JP2006290630A - レーザを用いたガラスの加工方法 - Google Patents

レーザを用いたガラスの加工方法 Download PDF

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Publication number
JP2006290630A
JP2006290630A JP2005046859A JP2005046859A JP2006290630A JP 2006290630 A JP2006290630 A JP 2006290630A JP 2005046859 A JP2005046859 A JP 2005046859A JP 2005046859 A JP2005046859 A JP 2005046859A JP 2006290630 A JP2006290630 A JP 2006290630A
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Japan
Prior art keywords
glass
laser
glass plate
etching
altered portion
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JP2005046859A
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Japanese (ja)
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JP2006290630A6 (enExample
Inventor
Hirotaka Komochi
広隆 小用
Keiji Tsunetomo
啓司 常友
Masanori Ojitani
将範 小路谷
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Nippon Sheet Glass Co Ltd
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Nippon Sheet Glass Co Ltd
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Priority to JP2005046859A priority Critical patent/JP2006290630A/ja
Publication of JP2006290630A publication Critical patent/JP2006290630A/ja
Publication of JP2006290630A6 publication Critical patent/JP2006290630A6/ja
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  • Lasers (AREA)
JP2005046859A 2005-02-23 2005-02-23 レーザを用いたガラスの加工方法 Pending JP2006290630A (ja)

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JP2005046859A JP2006290630A (ja) 2005-02-23 2005-02-23 レーザを用いたガラスの加工方法

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JP2006290630A true JP2006290630A (ja) 2006-10-26
JP2006290630A6 JP2006290630A6 (enExample) 2006-12-28

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Cited By (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008019123A (ja) * 2006-07-12 2008-01-31 Nagaoka Univ Of Technology 微細加工ガラス及びその加工法
DE112008001389T5 (de) 2007-05-25 2010-04-15 Hamamatsu Photonics K.K., Hamamatsu-shi Schneidbearbeitungsverfahren
JP2012014018A (ja) * 2010-07-01 2012-01-19 Takeji Arai ガラス製マイクロレンズアレイの製造方法
US8541319B2 (en) 2010-07-26 2013-09-24 Hamamatsu Photonics K.K. Laser processing method
JP2013220958A (ja) * 2012-04-13 2013-10-28 Namiki Precision Jewel Co Ltd 微小空洞形成方法
US8591753B2 (en) 2010-07-26 2013-11-26 Hamamatsu Photonics K.K. Laser processing method
JP2014501686A (ja) * 2010-11-30 2014-01-23 コーニング インコーポレイテッド ガラスに孔の高密度アレイを形成する方法
US8673167B2 (en) 2010-07-26 2014-03-18 Hamamatsu Photonics K.K. Laser processing method
US8685269B2 (en) 2010-07-26 2014-04-01 Hamamatsu Photonics K.K. Laser processing method
US8741777B2 (en) 2010-07-26 2014-06-03 Hamamatsu Photonics K.K. Substrate processing method
US8802544B2 (en) 2010-07-26 2014-08-12 Hamamatsu Photonics K.K. Method for manufacturing chip including a functional device formed on a substrate
US8828260B2 (en) 2010-07-26 2014-09-09 Hamamatsu Photonics K.K. Substrate processing method
US8828873B2 (en) 2010-07-26 2014-09-09 Hamamatsu Photonics K.K. Method for manufacturing semiconductor device
US8841213B2 (en) 2010-07-26 2014-09-23 Hamamatsu Photonics K.K. Method for manufacturing interposer
US8945416B2 (en) 2010-07-26 2015-02-03 Hamamatsu Photonics K.K. Laser processing method
US8961806B2 (en) 2010-07-26 2015-02-24 Hamamatsu Photonics K.K. Laser processing method
US9108269B2 (en) 2010-07-26 2015-08-18 Hamamatsu Photonics K. K. Method for manufacturing light-absorbing substrate and method for manufacturing mold for making same
JP2016070900A (ja) * 2014-10-02 2016-05-09 セイコーエプソン株式会社 磁気計測装置の製造方法、ガスセルの製造方法、磁気計測装置、およびガスセル
WO2017038075A1 (ja) * 2015-08-31 2017-03-09 日本板硝子株式会社 微細構造付きガラスの製造方法
US10077206B2 (en) 2015-06-10 2018-09-18 Corning Incorporated Methods of etching glass substrates and glass substrates
US10756003B2 (en) 2016-06-29 2020-08-25 Corning Incorporated Inorganic wafer having through-holes attached to semiconductor wafer
CN111799169A (zh) * 2020-07-17 2020-10-20 绍兴同芯成集成电路有限公司 一种飞秒激光结合hf湿蚀刻加工tgv的工艺
WO2020217936A1 (ja) * 2019-04-23 2020-10-29 日本電気硝子株式会社 ガラス板の製造方法、及びガラス板、並びにガラス板集合体
US11062986B2 (en) 2017-05-25 2021-07-13 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US11114309B2 (en) 2016-06-01 2021-09-07 Corning Incorporated Articles and methods of forming vias in substrates
JP2021172562A (ja) * 2020-04-27 2021-11-01 株式会社Nsc 貫通孔を有するガラス基板製造方法および表示装置製造方法
CN114988711A (zh) * 2022-06-08 2022-09-02 广东工业大学 一种通过预设应力辅助玻璃图案化的成型方法
US11478874B2 (en) 2019-04-05 2022-10-25 Tdk Corporation Method of processing inorganic material substrate, device, and method of manufacturing device
CN115385578A (zh) * 2022-07-29 2022-11-25 惠州市清洋实业有限公司 一种摄像头镜片化学打孔制造工艺
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US11774233B2 (en) 2016-06-29 2023-10-03 Corning Incorporated Method and system for measuring geometric parameters of through holes
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules

Cited By (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008019123A (ja) * 2006-07-12 2008-01-31 Nagaoka Univ Of Technology 微細加工ガラス及びその加工法
DE112008001389T5 (de) 2007-05-25 2010-04-15 Hamamatsu Photonics K.K., Hamamatsu-shi Schneidbearbeitungsverfahren
JP2012014018A (ja) * 2010-07-01 2012-01-19 Takeji Arai ガラス製マイクロレンズアレイの製造方法
US8802544B2 (en) 2010-07-26 2014-08-12 Hamamatsu Photonics K.K. Method for manufacturing chip including a functional device formed on a substrate
US8828873B2 (en) 2010-07-26 2014-09-09 Hamamatsu Photonics K.K. Method for manufacturing semiconductor device
US8591753B2 (en) 2010-07-26 2013-11-26 Hamamatsu Photonics K.K. Laser processing method
EP2600392A4 (en) * 2010-07-26 2016-12-14 Hamamatsu Photonics Kk LASER PROCESSING PROCESS
US8673167B2 (en) 2010-07-26 2014-03-18 Hamamatsu Photonics K.K. Laser processing method
US8685269B2 (en) 2010-07-26 2014-04-01 Hamamatsu Photonics K.K. Laser processing method
US8741777B2 (en) 2010-07-26 2014-06-03 Hamamatsu Photonics K.K. Substrate processing method
US8541319B2 (en) 2010-07-26 2013-09-24 Hamamatsu Photonics K.K. Laser processing method
US8828260B2 (en) 2010-07-26 2014-09-09 Hamamatsu Photonics K.K. Substrate processing method
US9108269B2 (en) 2010-07-26 2015-08-18 Hamamatsu Photonics K. K. Method for manufacturing light-absorbing substrate and method for manufacturing mold for making same
US8841213B2 (en) 2010-07-26 2014-09-23 Hamamatsu Photonics K.K. Method for manufacturing interposer
US8945416B2 (en) 2010-07-26 2015-02-03 Hamamatsu Photonics K.K. Laser processing method
US8961806B2 (en) 2010-07-26 2015-02-24 Hamamatsu Photonics K.K. Laser processing method
JP2014501686A (ja) * 2010-11-30 2014-01-23 コーニング インコーポレイテッド ガラスに孔の高密度アレイを形成する方法
US9802855B2 (en) 2010-11-30 2017-10-31 Corning Incorporated Methods of forming high-density arrays of holes in glass
JP2013220958A (ja) * 2012-04-13 2013-10-28 Namiki Precision Jewel Co Ltd 微小空洞形成方法
JP2016070900A (ja) * 2014-10-02 2016-05-09 セイコーエプソン株式会社 磁気計測装置の製造方法、ガスセルの製造方法、磁気計測装置、およびガスセル
US10077206B2 (en) 2015-06-10 2018-09-18 Corning Incorporated Methods of etching glass substrates and glass substrates
JPWO2017038075A1 (ja) * 2015-08-31 2018-06-14 日本板硝子株式会社 微細構造付きガラスの製造方法
CN107922254A (zh) * 2015-08-31 2018-04-17 日本板硝子株式会社 带微细结构的玻璃的制造方法
WO2017038075A1 (ja) * 2015-08-31 2017-03-09 日本板硝子株式会社 微細構造付きガラスの製造方法
US11114309B2 (en) 2016-06-01 2021-09-07 Corning Incorporated Articles and methods of forming vias in substrates
US10756003B2 (en) 2016-06-29 2020-08-25 Corning Incorporated Inorganic wafer having through-holes attached to semiconductor wafer
US11774233B2 (en) 2016-06-29 2023-10-03 Corning Incorporated Method and system for measuring geometric parameters of through holes
US11972993B2 (en) 2017-05-25 2024-04-30 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US11062986B2 (en) 2017-05-25 2021-07-13 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US11478874B2 (en) 2019-04-05 2022-10-25 Tdk Corporation Method of processing inorganic material substrate, device, and method of manufacturing device
JP7116926B2 (ja) 2019-04-23 2022-08-12 日本電気硝子株式会社 ガラス板の製造方法、及びガラス板、並びにガラス板集合体
JP2020180009A (ja) * 2019-04-23 2020-11-05 日本電気硝子株式会社 ガラス板の製造方法、及びガラス板、並びにガラス板集合体
WO2020217936A1 (ja) * 2019-04-23 2020-10-29 日本電気硝子株式会社 ガラス板の製造方法、及びガラス板、並びにガラス板集合体
TWI842874B (zh) * 2019-04-23 2024-05-21 日商日本電氣硝子股份有限公司 玻璃板的製造方法、玻璃板以及玻璃板集合體
US12180109B2 (en) 2019-04-23 2024-12-31 Nippon Electric Glass Co., Ltd. Method for manufacturing glass sheet, and glass sheet and glass sheet assembly
JP7028418B2 (ja) 2020-04-27 2022-03-02 株式会社Nsc 貫通孔を有するガラス基板製造方法および表示装置製造方法
WO2021220890A1 (ja) * 2020-04-27 2021-11-04 株式会社Nsc 貫通孔を有するガラス基板製造方法および表示装置製造方法
JP2021172562A (ja) * 2020-04-27 2021-11-01 株式会社Nsc 貫通孔を有するガラス基板製造方法および表示装置製造方法
CN111799169B (zh) * 2020-07-17 2024-05-28 绍兴同芯成集成电路有限公司 一种飞秒激光结合hf湿蚀刻加工tgv的工艺
CN111799169A (zh) * 2020-07-17 2020-10-20 绍兴同芯成集成电路有限公司 一种飞秒激光结合hf湿蚀刻加工tgv的工艺
CN114988711A (zh) * 2022-06-08 2022-09-02 广东工业大学 一种通过预设应力辅助玻璃图案化的成型方法
CN115385578A (zh) * 2022-07-29 2022-11-25 惠州市清洋实业有限公司 一种摄像头镜片化学打孔制造工艺
CN115385578B (zh) * 2022-07-29 2023-11-28 惠州市清洋实业有限公司 一种摄像头镜片化学打孔制造工艺

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