JP2006188622A - Epoxy resin composition and semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition which can highly be filled, little curves, has excellent solder crack resistance, and is suitable for sealing area mounting type semiconductor devices, and to provide a semiconductor device using the same. <P>SOLUTION: This resin composition for sealing semiconductors is characterized containing (A) an epoxy resin represented by general formula (1), (B) a crystalline epoxy resin represented by general formula (2), (C) a phenolic resin represented by general formula (3), (D) a curing accelerator, (E) an inorganic filler in an amount of 85 to 95 wt.% based on the total amount of the epoxy resin composition, (F) a silane coupling agent represented by general formula (4), and (G) polybutadiene having oxirane structures in the molecule, as essential components. The semiconductor device is characterized by mounting semiconductor elements on one side of a metal substrate and then sealing substantially only one semiconductor element-mounted side of the substrate with the epoxy resin composition. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an epoxy resin composition for semiconductor encapsulation and a semiconductor device, and in particular, an area mounting in which a semiconductor element is mounted on one side of a metal substrate and substantially only one side of the mounting surface side is resin-sealed. It is used suitably for a type semiconductor device.

  In recent years, the trend toward smaller, lighter, and higher performance electronic devices has led to the progress of higher integration of semiconductor elements and the promotion of surface mounting of semiconductor devices. Devices have been developed and are beginning to migrate from conventional semiconductor devices. With the downsizing and thinning of semiconductor devices, there is a demand for further lowering the viscosity and increasing the strength of the epoxy resin composition for sealing. In addition, due to environmental problems, there is an increasing demand for flame retardancy without using a flame retardant such as bromine compounds and antimony oxide. Against this background, the recent trend of epoxy resin compositions is becoming more likely to apply lower viscosity resins and incorporate more inorganic fillers. Also, as a new movement, when mounting semiconductor devices, the use of lead-free solder having a higher melting point than before is increasing. By applying this solder, it is necessary to raise the mounting temperature by about 20 ° C. compared to the conventional case, and there is a problem that the reliability of the semiconductor device after mounting is remarkably lowered compared to the current situation. For these reasons, the demand for improving the reliability of semiconductor devices by increasing the level of epoxy resin composition is acceleratingly strengthening, and it has spurred the reduction of resin viscosity and the increase of inorganic fillers. .

  Typical examples of area-mounted semiconductor devices include BGA (ball grid array) or CSP (chip scale package) in pursuit of further miniaturization, but in addition to this, conventional QFP and SOP such as QFN and SON are mounted. Some packages have a smaller area. QFN and SON have been manufactured with the same design as conventional QFP and SOP, but recently a semiconductor element on one side of a metal substrate (for example, a copper lead frame or a nickel palladium + gold plated lead frame overlaid with a polyimide film) Are packaged in a matrix, encapsulated with an epoxy resin composition for encapsulating, and then cut into a lattice shape of a predetermined size to produce individual packages (hereinafter MAP-QFN, MAP-SON) And expression) are increasing. (For example, refer to Patent Document 1.)

The structures of MAP-QFN and MAP-SON are in the form of single-side sealing in which only the semiconductor element mounting surface of the substrate is sealed with an epoxy resin composition. In this case, the area to be sealed is larger than that of normal package molding, and since it is one side, mismatch between thermal expansion and thermal shrinkage between the metal substrate and the cured product of the epoxy resin composition, or epoxy resin Due to the influence of curing shrinkage at the time of molding and curing of the composition, these semiconductor devices are likely to warp immediately after molding.
Further, when the semiconductor device is warped, the semiconductor device is lifted from the circuit board on which the semiconductor device is mounted, and there is a problem that the reliability of electrical connection is lowered.

In a semiconductor device in which only one surface on a metal substrate is sealed with an epoxy resin composition, in order to reduce warpage, the thermal expansion coefficient of the substrate and the thermal expansion coefficient of a cured product of the epoxy resin composition are brought close to each other. Two methods of reducing the shrinkage of curing at the time of molding and curing the epoxy resin composition are important.
As a countermeasure, a method has already been proposed in which Tg is increased by a combination of a polyfunctional epoxy resin and a polyfunctional phenol resin, and α1 is adjusted to match the blending amount of the inorganic filler. However, the combination of the polyfunctional epoxy resin and the polyfunctional phenol resin has problems such as poor fluidity and unfilled voids.

Also, when solder bonding is performed by means of soldering using means such as infrared reflow, vapor phase soldering, or solder dipping, moisture present in the semiconductor device is rapidly vaporized at high temperatures due to moisture absorption of the cured epoxy resin composition. The stress caused by the cracking of the semiconductor device may cause peeling at the interface between the semiconductor element mounting surface of the metal substrate and the cured product of the epoxy resin composition. The low stress of the epoxy resin composition High adhesion to metal substrates is also required, as well as low temperature, low moisture absorption, low warpage, high filling and high heat resistance.
In a conventional surface mount semiconductor device such as QFP or SOP, in order to maintain high viscosity and low viscosity at the time of molding, a method using a resin having a low melt viscosity (for example, refer to Patent Document 2), or inorganic. In order to increase the blending amount of the filler, a method of surface-treating the inorganic filler with a silane coupling agent is known (for example, see Patent Document 3). However, many of them satisfy only one of various required characteristics. In the area mounting type semiconductor sealing epoxy resin composition, there has been a demand for a technique that satisfies the reliability by using a resin excellent in high flow and low warpage and further increasing the blending amount of the inorganic filler.

JP 2003-109983 A (pages 2 to 7) JP-A-7-130919 (pages 2 to 5) JP-A-8-20673 (pages 2 to 4)

  The present invention has been made in order to solve the problems of the background art of the prior art, and the object of the present invention is to satisfy filling properties, molding and soldering processes without deteriorating curability and other characteristics. An object of the present invention is to provide an epoxy resin composition suitable for area mounting type semiconductor encapsulation (especially MAP-QFN or MAP-SON) having low warpage and remarkably excellent solder resistance, and a semiconductor device using the same.

The present invention
[1] (A) an epoxy resin represented by the general formula (1), (B) a crystalline epoxy resin represented by the general formula (2), (C) a phenol resin represented by the general formula (3), (D) a curing accelerator, (E) an inorganic filler of 85 to 95% by weight based on the total epoxy resin composition, (F) a silane coupling agent represented by the general formula (4), and (G) a molecule An epoxy resin composition for encapsulating a semiconductor comprising polybutadiene having an oxirane structure therein as an essential component, wherein the polybutadiene having an oxirane structure in the molecule has an oxirane oxygen content of 3 to 10%. Epoxy resin composition for stopping,

（Ｒ１、Ｒ２は水素又は炭素数１〜４のアルキル基で、互いに同一でも異なっていてもよい。ａは０〜３の整数、ｂは０〜４の整数。ｎは平均値で、１〜５の正数）

(R1 and R2 are hydrogen or an alkyl group having 1 to 4 carbon atoms and may be the same or different. A is an integer of 0 to 3, b is an integer of 0 to 4. n is an average value, A positive number of 5)

（Ｘは単結合、−Ｏ−、−Ｓ−、−Ｒ２ＣＲ２−の中から選択される基で、Ｒ１は炭素数１〜６のアルキル基で同一でも異なってもよい。ｍは０〜４の整数。Ｒ２は水素又は炭素数１〜４アルキル基で同一でも異なっていてもよい。）

(X is a group selected from a single bond, —O—, —S—, and —R 2 CR 2 —, and R 1 is an alkyl group having 1 to 6 carbon atoms, which may be the same or different. An integer, R2 is hydrogen or an alkyl group having 1 to 4 carbon atoms, which may be the same or different.

（Ｒ１、Ｒ２は水素又は炭素数１〜４のアルキル基で、互いに同一でも異なっていてもよい。ａは０〜３の整数、ｂは０〜４の整数。ｎは平均値で、１〜５の正数）

(R1 and R2 are hydrogen or an alkyl group having 1 to 4 carbon atoms and may be the same or different. A is an integer of 0 to 3, b is an integer of 0 to 4. n is an average value, A positive number of 5)

（Ｒ３は炭素数１〜１２の有機基。Ｒ４、Ｒ５、Ｒ６は炭素数１〜１２の炭化水素基。ｎは１〜３の整数。）

(R3 is an organic group having 1 to 12 carbon atoms. R4, R5 and R6 are hydrocarbon groups having 1 to 12 carbon atoms. N is an integer of 1 to 3)

[2] The epoxy resin composition for semiconductor encapsulation according to [1], wherein the polybutadiene having an oxirane structure in the molecule has a viscosity at 25 ° C. of 20 to 700 Pa · s,
[3] A semiconductor device comprising a semiconductor element encapsulated with the epoxy resin composition for encapsulating a semiconductor according to [1] or [2],
[4] A resin composition in which a semiconductor element is mounted on one side of a metal substrate and used for sealing substantially only one side of the mounting surface side on which the semiconductor element is mounted, and (A) General formula (1) (B) a crystalline epoxy resin represented by the general formula (2), (C) a phenol resin represented by the general formula (3), (D) a curing accelerator, (E) all 85 to 95% by weight of an inorganic filler based on the epoxy resin composition, (F) a silane coupling agent represented by the general formula (4), and (G) a polybutadiene having an oxirane structure in the molecule. An area mounting type semiconductor sealing epoxy resin composition characterized in that the oxirane oxygen content of polybutadiene having an oxirane structure in the molecule is 3 to 10%. object,

（Ｒ１、Ｒ２は水素又は炭素数１〜４のアルキル基で、互いに同一でも異なっていてもよい。ａは０〜３の整数、ｂは０〜４の整数。ｎは平均値で、１〜５の正数）

(R1 and R2 are hydrogen or an alkyl group having 1 to 4 carbon atoms and may be the same or different. A is an integer of 0 to 3, b is an integer of 0 to 4. n is an average value, A positive number of 5)

（Ｘは単結合、−Ｏ−、−Ｓ−、−Ｒ２ＣＲ２−の中から選択される基で、Ｒ１は炭素数１〜６のアルキル基で同一でも異なってもよい。ｍは０〜４の整数。Ｒ２は水素又は炭素数１〜４アルキル基で同一でも異なっていてもよい。）

(X is a group selected from a single bond, —O—, —S—, and —R 2 CR 2 —, and R 1 is an alkyl group having 1 to 6 carbon atoms, which may be the same or different. An integer, R2 is hydrogen or an alkyl group having 1 to 4 carbon atoms, which may be the same or different.

（Ｒ１、Ｒ２は水素又は炭素数１〜４のアルキル基で、互いに同一でも異なっていてもよい。ａは０〜３の整数、ｂは０〜４の整数。ｎは平均値で、１〜５の正数）

(R1 and R2 are hydrogen or an alkyl group having 1 to 4 carbon atoms and may be the same or different. A is an integer of 0 to 3, b is an integer of 0 to 4. n is an average value, A positive number of 5)

（Ｒ３は炭素数１〜１２の有機基。Ｒ４、Ｒ５、Ｒ６は炭素数１〜１２の炭化水素基。ｎは１〜３の整数。）

(R3 is an organic group having 1 to 12 carbon atoms. R4, R5 and R6 are hydrocarbon groups having 1 to 12 carbon atoms. N is an integer of 1 to 3)

[5] The epoxy resin composition for semiconductor encapsulation according to item [4], wherein the polybutadiene having an oxirane structure in the molecule has a viscosity at 25 ° C. of 20 to 700 Pa · s,
[6] An epoxy resin composition for encapsulating a semiconductor according to [4] or [5], wherein a semiconductor element is mounted on one side of a metal substrate, and substantially only one side of the mounting surface side on which the semiconductor element is mounted. An area mounting type semiconductor device, characterized by being sealed using
It is.

  According to the present invention, high filling, low warpage, and solder resistance characteristics that could not be obtained by conventional techniques can be obtained, and in particular, an epoxy resin composition for area mounting type semiconductor encapsulation such as MAP-QFN and MAP-SON and the like It is suitable as a semiconductor device using

The present invention includes (A) an epoxy resin represented by general formula (1), (B) a crystalline epoxy resin represented by general formula (2), and (C) a phenol resin represented by general formula (3). , (D) a curing accelerator, (E) an inorganic filler of 85 to 95% by weight based on the total epoxy resin composition, (F) a silane coupling agent represented by the general formula (4), and (G) A semiconductor sealing epoxy resin composition comprising polybutadiene having an oxirane structure in the molecule as an essential component, wherein the butadiene has an oxirane oxygen content of 3 to 10%. By using the epoxy resin composition for sealing, the epoxy resin composition and a semiconductor device using the epoxy resin composition have a remarkable effect of high filling, low warpage, and excellent solder resistance.
Hereinafter, the present invention will be described in detail.

The epoxy resin represented by the general formula (1) used in the present invention has a hydrophobic and rigid biphenylene skeleton between epoxy groups, and a cured product of an epoxy resin composition using the epoxy resin has a moisture absorption rate. It has a low elastic modulus in a high temperature range exceeding the glass transition temperature (hereinafter referred to as Tg), and is excellent in adhesion to a semiconductor element, an organic substrate, and a metal substrate. Moreover, it has the characteristic that heat resistance is high although a crosslinking density is low.
In the general formula (1), n is an average value and is a positive number of 1 to 5, preferably a positive number of 1 to 3. When n is less than the lower limit, the curability of the epoxy resin composition may be lowered. When n exceeds the upper limit, the viscosity increases and the fluidity of the epoxy resin composition may be reduced. The epoxy resin (A) represented by the general formula (1) includes, for example, a phenol biphenyl aralkyl type epoxy resin, but is not particularly limited as long as it has the structure of the formula (1).

（Ｒ１、Ｒ２は水素又は炭素数１〜４のアルキル基で、互いに同一でも異なっていてもよい。ａは０〜３の整数、ｂは０〜４の整数。ｎは平均値で、１〜５の正数）

(R1 and R2 are hydrogen or an alkyl group having 1 to 4 carbon atoms and may be the same or different. A is an integer of 0 to 3, b is an integer of 0 to 4. n is an average value, A positive number of 5)

  The crystalline epoxy resin represented by the general formula (2) used in the present invention is a crystalline solid at room temperature, but becomes a very low-viscosity liquid at a melting point or higher and can be highly filled with an inorganic filler. The epoxy resin composition using the has excellent solder resistance. Examples of the crystalline epoxy resin represented by the general formula (2) include a bisphenol A type epoxy resin, but are not particularly limited as long as the structure is the general formula (2).

（Ｘは単結合、−Ｏ−、−Ｓ−、−Ｒ２ＣＲ２−の中から選択される基で、Ｒ１は炭素数１〜６のアルキル基で同一でも異なってもよい。ｍは０〜４の整数。Ｒ２は水素又は炭素数１〜４アルキル基で同一でも異なってもよい。）

(X is a group selected from a single bond, —O—, —S—, and —R 2 CR 2 —, and R 1 is an alkyl group having 1 to 6 carbon atoms, which may be the same or different. An integer, R2 is hydrogen or an alkyl group having 1 to 4 carbon atoms which may be the same or different.

  In the present invention, other epoxy resins may be used in combination as long as the characteristics of the epoxy resin represented by the general formula (1) and the crystalline epoxy resin represented by the general formula (2) are not impaired. . Examples of the epoxy resin that can be used in combination include monomers, oligomers, and polymers having an epoxy group in the molecule. For example, phenol novolac type epoxy resin, orthocresol novolak type epoxy resin, naphthol novolak type epoxy resin, phenol aralkyl type epoxy resin having phenylene skeleton, naphthol aralkyl type epoxy resin (having phenylene skeleton, biphenyl skeleton, etc.), dicyclopentadiene Examples include modified phenol type epoxy resins, stilbene type epoxy resins, triphenol methane type epoxy resins, alkyl modified triphenol methane type epoxy resins, triazine nucleus-containing epoxy resins, etc. These may be used alone or in combination of two or more. May be used in combination. As a compounding quantity in the case of using together another epoxy resin, the total amount of the epoxy resin shown by General formula (1) and the epoxy resin shown by General formula (2) with respect to all the epoxy resins is 70- It is preferably 100% by weight. When the total amount of the epoxy resin represented by the general formula (1) and the epoxy resin represented by the general formula (2) is less than the lower limit value, the moisture absorption rate may be increased and the crack resistance may be decreased.

The phenol resin represented by the general formula (3) used in the present invention has a hydrophobic and rigid biphenylene skeleton between phenolic hydroxyl groups, and a cured product of an epoxy resin composition using the phenol resin has a moisture absorption rate. Low, elastic modulus in a high temperature range exceeding Tg is low, and excellent adhesion to semiconductor elements, organic substrates, and metal substrates. Moreover, it has the characteristic that heat resistance is high although a crosslinking density is low. Therefore, a semiconductor device sealed with a resin composition using this phenol resin is excellent in crack resistance.
In the general formula (3), n is an average value and is a positive number of 1 to 5, preferably a positive number of 1 to 3. When n is less than the lower limit, the curability of the epoxy resin composition may be lowered. When n exceeds the upper limit, the viscosity becomes high and the fluidity of the epoxy resin composition may be lowered. The phenol resin represented by the general formula (2) may be used alone or in combination of two or more.
Examples of the phenol resin represented by the general formula (3) include a phenol biphenyl aralkyl resin, but are not particularly limited as long as the structure is represented by the general formula (3).

（Ｒ１、Ｒ２は水素又は炭素数１〜４のアルキル基で、互いに同一でも異なっていてもよい。ａは０〜３の整数、ｂは０〜４の整数。ｎは平均値で、１〜５の正数）

(R1 and R2 are hydrogen or an alkyl group having 1 to 4 carbon atoms and may be the same or different. A is an integer of 0 to 3, b is an integer of 0 to 4. n is an average value, A positive number of 5)

  You may use together other phenol resin in the range which does not impair the characteristic by using the phenol resin shown by General formula (3) used by this invention. When used in combination, it is desirable to use monomers, oligomers, and polymers having a phenolic hydroxyl group in the molecule and those having a low viscosity as much as possible. Naphthol aralkyl resin, triphenol methane resin, terpene modified phenol resin, dicyclopentadiene modified phenol resin, and the like. These may be used alone or in combination of two or more. In consideration of moisture resistance reliability as an epoxy resin composition for semiconductor encapsulation, it is preferable that Na ions and Cl ions, which are ionic impurities, be as small as possible. When the other phenol resin is used in combination, the amount of the phenol resin represented by the general formula (3) is preferably 70 to 100% by weight with respect to the total phenol resin. When the blending amount of the phenol resin represented by the general formula (3) is less than the lower limit, there is a possibility that the moisture absorption rate increases, the adhesion with the base material after the soldering treatment and the solder resistance decrease.

  The equivalent ratio of the epoxy groups of all epoxy resins to the phenolic hydroxyl groups of the phenol resin is preferably in the range of the number of epoxy groups / the number of phenolic hydroxyl groups = 0.7 to 1.5. This is not preferable because it may cause a decrease in properties, a decrease in glass transition temperature of a cured product, a decrease in moisture resistance reliability, and the like. When the epoxy resin represented by the general formula (1), the epoxy resin represented by the general formula (2), and the phenol resin represented by the general formula (3) are used in combination, the resistance to soldering after moisture absorption is improved. The highest effect is obtained in terms of cracking properties, warpage, and the like.

  The curing accelerator used in the present invention is not particularly limited as long as it accelerates the reaction between an epoxy group and a phenolic hydroxyl group. For example, a diastere such as 1,8-diazabicyclo (5,4,0) undecene-7 is used. Zabicycloalkene and its derivatives, organic phosphines such as triphenylphosphine and methyldiphenylphosphine, tetraphenylphosphonium / tetraphenylborate, tetraphenylphosphonium / tetrabenzoic acid borate, tetraphenylphosphonium / tetranaphthoic acid borate, tetraphenylphosphonium -Tetranaphthoyloxyborate, tetrasubstituted phosphonium such as tetraphenylphosphonium, tetranaphthyloxyborate, tetrasubstituted borate, and the like. These may be used alone or in combination of two or more. It may be used in combination.

  As an inorganic filler used by this invention, what is generally used for the epoxy resin composition for semiconductor sealing can be used. For example, fused spherical silica, fused crushed silica, crystalline silica, talc, alumina, titanium white, silicon nitride and the like can be mentioned, and the most suitably used is fused spherical silica. These inorganic fillers may be used alone or in combination. These may be surface-treated with a coupling agent. The shape of the inorganic filler is preferably as spherical as possible and the particle size distribution is broad in order to improve fluidity. The compounding quantity of the inorganic filler used by this invention is 85 to 95 weight% in all the epoxy resin compositions, Preferably it is 87 to 93 weight%. Below the lower limit, low hygroscopicity and low thermal expansibility cannot be obtained, solder resistance may be insufficient, and warpage may increase, which is not preferable. Exceeding the upper limit is not preferable because the fluidity may be reduced, resulting in poor filling during molding or inconveniences such as deformation of the gold wire in the semiconductor device due to increased viscosity.

  In the present invention, the silane coupling agent represented by the general formula (4) is essential. When the silane coupling agent represented by the general formula (4) is used, an effect that the viscosity of the epoxy resin composition is lowered and the fluidity is improved is obtained. The silane coupling agent represented by General formula (4) may be used individually by 1 type, or may use 2 or more types together. Moreover, although a compounding quantity is not specifically limited, It is 0.05 to 1 weight% in all the epoxy resin compositions, More preferably, it is 0.1 to 0.8 weight%. If the blending amount of the silane coupling agent represented by the general formula (4) is less than the above lower limit value, the expected adhesion and fluidity may not be obtained. May be reduced. Moreover, as long as the effect by using the silane coupling agent represented by General formula (4) is not impaired, another coupling agent may be used together. Examples of coupling agents that can be used in combination include silane coupling agents such as epoxy silane, mercaptosilane, amino silane, alkyl silane, ureido silane, and vinyl silane, titanate coupling agents, aluminum coupling agents, aluminum / zirconium coupling agents, and the like. Is mentioned.

（Ｒ３は炭素数１〜１２の有機基。Ｒ４、Ｒ５、Ｒ６は炭素数１〜１２の炭化水素基。ｎは１〜３の整数。）

(R3 is an organic group having 1 to 12 carbon atoms. R4, R5 and R6 are hydrocarbon groups having 1 to 12 carbon atoms. N is an integer of 1 to 3)

  In the present invention, polybutadiene having an oxirane structure in the molecule is essential. If this is used, the adhesiveness of an epoxy resin composition and a metal substrate (nickel-palladium, nickel-palladium-gold plating, etc.) will improve, and the effect of high reflow heat resistance will be acquired. The amount of oxirane oxygen of polybutadiene having an oxirane structure in the molecule affects the adhesion. The amount of oxirane oxygen obtained by the measurement based on the standard oil and fat analysis test method (oxirane oxygen) is 3 to 10%, more preferably 5 to 8%. If it falls below the lower limit, the adhesiveness is lowered, and if it exceeds the upper limit, the fluidity is lowered and the possibility of being unfilled is high. The viscosity of the polybutadiene having an oxirane structure in the molecule affects the viscosity of the resin composition for semiconductor encapsulation. The viscosity at 25 ° C. obtained by measurement according to JIS Z-8803 is 20 to 700 Pa · s, more preferably 50 to 500 Pa · s. If it deviates from the above upper and lower limit values, fluidity, adhesion and warpage as expected cannot be obtained. The blending amount is 0.05 to 1.5% by weight, preferably 0.1 to 1% by weight. If it falls below the lower limit, the adhesiveness is lowered, and if it exceeds the upper limit, the fluidity is lowered and the possibility of being unfilled is high. Further, other low stress agents may be used in combination as long as the effect of using polybutadiene having an oxirane structure in the molecule represented by the general formula (5) is not impaired. Examples of the low stress agent that can be used in combination include silicone oils such as organopolysiloxanes, and rubbers that are solid at room temperature such as silicone rubbers and acrylonitrile rubbers.

（ｋ、ｌ、ｍ、ｎは１〜５０の整数であり、Ｒ７はＣ_ｐＨ_ｑで示される構造を有し、ｐは０〜１０の整数、ｑは１〜２１の整数。）

(K, l, m, and n are integers of 1 to 50, R7 has a structure represented by C _p H _q , p is an integer of 0 to 10, and q is an integer of 1 to 21.)

  In addition to the components (A) to (G), the epoxy resin composition of the present invention includes, as necessary, natural wax such as carnauba wax, synthetic wax such as polyethylene wax, higher fatty acid such as stearic acid and zinc stearate and the like. Release agents such as metal salts or paraffin, colorants such as carbon black and bengara, brominated epoxy resins, antimony trioxide, aluminum hydroxide, magnesium hydroxide, zinc borate, zinc molybdate, phosphazene and other flame retardants, oxidation Various additives such as inorganic ion exchangers such as bismuth hydrate, low stress components such as silicone oil and rubber, and antioxidants can be appropriately blended.

The epoxy resin composition used in the present invention is obtained by mixing the components (A) to (G) and other additives at room temperature using a mixer, melt-kneading with a kneader such as an extruder such as a roll or kneader, and cooling. Obtained by post-grinding.
In order to seal an electronic component such as a semiconductor element and manufacture a semiconductor device using the epoxy resin composition of the present invention, it can be cured by a conventional molding method such as transfer molding, compression molding, injection molding, etc. Good. In particular, the epoxy resin composition of the present invention is optimal for area mounting type semiconductor devices.

EXAMPLES Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited by these Examples. The blending ratio is parts by weight.
Example 1
Epoxy resin 1: phenol biphenyl aralkyl type epoxy resin (Nippon Kayaku Co., Ltd., NC3000P, epoxy equivalent 274, softening point 58 ° C.) 1.47 parts by weight Epoxy resin 2: bisphenol A type crystalline epoxy resin (Japan epoxy resin) Manufactured by YL6810, epoxy equivalent 171 and melting point 45 ° C.) 3.41 parts by weight Phenol resin 1: phenol biphenyl aralkyl resin (Maywa Kasei Co., Ltd., MEH-7851SS, hydroxyl equivalent 203, softening point 65 ° C.) 5 .12 parts by weight Triphenylphosphine 0.15 parts by weight Spherical fused silica (average particle size 30 μm) 88.85 parts by weight Polybutadiene 1 (viscosity at 25 ° C .: 350 Pa · s, oxirane oxygen content: 6.5%)
0.30 part by weight N-phenyl γ-aminopropyltrimethoxysilane 0.20 part by weight Carnauba wax 0.20 part by weight Carbon black 0.30 part by weight is mixed with a mixer at room temperature, and two rolls at 70 to 120 ° C. And kneaded after cooling to obtain an epoxy resin composition. The obtained epoxy resin composition was evaluated by the following methods. The results are shown in Table 1.

Evaluation method Spiral flow: Using a mold for spiral flow measurement according to EMMI-1-66, measurement was performed at a mold temperature of 175 ° C., an injection pressure of 6.9 MPa, and a curing time of 120 seconds. The unit is cm.
MAP molding (unfilled void): MAP-QFN (metal substrate is nickel-palladium-gold plated on a copper frame with a mold temperature of 175 ° C., injection pressure of 6.9 MPa, curing time of 90 seconds, using a transfer molding machine. The size of the encapsulated part is 45 mm × 62 mm, the thickness is 0.65 mm, the size of the separated semiconductor device (QFN-16L) is 4.0 mm × 4.0 mm, the size of the semiconductor element is 1.5 mm × 1.5 mm, Thickness 0.2 mm Passivation type is SiN) and the number of unfilled voids is counted.
Package warpage: For the longitudinal direction of MAP-QFN molded in the evaluation of MAP molding (unfilled voids), measure the displacement in the height direction using a surface roughness meter, and use the largest displacement difference as the package warpage It was. The unit is μm.
Solder crack resistance: The MAP-QFN was molded, post-cured at 175 ° C. for 4 hours, and then cut into individual pieces to obtain a semiconductor device (QFN-16L) sample. Each of the 20 samples was separately treated at 60 ° C. and 60% relative humidity for 120 hours and 85 ° C. and 60% relative humidity for 168 hours, and then treated with IR reflow (260 ° C.) for 10 seconds. did. Observation was made using an ultrasonic flaw detector and the presence or absence of various interface peelings was examined. When the number of defective packages (those with peeling) is n, n / 20 is displayed.

Examples 2-12, Comparative Examples 1-9
According to the composition of Table 1 and Table 2, an epoxy resin composition was produced in the same manner as in Example 1 and evaluated in the same manner as in Example 1. The evaluation results are shown in Tables 1 and 2. The components used in other than Example 1 are shown below.
Epoxy resin 3: biphenyl type epoxy resin (manufactured by Japan Epoxy Resin Co., Ltd., YX4000K, softening point 105 ° C., epoxy equivalent 185)

Phenol resin 2: Phenol aralkyl resin (Mitsui Chemicals, XLC-LL, softening point 75 ° C., hydroxyl equivalent 175)
γ-glycidylpropyltrimethoxysilane polybutadiene 2-6
Table 3 shows the oxirane oxygen content and the viscosity at 25 ° C. of polybutadiene.

  A semiconductor device using the epoxy resin for semiconductor encapsulation obtained according to the present invention has a small amount of warpage and excellent solder crack resistance. Therefore, an epoxy for semiconductor encapsulation obtained by the present invention is applied to a so-called area mounting type semiconductor device in which a semiconductor element is mounted on one side of a metal lead frame and only one side of the mounting surface side is resin-sealed. By applying the resin, it is possible to improve its reliability.

Claims (6)

(A) an epoxy resin represented by general formula (1), (B) a crystalline epoxy resin represented by general formula (2), (C) a phenol resin represented by general formula (3), (D) A curing accelerator, (E) 85 to 95% by weight of an inorganic filler based on the total epoxy resin composition, (F) a silane coupling agent represented by the general formula (4), and (G) an oxirane in the molecule. An epoxy resin composition for encapsulating a semiconductor comprising a polybutadiene having a structure as an essential component, wherein the oxirane oxygen content of the polybutadiene having an oxirane structure in the molecule is 3 to 10% Resin composition.

(R1 and R2 are hydrogen or an alkyl group having 1 to 4 carbon atoms and may be the same or different. A is an integer of 0 to 3, b is an integer of 0 to 4. n is an average value, A positive number of 5)

(X is a group selected from a single bond, —O—, —S—, and —R 2 CR 2 —, and R 1 is an alkyl group having 1 to 6 carbon atoms, which may be the same or different. An integer, R2 is hydrogen or an alkyl group having 1 to 4 carbon atoms, which may be the same or different.

(R1 and R2 are hydrogen or an alkyl group having 1 to 4 carbon atoms and may be the same or different. A is an integer of 0 to 3, b is an integer of 0 to 4. n is an average value, A positive number of 5)

(R3 is an organic group having 1 to 12 carbon atoms. R4, R5 and R6 are hydrocarbon groups having 1 to 12 carbon atoms. N is an integer of 1 to 3) The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein the polybutadiene having an oxirane structure in the molecule has a viscosity at 25 ° C of 20 to 700 Pa · s.   A semiconductor device obtained by sealing a semiconductor element using the epoxy resin composition for semiconductor sealing according to claim 1. A semiconductor element is mounted on one side of a metal substrate, and is used for sealing only substantially one side of the mounting surface side on which the semiconductor element is mounted. (A) An epoxy represented by the general formula (1) Resin, (B) Crystalline epoxy resin represented by general formula (2), (C) Phenol resin represented by general formula (3), (D) Curing accelerator, (E) In all epoxy resin compositions Area mounting type semiconductor comprising 85 to 95% by weight of inorganic filler, (F) silane coupling agent represented by general formula (4), and (G) polybutadiene having an oxirane structure in the molecule as essential components An epoxy resin composition for sealing an area mounting type semiconductor, characterized in that the oxirane oxygen content of a polybutadiene having an oxirane structure in the molecule is 3 to 10%.

(R1 and R2 are hydrogen or an alkyl group having 1 to 4 carbon atoms and may be the same or different. A is an integer of 0 to 3, b is an integer of 0 to 4. n is an average value, A positive number of 5)

(X is a group selected from a single bond, —O—, —S—, and —R 2 CR 2 —, and R 1 is an alkyl group having 1 to 6 carbon atoms, which may be the same or different. An integer, R2 is hydrogen or an alkyl group having 1 to 4 carbon atoms, which may be the same or different.

(R1 and R2 are hydrogen or an alkyl group having 1 to 4 carbon atoms and may be the same or different. A is an integer of 0 to 3, b is an integer of 0 to 4. n is an average value, A positive number of 5)

(R3 is an organic group having 1 to 12 carbon atoms. R4, R5 and R6 are hydrocarbon groups having 1 to 12 carbon atoms. N is an integer of 1 to 3)   The epoxy resin composition for semiconductor encapsulation according to claim 4, wherein the polybutadiene having an oxirane structure in the molecule has a viscosity at 25 ° C of 20 to 700 Pa · s.   A semiconductor element is mounted on one side of a metal substrate, and only one side of the mounting surface side on which the semiconductor element is mounted is sealed using the epoxy resin composition according to claim 4 or 5. An area-mounted semiconductor device.