JP2006290630A - レーザを用いたガラスの加工方法 - Google Patents
レーザを用いたガラスの加工方法 Download PDFInfo
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- JP2006290630A JP2006290630A JP2005046859A JP2005046859A JP2006290630A JP 2006290630 A JP2006290630 A JP 2006290630A JP 2005046859 A JP2005046859 A JP 2005046859A JP 2005046859 A JP2005046859 A JP 2005046859A JP 2006290630 A JP2006290630 A JP 2006290630A
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- Prior art keywords
- glass
- laser
- glass plate
- etching
- altered portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011521 glass Substances 0.000 title claims abstract description 154
- 238000003672 processing method Methods 0.000 title claims abstract description 32
- 238000005530 etching Methods 0.000 claims abstract description 62
- 238000010521 absorption reaction Methods 0.000 claims abstract description 16
- 230000001678 irradiating effect Effects 0.000 claims abstract description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 24
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 10
- 238000009833 condensation Methods 0.000 abstract 1
- 230000005494 condensation Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 23
- 238000012545 processing Methods 0.000 description 12
- 238000005498 polishing Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- 239000006089 photosensitive glass Substances 0.000 description 5
- 239000005368 silicate glass Substances 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910000420 cerium oxide Inorganic materials 0.000 description 2
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000000879 optical micrograph Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
Images
Landscapes
- Surface Treatment Of Glass (AREA)
- Lasers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005046859A JP2006290630A (ja) | 2005-02-23 | 2005-02-23 | レーザを用いたガラスの加工方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005046859A JP2006290630A (ja) | 2005-02-23 | 2005-02-23 | レーザを用いたガラスの加工方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006290630A true JP2006290630A (ja) | 2006-10-26 |
| JP2006290630A6 JP2006290630A6 (enrdf_load_stackoverflow) | 2006-12-28 |
Family
ID=37411613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005046859A Pending JP2006290630A (ja) | 2005-02-23 | 2005-02-23 | レーザを用いたガラスの加工方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2006290630A (enrdf_load_stackoverflow) |
Cited By (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008019123A (ja) * | 2006-07-12 | 2008-01-31 | Nagaoka Univ Of Technology | 微細加工ガラス及びその加工法 |
| DE112008001389T5 (de) | 2007-05-25 | 2010-04-15 | Hamamatsu Photonics K.K., Hamamatsu-shi | Schneidbearbeitungsverfahren |
| JP2012014018A (ja) * | 2010-07-01 | 2012-01-19 | Takeji Arai | ガラス製マイクロレンズアレイの製造方法 |
| US8541319B2 (en) | 2010-07-26 | 2013-09-24 | Hamamatsu Photonics K.K. | Laser processing method |
| JP2013220958A (ja) * | 2012-04-13 | 2013-10-28 | Namiki Precision Jewel Co Ltd | 微小空洞形成方法 |
| US8591753B2 (en) | 2010-07-26 | 2013-11-26 | Hamamatsu Photonics K.K. | Laser processing method |
| JP2014501686A (ja) * | 2010-11-30 | 2014-01-23 | コーニング インコーポレイテッド | ガラスに孔の高密度アレイを形成する方法 |
| US8673167B2 (en) | 2010-07-26 | 2014-03-18 | Hamamatsu Photonics K.K. | Laser processing method |
| US8685269B2 (en) | 2010-07-26 | 2014-04-01 | Hamamatsu Photonics K.K. | Laser processing method |
| US8741777B2 (en) | 2010-07-26 | 2014-06-03 | Hamamatsu Photonics K.K. | Substrate processing method |
| US8802544B2 (en) | 2010-07-26 | 2014-08-12 | Hamamatsu Photonics K.K. | Method for manufacturing chip including a functional device formed on a substrate |
| US8828873B2 (en) | 2010-07-26 | 2014-09-09 | Hamamatsu Photonics K.K. | Method for manufacturing semiconductor device |
| US8828260B2 (en) | 2010-07-26 | 2014-09-09 | Hamamatsu Photonics K.K. | Substrate processing method |
| US8841213B2 (en) | 2010-07-26 | 2014-09-23 | Hamamatsu Photonics K.K. | Method for manufacturing interposer |
| US8945416B2 (en) | 2010-07-26 | 2015-02-03 | Hamamatsu Photonics K.K. | Laser processing method |
| US8961806B2 (en) | 2010-07-26 | 2015-02-24 | Hamamatsu Photonics K.K. | Laser processing method |
| US9108269B2 (en) | 2010-07-26 | 2015-08-18 | Hamamatsu Photonics K. K. | Method for manufacturing light-absorbing substrate and method for manufacturing mold for making same |
| JP2016070900A (ja) * | 2014-10-02 | 2016-05-09 | セイコーエプソン株式会社 | 磁気計測装置の製造方法、ガスセルの製造方法、磁気計測装置、およびガスセル |
| WO2017038075A1 (ja) * | 2015-08-31 | 2017-03-09 | 日本板硝子株式会社 | 微細構造付きガラスの製造方法 |
| US10077206B2 (en) | 2015-06-10 | 2018-09-18 | Corning Incorporated | Methods of etching glass substrates and glass substrates |
| US10756003B2 (en) | 2016-06-29 | 2020-08-25 | Corning Incorporated | Inorganic wafer having through-holes attached to semiconductor wafer |
| CN111799169A (zh) * | 2020-07-17 | 2020-10-20 | 绍兴同芯成集成电路有限公司 | 一种飞秒激光结合hf湿蚀刻加工tgv的工艺 |
| WO2020217936A1 (ja) * | 2019-04-23 | 2020-10-29 | 日本電気硝子株式会社 | ガラス板の製造方法、及びガラス板、並びにガラス板集合体 |
| US11062986B2 (en) | 2017-05-25 | 2021-07-13 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
| US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
| US11114309B2 (en) | 2016-06-01 | 2021-09-07 | Corning Incorporated | Articles and methods of forming vias in substrates |
| JP2021172562A (ja) * | 2020-04-27 | 2021-11-01 | 株式会社Nsc | 貫通孔を有するガラス基板製造方法および表示装置製造方法 |
| CN114988711A (zh) * | 2022-06-08 | 2022-09-02 | 广东工业大学 | 一种通过预设应力辅助玻璃图案化的成型方法 |
| US11478874B2 (en) | 2019-04-05 | 2022-10-25 | Tdk Corporation | Method of processing inorganic material substrate, device, and method of manufacturing device |
| CN115385578A (zh) * | 2022-07-29 | 2022-11-25 | 惠州市清洋实业有限公司 | 一种摄像头镜片化学打孔制造工艺 |
| US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
| US11774233B2 (en) | 2016-06-29 | 2023-10-03 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
| US12180108B2 (en) | 2017-12-19 | 2024-12-31 | Corning Incorporated | Methods for etching vias in glass-based articles employing positive charge organic molecules |
-
2005
- 2005-02-23 JP JP2005046859A patent/JP2006290630A/ja active Pending
Cited By (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008019123A (ja) * | 2006-07-12 | 2008-01-31 | Nagaoka Univ Of Technology | 微細加工ガラス及びその加工法 |
| DE112008001389T5 (de) | 2007-05-25 | 2010-04-15 | Hamamatsu Photonics K.K., Hamamatsu-shi | Schneidbearbeitungsverfahren |
| JP2012014018A (ja) * | 2010-07-01 | 2012-01-19 | Takeji Arai | ガラス製マイクロレンズアレイの製造方法 |
| US8802544B2 (en) | 2010-07-26 | 2014-08-12 | Hamamatsu Photonics K.K. | Method for manufacturing chip including a functional device formed on a substrate |
| US8828260B2 (en) | 2010-07-26 | 2014-09-09 | Hamamatsu Photonics K.K. | Substrate processing method |
| US8591753B2 (en) | 2010-07-26 | 2013-11-26 | Hamamatsu Photonics K.K. | Laser processing method |
| EP2600392A4 (en) * | 2010-07-26 | 2016-12-14 | Hamamatsu Photonics Kk | LASER PROCESSING PROCESS |
| US8673167B2 (en) | 2010-07-26 | 2014-03-18 | Hamamatsu Photonics K.K. | Laser processing method |
| US8685269B2 (en) | 2010-07-26 | 2014-04-01 | Hamamatsu Photonics K.K. | Laser processing method |
| US8741777B2 (en) | 2010-07-26 | 2014-06-03 | Hamamatsu Photonics K.K. | Substrate processing method |
| US8541319B2 (en) | 2010-07-26 | 2013-09-24 | Hamamatsu Photonics K.K. | Laser processing method |
| US8828873B2 (en) | 2010-07-26 | 2014-09-09 | Hamamatsu Photonics K.K. | Method for manufacturing semiconductor device |
| US9108269B2 (en) | 2010-07-26 | 2015-08-18 | Hamamatsu Photonics K. K. | Method for manufacturing light-absorbing substrate and method for manufacturing mold for making same |
| US8841213B2 (en) | 2010-07-26 | 2014-09-23 | Hamamatsu Photonics K.K. | Method for manufacturing interposer |
| US8945416B2 (en) | 2010-07-26 | 2015-02-03 | Hamamatsu Photonics K.K. | Laser processing method |
| US8961806B2 (en) | 2010-07-26 | 2015-02-24 | Hamamatsu Photonics K.K. | Laser processing method |
| JP2014501686A (ja) * | 2010-11-30 | 2014-01-23 | コーニング インコーポレイテッド | ガラスに孔の高密度アレイを形成する方法 |
| US9802855B2 (en) | 2010-11-30 | 2017-10-31 | Corning Incorporated | Methods of forming high-density arrays of holes in glass |
| JP2013220958A (ja) * | 2012-04-13 | 2013-10-28 | Namiki Precision Jewel Co Ltd | 微小空洞形成方法 |
| JP2016070900A (ja) * | 2014-10-02 | 2016-05-09 | セイコーエプソン株式会社 | 磁気計測装置の製造方法、ガスセルの製造方法、磁気計測装置、およびガスセル |
| US10077206B2 (en) | 2015-06-10 | 2018-09-18 | Corning Incorporated | Methods of etching glass substrates and glass substrates |
| JPWO2017038075A1 (ja) * | 2015-08-31 | 2018-06-14 | 日本板硝子株式会社 | 微細構造付きガラスの製造方法 |
| CN107922254A (zh) * | 2015-08-31 | 2018-04-17 | 日本板硝子株式会社 | 带微细结构的玻璃的制造方法 |
| WO2017038075A1 (ja) * | 2015-08-31 | 2017-03-09 | 日本板硝子株式会社 | 微細構造付きガラスの製造方法 |
| US11114309B2 (en) | 2016-06-01 | 2021-09-07 | Corning Incorporated | Articles and methods of forming vias in substrates |
| US10756003B2 (en) | 2016-06-29 | 2020-08-25 | Corning Incorporated | Inorganic wafer having through-holes attached to semiconductor wafer |
| US11774233B2 (en) | 2016-06-29 | 2023-10-03 | Corning Incorporated | Method and system for measuring geometric parameters of through holes |
| US11972993B2 (en) | 2017-05-25 | 2024-04-30 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
| US11062986B2 (en) | 2017-05-25 | 2021-07-13 | Corning Incorporated | Articles having vias with geometry attributes and methods for fabricating the same |
| US11078112B2 (en) | 2017-05-25 | 2021-08-03 | Corning Incorporated | Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same |
| US12180108B2 (en) | 2017-12-19 | 2024-12-31 | Corning Incorporated | Methods for etching vias in glass-based articles employing positive charge organic molecules |
| US11554984B2 (en) | 2018-02-22 | 2023-01-17 | Corning Incorporated | Alkali-free borosilicate glasses with low post-HF etch roughness |
| US11478874B2 (en) | 2019-04-05 | 2022-10-25 | Tdk Corporation | Method of processing inorganic material substrate, device, and method of manufacturing device |
| JP7116926B2 (ja) | 2019-04-23 | 2022-08-12 | 日本電気硝子株式会社 | ガラス板の製造方法、及びガラス板、並びにガラス板集合体 |
| JP2020180009A (ja) * | 2019-04-23 | 2020-11-05 | 日本電気硝子株式会社 | ガラス板の製造方法、及びガラス板、並びにガラス板集合体 |
| WO2020217936A1 (ja) * | 2019-04-23 | 2020-10-29 | 日本電気硝子株式会社 | ガラス板の製造方法、及びガラス板、並びにガラス板集合体 |
| TWI842874B (zh) * | 2019-04-23 | 2024-05-21 | 日商日本電氣硝子股份有限公司 | 玻璃板的製造方法、玻璃板以及玻璃板集合體 |
| US12180109B2 (en) | 2019-04-23 | 2024-12-31 | Nippon Electric Glass Co., Ltd. | Method for manufacturing glass sheet, and glass sheet and glass sheet assembly |
| JP7028418B2 (ja) | 2020-04-27 | 2022-03-02 | 株式会社Nsc | 貫通孔を有するガラス基板製造方法および表示装置製造方法 |
| WO2021220890A1 (ja) * | 2020-04-27 | 2021-11-04 | 株式会社Nsc | 貫通孔を有するガラス基板製造方法および表示装置製造方法 |
| JP2021172562A (ja) * | 2020-04-27 | 2021-11-01 | 株式会社Nsc | 貫通孔を有するガラス基板製造方法および表示装置製造方法 |
| CN111799169B (zh) * | 2020-07-17 | 2024-05-28 | 绍兴同芯成集成电路有限公司 | 一种飞秒激光结合hf湿蚀刻加工tgv的工艺 |
| CN111799169A (zh) * | 2020-07-17 | 2020-10-20 | 绍兴同芯成集成电路有限公司 | 一种飞秒激光结合hf湿蚀刻加工tgv的工艺 |
| CN114988711A (zh) * | 2022-06-08 | 2022-09-02 | 广东工业大学 | 一种通过预设应力辅助玻璃图案化的成型方法 |
| CN115385578A (zh) * | 2022-07-29 | 2022-11-25 | 惠州市清洋实业有限公司 | 一种摄像头镜片化学打孔制造工艺 |
| CN115385578B (zh) * | 2022-07-29 | 2023-11-28 | 惠州市清洋实业有限公司 | 一种摄像头镜片化学打孔制造工艺 |
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