JP2006285911A - Rfidタグ - Google Patents
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- JP2006285911A JP2006285911A JP2005108675A JP2005108675A JP2006285911A JP 2006285911 A JP2006285911 A JP 2006285911A JP 2005108675 A JP2005108675 A JP 2005108675A JP 2005108675 A JP2005108675 A JP 2005108675A JP 2006285911 A JP2006285911 A JP 2006285911A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
- G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
- G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
- G06K19/07381—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit with deactivation or otherwise incapacitation of at least a part of the circuit upon detected tampering
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
- G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
- G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
- G06K19/07381—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit with deactivation or otherwise incapacitation of at least a part of the circuit upon detected tampering
- G06K19/0739—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit with deactivation or otherwise incapacitation of at least a part of the circuit upon detected tampering the incapacitated circuit being part of an antenna
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Security & Cryptography (AREA)
- General Engineering & Computer Science (AREA)
- Details Of Aerials (AREA)
- Credit Cards Or The Like (AREA)
Abstract
【解決手段】第1の導体パターン12が、ICチップ13に各端部が接続されてICチップ13から延在する2つの延在部121,122と、ICチップ13を迂回してそれら2つの延在部121,122どうしを繋ぐ、アンテナ特性補正用の補正パターン123とを有し、剥離検知パターンを、2つの延在部121,122と補正パターン123とに囲まれた領域内に形成する。
【選択図】 図4
Description
ベースと、
ベース上に設けられた、通信用のアンテナとして作用する第1の導体パターンと、
ベース上に設けられた、そのベースからの剥離時に破壊される剥離検知用の第2の導体パターンと、
第1の導体パターンおよび第2の導体パターンの双方に電気的に接続され、第1の導体パターンをアンテナとして使った無線通信および第2の導体パターンの破壊検知を行なう回路チップと、
第1の導体パターン、第2の導体パターン、および回路チップを覆ってベースに剥離可能な状態で接着された、ベースからの剥離の際に第2の導体パターンの全部または一部を付着させたま剥離されるカバーとを備え、
上記第1の導体パターンが、回路チップに各端部が接続されて回路チップから延在する2つの延在部と、回路チップを迂回してそれら2つの延在部どうしを繋ぐ、アンテナ特性補正用の補正パターンとを有し、
上記第2の導体パターンが、上記2つの延在部と上記補正パターンとに囲まれた領域内に形成されていることを特徴とする。
11 ベースシート
12 アンテナパターン
12a 延在部
12b 延在部
121 延在部
122 延在部
123 補正パターン
13 ICチップ
14 バンプ
15 接着剤
16 剥離検知パターン
161 剥離検知箇所
17 カバーシート
20 台紙
31 接着剤
32 隠蔽層
32a 剥離部
32b 残留部
33 接着剤
40 貼付対象物
Claims (5)
- ベースと、
前記ベース上に設けられた、通信用のアンテナとして作用する第1の導体パターンと、
前記ベース上に設けられた、該ベースからの剥離時に破壊される剥離検知用の第2の導体パターンと、
前記第1の導体パターンおよび前記第2の導体パターンの双方に電気的に接続され、該第1の導体パターンをアンテナとして使った無線通信および該第2の導体パターンの破壊検知を行なう回路チップと、
前記第1の導体パターン、前記第2の導体パターン、および前記回路チップを覆って前記ベースに剥離可能な状態で接着された、該ベースからの剥離の際に前記第2の導体パターンの全部または一部を付着させたま剥離されるカバーとを備え、
前記第1の導体パターンが、前記回路チップに各端部が接続されて該回路チップから延在する2つの延在部と、該回路チップを迂回して該2つの延在部どうしを繋ぐ、アンテナ特性補正用の補正パターンとを有し、
前記第2の導体パターンが、前記2つの延在部と前記補正パターンとに囲まれた領域内に形成されていることを特徴とするRFIDタグ。 - 前記第1の導体パターンが前記回路チップに両端部が接続されたループアンテナのパターンを有することを特徴とする請求項1記載のRFIDタグ。
- 前記第1の導体パターンが、前記回路チップにそれぞれの一方の端部が接続された2つのモノポールパターンからなるダイポールアンテナのパターンを有することを特徴とする請求項1記載のRFIDタグ。
- 前記補正パターンは、前記回路チップと、前記第1の導体パターンの該回路チップに接続された端部との間に生じる寄生容量を相殺するインダクタであることを特徴とする請求項1記載のRFIDタグ。
- 前記第2の導体パターンは、前記回路チップに両端部が接続されたループ状のパターンであって、前記カバーが前記ベースから剥離される際に該カバーに付着したまま剥離される剥離検知箇所が該第2の導体パターンのループを一周する途中の複数箇所に設けられたものであることを特徴とする請求項1記載のRFIDタグ。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005108675A JP4750450B2 (ja) | 2005-04-05 | 2005-04-05 | Rfidタグ |
EP05255481A EP1710734A3 (en) | 2005-04-05 | 2005-09-07 | Rfid tag |
TW094131119A TWI301947B (en) | 2005-04-05 | 2005-09-09 | Rfid tag |
US11/232,035 US7277017B2 (en) | 2005-04-05 | 2005-09-22 | RFID tag |
CNB2005101076831A CN100474335C (zh) | 2005-04-05 | 2005-09-29 | 射频识别标签 |
KR1020050092537A KR100686573B1 (ko) | 2005-04-05 | 2005-09-30 | Rfid 태그 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005108675A JP4750450B2 (ja) | 2005-04-05 | 2005-04-05 | Rfidタグ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006285911A true JP2006285911A (ja) | 2006-10-19 |
JP4750450B2 JP4750450B2 (ja) | 2011-08-17 |
Family
ID=36582002
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005108675A Expired - Fee Related JP4750450B2 (ja) | 2005-04-05 | 2005-04-05 | Rfidタグ |
Country Status (6)
Country | Link |
---|---|
US (1) | US7277017B2 (ja) |
EP (1) | EP1710734A3 (ja) |
JP (1) | JP4750450B2 (ja) |
KR (1) | KR100686573B1 (ja) |
CN (1) | CN100474335C (ja) |
TW (1) | TWI301947B (ja) |
Cited By (87)
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JP2008123083A (ja) * | 2006-11-09 | 2008-05-29 | Dainippon Printing Co Ltd | 非接触icタグラベルと航空手荷物タグラベル、および非接触icタグラベルの製造方法 |
KR100842320B1 (ko) | 2006-11-06 | 2008-06-30 | 아시아나아이디티 주식회사 | 금속 부착형 태그 안테나 |
JP2008205732A (ja) * | 2007-02-19 | 2008-09-04 | Toppan Forms Co Ltd | 非接触型データ受送信体 |
JP2008276607A (ja) * | 2007-05-01 | 2008-11-13 | Toppan Forms Co Ltd | Rfidメディア |
JP2008282103A (ja) * | 2007-05-08 | 2008-11-20 | Yoshikawa Rf System Kk | データキャリア及びリーダ/ライタ装置 |
WO2009048767A1 (en) * | 2007-10-11 | 2009-04-16 | 3M Innovative Properties Company | Rfid tag with a modified dipole antenna |
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US7997501B2 (en) | 2007-07-17 | 2011-08-16 | Murata Manufacturing Co., Ltd. | Wireless IC device and electronic apparatus |
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Also Published As
Publication number | Publication date |
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TW200636594A (en) | 2006-10-16 |
KR100686573B1 (ko) | 2007-02-26 |
CN1848143A (zh) | 2006-10-18 |
US20060220871A1 (en) | 2006-10-05 |
EP1710734A2 (en) | 2006-10-11 |
CN100474335C (zh) | 2009-04-01 |
US7277017B2 (en) | 2007-10-02 |
EP1710734A3 (en) | 2011-06-29 |
KR20060106597A (ko) | 2006-10-12 |
JP4750450B2 (ja) | 2011-08-17 |
TWI301947B (en) | 2008-10-11 |
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