JP2006284433A - 外観検査装置及び外観検査方法 - Google Patents

外観検査装置及び外観検査方法 Download PDF

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Publication number
JP2006284433A
JP2006284433A JP2005106187A JP2005106187A JP2006284433A JP 2006284433 A JP2006284433 A JP 2006284433A JP 2005106187 A JP2005106187 A JP 2005106187A JP 2005106187 A JP2005106187 A JP 2005106187A JP 2006284433 A JP2006284433 A JP 2006284433A
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image
distribution
calculation unit
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JP2005106187A
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English (en)
Japanese (ja)
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JP2006284433A5 (enExample
Inventor
Akio Ishikawa
明夫 石川
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Tokyo Seimitsu Co Ltd
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Tokyo Seimitsu Co Ltd
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Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Priority to JP2005106187A priority Critical patent/JP2006284433A/ja
Priority to DE102006014812A priority patent/DE102006014812A1/de
Priority to US11/396,173 priority patent/US20060222232A1/en
Priority to KR1020060030295A priority patent/KR100855100B1/ko
Publication of JP2006284433A publication Critical patent/JP2006284433A/ja
Publication of JP2006284433A5 publication Critical patent/JP2006284433A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2005106187A 2005-04-01 2005-04-01 外観検査装置及び外観検査方法 Pending JP2006284433A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005106187A JP2006284433A (ja) 2005-04-01 2005-04-01 外観検査装置及び外観検査方法
DE102006014812A DE102006014812A1 (de) 2005-04-01 2006-03-29 Sichtprüfeinrichtung und Sichtprüfverfahren
US11/396,173 US20060222232A1 (en) 2005-04-01 2006-03-30 Appearance inspection apparatus and appearance inspection method
KR1020060030295A KR100855100B1 (ko) 2005-04-01 2006-04-03 외관 검사 장치 및 외관 검사 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005106187A JP2006284433A (ja) 2005-04-01 2005-04-01 外観検査装置及び外観検査方法

Publications (2)

Publication Number Publication Date
JP2006284433A true JP2006284433A (ja) 2006-10-19
JP2006284433A5 JP2006284433A5 (enExample) 2008-04-24

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ID=37070543

Family Applications (1)

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JP2005106187A Pending JP2006284433A (ja) 2005-04-01 2005-04-01 外観検査装置及び外観検査方法

Country Status (4)

Country Link
US (1) US20060222232A1 (enExample)
JP (1) JP2006284433A (enExample)
KR (1) KR100855100B1 (enExample)
DE (1) DE102006014812A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009014409A (ja) * 2007-07-02 2009-01-22 Tokyo Electron Ltd 基板の欠陥検査方法及び欠陥検査プログラム
KR20190029484A (ko) * 2017-09-11 2019-03-20 어플라이드 머티리얼즈 이스라엘 리미티드 검사 레시피를 생성하는 방법 및 그 시스템
CN111220620A (zh) * 2020-03-09 2020-06-02 广东荣旭智能技术有限公司 一种机器视觉外观瑕疵检测装置及其瑕疵检测方法
WO2021084933A1 (ja) * 2019-10-30 2021-05-06 Ａｌｉｔｅｃｓ株式会社 検査装置、方法、及び、プログラム

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008002934A (ja) * 2006-06-22 2008-01-10 Tokyo Seimitsu Co Ltd 外観検査装置及び外観検査方法
JP5414215B2 (ja) * 2008-07-30 2014-02-12 株式会社日立ハイテクノロジーズ 回路パターン検査装置、および回路パターンの検査方法
SG175097A1 (en) * 2009-04-23 2011-12-29 Rudolph Technologies Inc Optical inspection optimization
US8908170B2 (en) * 2012-12-27 2014-12-09 Shenzhen China Star Optoelectronics Technology Co., Ltd. Method for detecting defect of display panel and related detecting device
KR101828536B1 (ko) * 2013-04-11 2018-02-12 한화테크윈 주식회사 패널 검사 방법 및 장치
JP6513982B2 (ja) * 2015-03-16 2019-05-15 株式会社東芝 欠陥検査装置並びに欠陥検査装置の管理方法及び管理装置
US10354375B2 (en) * 2016-06-29 2019-07-16 Ngr Inc. Method of utilizing information on shape of frequency distribution of inspection result in a pattern inspection apparatus
US11749569B2 (en) * 2020-05-06 2023-09-05 Taiwan Semiconductor Manufacturing Company, Ltd. Method for non-destructive inspection of cell etch redeposition
DE102020125929A1 (de) * 2020-05-06 2021-11-11 Taiwan Semiconductor Manufacturing Co., Ltd. Verfahren zur nicht destruktiven überprüfung parasitärer ätzabscheidungen auf zellen
KR102586394B1 (ko) * 2021-04-15 2023-10-11 (주)넥스틴 셀-대-셀 비교 방법
CN115294060A (zh) * 2022-08-05 2022-11-04 海尔数字科技(青岛)有限公司 电器设备的外观缺陷检测方法、装置、电子设备及介质

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01143938A (ja) * 1987-11-30 1989-06-06 Toshiba Corp 規則パターンの欠陥検出方法
JPH02253109A (ja) * 1989-03-28 1990-10-11 Toshiba Corp 欠陥判別装置
JPH06213821A (ja) * 1993-01-21 1994-08-05 Hitachi Ltd 半導体ウェハの異物検査装置
JP2000105203A (ja) * 1998-07-28 2000-04-11 Hitachi Ltd 欠陥検査装置およびその方法
JP2000171404A (ja) * 1998-12-02 2000-06-23 Tokyo Seimitsu Co Ltd 半導体集積装置のパターン検査装置及びパターン検査方法
JP2004144685A (ja) * 2002-10-28 2004-05-20 Hitachi Ltd 半導体デバイス製造ラインにおける外観検査装置の機差調整方法及びそのシステム
JP2004177397A (ja) * 2002-10-01 2004-06-24 Tokyo Seimitsu Co Ltd 画像欠陥検査方法、画像欠陥検査装置及び外観検査装置
JP2005072048A (ja) * 2003-08-27 2005-03-17 Nikon Corp データ管理装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10123064A (ja) 1996-10-24 1998-05-15 Hitachi Metals Ltd 外観検査方法
JPH1145919A (ja) 1997-07-24 1999-02-16 Hitachi Ltd 半導体基板の製造方法
JP3836988B2 (ja) 1999-01-06 2006-10-25 大日本スクリーン製造株式会社 パターン検査方法およびパターン検査装置
US6539106B1 (en) * 1999-01-08 2003-03-25 Applied Materials, Inc. Feature-based defect detection
JP2001304842A (ja) * 2000-04-25 2001-10-31 Hitachi Ltd パターン検査方法及びその装置並びに基板の処理方法
JP4017148B2 (ja) * 2002-09-05 2007-12-05 大日本スクリーン製造株式会社 パターン検査装置、歩留管理システム、パターン検査方法、基板製造方法およびプログラム
JP4033084B2 (ja) * 2003-09-01 2008-01-16 山崎製パン株式会社 物体表面に形成された凹部の認知方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01143938A (ja) * 1987-11-30 1989-06-06 Toshiba Corp 規則パターンの欠陥検出方法
JPH02253109A (ja) * 1989-03-28 1990-10-11 Toshiba Corp 欠陥判別装置
JPH06213821A (ja) * 1993-01-21 1994-08-05 Hitachi Ltd 半導体ウェハの異物検査装置
JP2000105203A (ja) * 1998-07-28 2000-04-11 Hitachi Ltd 欠陥検査装置およびその方法
JP2000171404A (ja) * 1998-12-02 2000-06-23 Tokyo Seimitsu Co Ltd 半導体集積装置のパターン検査装置及びパターン検査方法
JP2004177397A (ja) * 2002-10-01 2004-06-24 Tokyo Seimitsu Co Ltd 画像欠陥検査方法、画像欠陥検査装置及び外観検査装置
JP2004144685A (ja) * 2002-10-28 2004-05-20 Hitachi Ltd 半導体デバイス製造ラインにおける外観検査装置の機差調整方法及びそのシステム
JP2005072048A (ja) * 2003-08-27 2005-03-17 Nikon Corp データ管理装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009014409A (ja) * 2007-07-02 2009-01-22 Tokyo Electron Ltd 基板の欠陥検査方法及び欠陥検査プログラム
KR20190029484A (ko) * 2017-09-11 2019-03-20 어플라이드 머티리얼즈 이스라엘 리미티드 검사 레시피를 생성하는 방법 및 그 시스템
KR102079022B1 (ko) * 2017-09-11 2020-02-19 어플라이드 머티리얼즈 이스라엘 리미티드 검사 레시피를 생성하는 방법 및 그 시스템
WO2021084933A1 (ja) * 2019-10-30 2021-05-06 Ａｌｉｔｅｃｓ株式会社 検査装置、方法、及び、プログラム
JP2021072332A (ja) * 2019-10-30 2021-05-06 Ａｌｉｔｅｃｓ株式会社 検査装置、方法、及び、プログラム
JP7087221B2 (ja) 2019-10-30 2022-06-21 Ａｌｉｔｅｃｓ株式会社 検査装置、方法、及び、プログラム
CN111220620A (zh) * 2020-03-09 2020-06-02 广东荣旭智能技术有限公司 一种机器视觉外观瑕疵检测装置及其瑕疵检测方法

Also Published As

Publication number Publication date
KR20060106780A (ko) 2006-10-12
DE102006014812A1 (de) 2006-12-07
KR100855100B1 (ko) 2008-08-29
US20060222232A1 (en) 2006-10-05

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