磨パッドに接触させて、前記研磨対象物が有する複数の面のうち前記研磨パッドに向かい合う面のみを研磨する請求項12又は請求項13に記載の研磨方法。
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US15/744,460 US10882157B2 (en) | 2015-07-17 | 2016-05-18 | Polishing pad and polishing method |
EP16827499.1A EP3326751A4 (en) | 2015-07-17 | 2016-05-18 | Polishing pad and polishing method |
JP2017529486A JP6280673B2 (ja) | 2015-07-17 | 2016-05-18 | 研磨パッド及び研磨方法 |
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CN109749630A (zh) * | 2017-11-06 | 2019-05-14 | 蓝思科技(长沙)有限公司 | 一种微米级碳化硼粗磨液、其制备方法及其应用 |
EP3742473A4 (en) * | 2018-01-17 | 2021-09-29 | Sumco Corporation | PROCESS FOR MANUFACTURING TIE SLICE, AND TIE SLICE |
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CN112276788A (zh) * | 2020-10-27 | 2021-01-29 | 湖南元宏特种陶瓷有限公司 | 一种用于陶瓷材料表面的研磨抛光盘盘面 |
KR102489678B1 (ko) * | 2020-12-07 | 2023-01-17 | 에스케이엔펄스 주식회사 | 연마패드용 시트, 연마패드 및 반도체 소자의 제조방법 |
CN115194666A (zh) * | 2022-07-12 | 2022-10-18 | 陈猛 | 适用于多种材料表面打磨抛光的静电植绒材料及制造方法 |
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JP6280673B2 (ja) | 2018-02-14 |
EP3326751A4 (en) | 2018-08-29 |
US10882157B2 (en) | 2021-01-05 |
KR20180030968A (ko) | 2018-03-27 |
US20180200861A1 (en) | 2018-07-19 |
JPWO2017013935A1 (ja) | 2017-11-16 |
EP3326751A1 (en) | 2018-05-30 |
CN107708926A (zh) | 2018-02-16 |
TW201713459A (zh) | 2017-04-16 |
TWI719030B (zh) | 2021-02-21 |
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