JP2006128476A5 - - Google Patents

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Publication number
JP2006128476A5
JP2006128476A5 JP2004316407A JP2004316407A JP2006128476A5 JP 2006128476 A5 JP2006128476 A5 JP 2006128476A5 JP 2004316407 A JP2004316407 A JP 2004316407A JP 2004316407 A JP2004316407 A JP 2004316407A JP 2006128476 A5 JP2006128476 A5 JP 2006128476A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2004316407A
Other versions
JP2006128476A (ja
JP4260721B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2004316407A priority Critical patent/JP4260721B2/ja
Priority claimed from JP2004316407A external-priority patent/JP4260721B2/ja
Priority to TW094101155A priority patent/TWI265583B/zh
Priority to US11/037,266 priority patent/US7513032B2/en
Priority to CN2005100083433A priority patent/CN1770974B/zh
Publication of JP2006128476A publication Critical patent/JP2006128476A/ja
Publication of JP2006128476A5 publication Critical patent/JP2006128476A5/ja
Application granted granted Critical
Publication of JP4260721B2 publication Critical patent/JP4260721B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2004316407A 2004-10-29 2004-10-29 電子部品の基板実装方法、及び基板実装装置 Expired - Fee Related JP4260721B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004316407A JP4260721B2 (ja) 2004-10-29 2004-10-29 電子部品の基板実装方法、及び基板実装装置
TW094101155A TWI265583B (en) 2004-10-29 2005-01-14 Method of and apparatus for mounting an electronic part to a substrate
US11/037,266 US7513032B2 (en) 2004-10-29 2005-01-19 Method of mounting an electronic part to a substrate
CN2005100083433A CN1770974B (zh) 2004-10-29 2005-02-17 将电子元件安装至基板的装置和方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004316407A JP4260721B2 (ja) 2004-10-29 2004-10-29 電子部品の基板実装方法、及び基板実装装置

Publications (3)

Publication Number Publication Date
JP2006128476A JP2006128476A (ja) 2006-05-18
JP2006128476A5 true JP2006128476A5 (ja) 2009-02-26
JP4260721B2 JP4260721B2 (ja) 2009-04-30

Family

ID=36260889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004316407A Expired - Fee Related JP4260721B2 (ja) 2004-10-29 2004-10-29 電子部品の基板実装方法、及び基板実装装置

Country Status (4)

Country Link
US (1) US7513032B2 (ja)
JP (1) JP4260721B2 (ja)
CN (1) CN1770974B (ja)
TW (1) TWI265583B (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060057763A1 (en) * 2004-09-14 2006-03-16 Agency For Science, Technology And Research Method of forming a surface mountable IC and its assembly
JP4218037B2 (ja) * 2006-06-06 2009-02-04 株式会社九州ノゲデン 被検体欠陥部等の検出装置
US7677431B2 (en) * 2006-10-19 2010-03-16 Asm Technology Singapore Pte Ltd. Electronic device handler for a bonding apparatus
WO2009060705A1 (ja) * 2007-11-09 2009-05-14 Fuji Machine Mfg. Co., Ltd. 電気回路部品装着方法およびシステム
JP5577703B2 (ja) * 2008-01-25 2014-08-27 富士通株式会社 部品実装方法
JP5760212B2 (ja) * 2008-06-12 2015-08-05 株式会社アドウェルズ 実装装置および実装方法
JP4952683B2 (ja) * 2008-08-19 2012-06-13 パナソニック株式会社 基板搬出装置
JP4840422B2 (ja) * 2008-09-04 2011-12-21 パナソニック株式会社 電子部品実装用装置及び電子部品実装用装置による作業方法
JP5277894B2 (ja) * 2008-11-19 2013-08-28 富士通株式会社 樹脂塗布方法及び樹脂塗布装置
KR20110037646A (ko) * 2009-10-07 2011-04-13 삼성전자주식회사 반도체 다이 본딩 장치
CN103797569A (zh) * 2011-07-06 2014-05-14 弗莱克斯电子有限责任公司 金属凸块的焊料沉积系统和方法
CN102723296A (zh) * 2012-05-11 2012-10-10 哈尔滨工业大学 一种双层直线电机驱动的xy运动平台
CN102723298A (zh) * 2012-05-11 2012-10-10 哈尔滨工业大学 一种电磁预紧xy精密运动平台
CN102723297A (zh) * 2012-05-11 2012-10-10 哈尔滨工业大学 一种具有末端负载支撑且结构对称的xy精密运动平台
US9232630B1 (en) 2012-05-18 2016-01-05 Flextronics Ap, Llc Method of making an inlay PCB with embedded coin
KR101619782B1 (ko) * 2015-04-14 2016-05-12 제엠제코(주) 반도체 기판의 초음파 웰딩 접합 장치
JP6442363B2 (ja) * 2015-06-09 2018-12-19 新電元工業株式会社 搬送装置
US10882298B2 (en) * 2016-11-07 2021-01-05 Asm Technology Singapore Pte Ltd System for adjusting relative positions between components of a bonding apparatus
CN107324032A (zh) * 2017-06-30 2017-11-07 太仓井林机械科技有限公司 一种转接机构

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3566207A (en) * 1969-05-19 1971-02-23 Singer Co Silicon-to-gold bonded structure and method of making the same
JP3301880B2 (ja) * 1995-01-17 2002-07-15 松下電器産業株式会社 部品装着方法及び装置
JP3425492B2 (ja) * 1995-08-18 2003-07-14 松下電器産業株式会社 半導体実装方法およびその装置
JP3132353B2 (ja) * 1995-08-24 2001-02-05 松下電器産業株式会社 チップの搭載装置および搭載方法
JP2915350B2 (ja) 1996-07-05 1999-07-05 株式会社アルテクス 超音波振動接合チップ実装装置
JPH11288975A (ja) 1998-04-03 1999-10-19 Toshiba Corp ボンディング方法及びボンディング装置
JP3942738B2 (ja) * 1998-07-17 2007-07-11 松下電器産業株式会社 バンプ接合装置及び方法、並びに半導体部品製造装置
JP2000151551A (ja) 1998-11-09 2000-05-30 Mitsubishi Electric Corp 受信装置
JP2001077524A (ja) * 1999-09-03 2001-03-23 Fujitsu Ltd リフロー半田付け装置及びリフロー半田付け方法
JP2001244279A (ja) * 2000-02-25 2001-09-07 Nec Niigata Ltd 基板の供給方法、基板供給装置、チップ供給装置およびチップ実装装置
JP4371619B2 (ja) * 2001-09-21 2009-11-25 パナソニック株式会社 リフロー装置
US6724091B1 (en) * 2002-10-24 2004-04-20 Intel Corporation Flip-chip system and method of making same

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