JP2006134912A - 半導体モジュールおよびその製造方法、ならびにフィルムインターポーザ - Google Patents

半導体モジュールおよびその製造方法、ならびにフィルムインターポーザ Download PDF

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JP2006134912A
JP2006134912A JP2004318891A JP2004318891A JP2006134912A JP 2006134912 A JP2006134912 A JP 2006134912A JP 2004318891 A JP2004318891 A JP 2004318891A JP 2004318891 A JP2004318891 A JP 2004318891A JP 2006134912 A JP2006134912 A JP 2006134912A
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semiconductor
semiconductor module
insulating resin
resin layer
film member
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JP2004318891A
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Japanese (ja)
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JP2006134912A5 (enExample
Inventor
Yasuharu Karashima
靖治 辛島
Yoshihisa Yamashita
嘉久 山下
Seiichi Nakatani
誠一 中谷
Toshiyuki Kojima
俊之 小島
Shingo Komatsu
慎五 小松
Satoru Tomekawa
悟 留河
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Priority to JP2004318891A priority Critical patent/JP2006134912A/ja
Priority to US11/262,758 priority patent/US20060091524A1/en
Publication of JP2006134912A publication Critical patent/JP2006134912A/ja
Publication of JP2006134912A5 publication Critical patent/JP2006134912A5/ja
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JPWO2013168196A1 (ja) * 2012-05-10 2015-12-24 ユニテクノ株式会社 半導体搬送テスト治具

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DE102006032073B4 (de) * 2006-07-11 2016-07-07 Intel Deutschland Gmbh Elektrisch leitfähiger Verbund aus einem Bauelement und einer Trägerplatte
TWI375999B (en) * 2007-06-07 2012-11-01 Advanced Semiconductor Eng Substrate with bumps process and structure
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US9570376B2 (en) 2010-06-29 2017-02-14 General Electric Company Electrical interconnect for an integrated circuit package and method of making same
US8653670B2 (en) 2010-06-29 2014-02-18 General Electric Company Electrical interconnect for an integrated circuit package and method of making same
DE102011077614B4 (de) * 2011-06-16 2023-08-17 Osram Gmbh Verfahren zur Herstellung einer Leuchtvorrichtung und Leuchtvorrichtung
JP5985846B2 (ja) * 2011-06-29 2016-09-06 Ｆｌｅｘｃｅｅｄ株式会社 発光素子搭載用基板及びｌｅｄパッケージ
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KR100298827B1 (ko) * 1999-07-09 2001-11-01 윤종용 재배선 기판을 사용한 웨이퍼 레벨 칩 스케일 패키지 제조방법
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JPWO2013168196A1 (ja) * 2012-05-10 2015-12-24 ユニテクノ株式会社 半導体搬送テスト治具
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