JP2006269497A - 基板処理装置及び基板収納方法 - Google Patents

基板処理装置及び基板収納方法 Download PDF

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Publication number
JP2006269497A
JP2006269497A JP2005081607A JP2005081607A JP2006269497A JP 2006269497 A JP2006269497 A JP 2006269497A JP 2005081607 A JP2005081607 A JP 2005081607A JP 2005081607 A JP2005081607 A JP 2005081607A JP 2006269497 A JP2006269497 A JP 2006269497A
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JP
Japan
Prior art keywords
substrate
wafer
semiconductor wafer
unit
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005081607A
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English (en)
Japanese (ja)
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JP2006269497A5 (enExample
Inventor
Katsuyuki Hashimoto
勝行 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Priority to JP2005081607A priority Critical patent/JP2006269497A/ja
Priority to US11/377,509 priority patent/US7747343B2/en
Priority to CNB2006100570585A priority patent/CN100533704C/zh
Priority to TW095109170A priority patent/TWI417977B/zh
Publication of JP2006269497A publication Critical patent/JP2006269497A/ja
Publication of JP2006269497A5 publication Critical patent/JP2006269497A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2005081607A 2005-03-22 2005-03-22 基板処理装置及び基板収納方法 Withdrawn JP2006269497A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2005081607A JP2006269497A (ja) 2005-03-22 2005-03-22 基板処理装置及び基板収納方法
US11/377,509 US7747343B2 (en) 2005-03-22 2006-03-16 Substrate processing apparatus and substrate housing method
CNB2006100570585A CN100533704C (zh) 2005-03-22 2006-03-17 基片处理装置和基片容纳方法
TW095109170A TWI417977B (zh) 2005-03-22 2006-03-17 基材處理裝置與基材收納方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005081607A JP2006269497A (ja) 2005-03-22 2005-03-22 基板処理装置及び基板収納方法

Publications (2)

Publication Number Publication Date
JP2006269497A true JP2006269497A (ja) 2006-10-05
JP2006269497A5 JP2006269497A5 (enExample) 2008-05-01

Family

ID=37015718

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005081607A Withdrawn JP2006269497A (ja) 2005-03-22 2005-03-22 基板処理装置及び基板収納方法

Country Status (4)

Country Link
US (1) US7747343B2 (enExample)
JP (1) JP2006269497A (enExample)
CN (1) CN100533704C (enExample)
TW (1) TWI417977B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018190870A (ja) * 2017-05-09 2018-11-29 キヤノン株式会社 搬送装置、システム、および物品の製造方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8600150B2 (en) * 2006-02-13 2013-12-03 Samsung Electronics Co., Ltd. Wafer aligning apparatus and related method
JP4914761B2 (ja) * 2007-05-16 2012-04-11 オリンパス株式会社 外観検査装置
JP5303254B2 (ja) * 2008-12-15 2013-10-02 東京エレクトロン株式会社 異物除去方法及び記憶媒体
KR102238649B1 (ko) * 2014-09-16 2021-04-09 삼성전자주식회사 반도체 칩 본딩 장치
CN114235684A (zh) * 2020-09-09 2022-03-25 旺矽科技股份有限公司 巨观及微观检测设备及检测方法
KR102624577B1 (ko) * 2020-10-28 2024-01-15 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
TW202238803A (zh) * 2021-02-26 2022-10-01 日商東京威力科創股份有限公司 搬運系統、搬運裝置及搬運方法
JP7609676B2 (ja) * 2021-03-29 2025-01-07 東京エレクトロン株式会社 基板処理装置及び基板搬送位置調整方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07263518A (ja) 1994-03-18 1995-10-13 Fujitsu Ltd 半導体ウェハの搬送装置及び搬送方法並びに半導体ウェハ処理装置
JPH09102257A (ja) 1995-07-28 1997-04-15 Matsushita Electric Works Ltd 封止接点装置
US5822213A (en) * 1996-03-29 1998-10-13 Lam Research Corporation Method and apparatus for determining the center and orientation of a wafer-like object
US5980194A (en) * 1996-07-15 1999-11-09 Applied Materials, Inc. Wafer position error detection and correction system
TW350115B (en) * 1996-12-02 1999-01-11 Toyota Automatic Loom Co Ltd Misregistration detection device and method thereof
JP3932097B2 (ja) * 2000-04-27 2007-06-20 信越半導体株式会社 半導体ウエーハ及び半導体ウエーハの加工方法
US6327517B1 (en) * 2000-07-27 2001-12-04 Applied Materials, Inc. Apparatus for on-the-fly center finding and notch aligning for wafer handling robots
TW559855B (en) 2000-09-06 2003-11-01 Olympus Optical Co Wafer transfer apparatus
US6678055B2 (en) * 2001-11-26 2004-01-13 Tevet Process Control Technologies Ltd. Method and apparatus for measuring stress in semiconductor wafers
US6900877B2 (en) * 2002-06-12 2005-05-31 Asm American, Inc. Semiconductor wafer position shift measurement and correction
US20050151947A1 (en) * 2002-07-31 2005-07-14 Nikon Corporation Position measuring method, position control method, exposure method and exposure apparatus, and device manufacturing method
US7379785B2 (en) * 2002-11-28 2008-05-27 Tokyo Electron Limited Substrate processing system, coating/developing apparatus, and substrate processing apparatus
JP3880589B2 (ja) * 2004-03-31 2007-02-14 キヤノン株式会社 位置計測装置、露光装置及びデバイス製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018190870A (ja) * 2017-05-09 2018-11-29 キヤノン株式会社 搬送装置、システム、および物品の製造方法

Also Published As

Publication number Publication date
TW200703537A (en) 2007-01-16
US20060215152A1 (en) 2006-09-28
CN1838398A (zh) 2006-09-27
CN100533704C (zh) 2009-08-26
TWI417977B (zh) 2013-12-01
US7747343B2 (en) 2010-06-29

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