JP2006324665A - オフセット集積回路パッケージオンパッケージ積層システム - Google Patents
オフセット集積回路パッケージオンパッケージ積層システム Download PDFInfo
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- JP2006324665A JP2006324665A JP2006136747A JP2006136747A JP2006324665A JP 2006324665 A JP2006324665 A JP 2006324665A JP 2006136747 A JP2006136747 A JP 2006136747A JP 2006136747 A JP2006136747 A JP 2006136747A JP 2006324665 A JP2006324665 A JP 2006324665A
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Abstract
【解決手段】ベース基板104を設けることと、コンタクトパッド119をベース基板104上に形成することと、第1の集積回路110をベース基板104上に取付けることと、ベースパッケージ本体116を第1の集積回路110を囲むように形成することと、オフセット基板122を設けることと、第2の集積回路128をオフセット基板122上に取付けることと、オフセット基板122をベースパッケージ本体116上に置き、オフセット基板122をコンタクトパッド119に結合することとを含むオフセット集積回路パッケージオンパッケージ積層システム100が提供される。
【選択図】図1
Description
この出願は、2005年5月16日に出願された米国仮特許出願連続番号第60/594,884号の利益を主張する。
この発明は概して集積回路パッケージシステムに関し、より特定的には、積み重ねられたパッケージを有する集積回路パッケージシステムのためのシステムに関する。
集積回路を他の回路と接続するために、集積回路をリードフレームまたは基板に取付けることが一般的である。各々の集積回路は、極めて高純度の金またはアルミニウムのワイヤを使用してリードフレームのリードフィンガーパッドに個々に接続されるボンディングパッドを有する。このアセンブリは、次いで、成形されたプラスチックまたはセラミックの本体にアセンブリを個々に封入することによってパッケージ化されて、集積回路パッケージを作る。
路および集積回路の接続部が検査され得る前に予め組立てられなければならないからである。したがって、集積回路がマルチチップモジュールにおいて取付けられ、接続されるとき、個々の集積回路および接続部は個々に検査されることができず、より大きな回路に組立てられる前に品質保証チップ(「known-good-die」)(「KGD」)を識別することが不可能である。その結果、従来のマルチチップパッケージは組立プロセスの歩留りの問題を招く。したがって、KGDを識別しないこの製造プロセスは信頼性の低いものになり、組立ての欠陥を被りやすい。
この発明は、ベース基板を設けることと、コンタクトパッドをベース基板上に形成することと、第1の集積回路をベース基板上に取付けることと、ベースパッケージ本体を第1の集積回路を囲むように形成することと、オフセット基板を設けることと、第2の集積回路をオフセット基板上に取付けることと、オフセット基板をベースパッケージ本体上に置くことを含む、オフセット基板をコンタクトパッドに結合することとを含むオフセット集積回路パッケージオンパッケージ積層システムを提供する。
以下の実施例は、当業者がこの発明をなし、使用することができるように十分詳細に記載される。この開示に基づいて他の実施例が明らかであろうということが理解されるべきであり、この発明の範囲から逸脱することなくプロセスまたは機械的な変更がなされ得ることが理解されるべきである。
システムコンタクトパッド806のアレイ、フリップチップ集積回路などの能動素子808、受動構成要素204、およびオフセットパッケージアウトライン810を有するベース基板上部802を示し、オフセットパッケージアウトライン810は図1のオフセットパッケージ120を加えることによって覆われるであろう領域を示す。オーバーラップ領域812は、ベースモールドキャップ804とオフセットパッケージ120との間の接触領域を示す。ベースモールドキャップ804の角はオフセットパッケージ120によって覆われることになり、オフセットパッケージ120はベースモールドキャップ804の上に置かれることになる。能動素子808はオフセットパッケージ120の下に置かれ、図1のオフセット基板122の、図1の底部面126と接触することはない。
2.コンタクトパッドをベース基板上に形成すること。(図1)
3.第1の集積回路をコンタクトパッドに結合することを含む、第1の集積回路をベース基板上に取付けること。(図1)
4.成形材料を射出することを含む、ベースパッケージ本体を第1の集積回路を囲むように形成すること。(図1)
5.システム相互接続部を設けることを含む、オフセット基板を設けること。(図1)
6.オフセットパッケージ本体を第2の集積回路を覆って形成することを含む、第2の集積回路をオフセット基板上に取付けること。(図1)
7.オフセット基板をベースパッケージ本体上に置くことを含む、オフセット基板をコンタクトパッドに結合すること。(図1)
このように、この発明は多くの局面を有することが分かってきた。
110 第1の集積回路
116 ベースパッケージ本体
119 コンタクトパッド
122 オフセット基板
128 第2の集積回路
Claims (10)
- オフセット集積回路パッケージオンパッケージ積層システム(1000)であって、
ベース基板(104)を設けることと、
コンタクトパッド(119)を前記ベース基板(104)上に形成することと、
第1の集積回路(110)を前記ベース基板(104)上に取付けることと、
ベースパッケージ本体(116)を前記第1の集積回路(110)を囲むように形成することと、
オフセット基板(122)を設けることと、
第2の集積回路(128)を前記オフセット基板(122)上に取付けることと、
前記オフセット基板(122)を前記ベースパッケージ本体(116)上に置くことを含む、前記オフセット基板(122)を前記コンタクトパッド(119)に結合することとを含む、システム(1000)。 - 受動構成要素(204)、能動構成要素(808)、またはそれらの組合せを前記ベース基板(104)に取付けることをさらに含む、請求項1に記載のシステム(1000)。
- オフセットパッケージ(120)がベースモールドキャップ(804)の角にある状態で、前記オフセットパッケージ(120)を前記ベース基板(104)に取付けることをさらに含む、請求項1に記載のシステム(1000)。
- 前記ベースパッケージ本体(116)と前記オフセット基板(122)との間に隙間充填接着剤(502)を与えることをさらに含む、請求項1に記載のシステム(1000)。
- オフセットパッケージ(120)がベースモールドキャップ(904)の1つの端縁と整列された状態で、前記オフセットパッケージ(120)を前記ベース基板(104)上に取付けることをさらに含む、請求項1に記載のシステム(1000)。
- オフセット集積回路パッケージオンパッケージ積層システム(100)であって、
ベース基板(104)と、
前記ベース基板(104)上に形成されるコンタクトパッド(119)と、
前記ベース基板(104)上に取付けられる第1の集積回路(110)と、
前記第1の集積回路(110)を囲むように成形されるベースパッケージ本体(116)と、
オフセット基板(122)と、
前記オフセット基板(122)上に取付けられる第2の集積回路(128)と、
前記ベースパッケージ本体(116)上に置かれる前記オフセット基板(122)を含む、前記コンタクトパッド(119)に結合される前記オフセット基板(122)とを含む、システム(100)。 - 前記ベース基板(104)に取付けられる受動構成要素(204)、能動構成要素(808)、またはそれらの組合せをさらに含む、請求項6に記載のシステム(100)。
- オフセットパッケージ(120)がベースモールドキャップ(804)の角にある状態で前記ベース基板(104)上に取付けられる前記オフセットパッケージ(120)をさらに含む、請求項6に記載のシステム(100)。
- 前記ベースパッケージ本体(116)と前記オフセット基板(122)との間に隙間充
填接着剤(502)をさらに含む、請求項6に記載のシステム(100)。 - オフセットパッケージ(120)がベースモールドキャップ(904)の1つの端縁と整列された状態で前記ベース基板(104)上に取付けられる前記オフセットパッケージ(120)をさらに含む、請求項6に記載のシステム(100)。
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