JP2006124494A - 樹脂組成物及び銅張積層板 - Google Patents
樹脂組成物及び銅張積層板 Download PDFInfo
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- JP2006124494A JP2006124494A JP2004313562A JP2004313562A JP2006124494A JP 2006124494 A JP2006124494 A JP 2006124494A JP 2004313562 A JP2004313562 A JP 2004313562A JP 2004313562 A JP2004313562 A JP 2004313562A JP 2006124494 A JP2006124494 A JP 2006124494A
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- bismaleimide
- thermosetting resin
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- YUQZLQPOSCSNPJ-ARJAWSKDSA-N C/C=C\C(N(C)c1ccc(Cc(cc2)ccc2N(C(C=C2)O)C2O)cc1)O Chemical compound C/C=C\C(N(C)c1ccc(Cc(cc2)ccc2N(C(C=C2)O)C2O)cc1)O YUQZLQPOSCSNPJ-ARJAWSKDSA-N 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3415—Five-membered rings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/204—Di-electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31721—Of polyimide
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Laminated Bodies (AREA)
Abstract
Description
(実施例1〜4、比較例1、2)
2,2-ビス(4-シアネートフェニル)プロパン(CX、三菱ガス化学)、ビス(3-エチル-5-メチル-4-マレイミドフェニル)メタン(BMI-70、ケイ・アイ化成)、ビス(4-マレイミドフェニル)メタン(BMI-H、ケイ・アイ化成)を表1に記載した比率で 150℃、20分間溶融混合したものを、注型用金型に流し込み、150℃で 15分間、真空脱泡した後、200℃で8時間、加熱硬化させて、厚み 4mmの硬化物を得た。得られた硬化物の物性測定結果を表1に示す。
2,2-ビス(4-シアネートフェニル)プロパン(CX)、ビス(3-エチル-5-メチル-4-マレイミドフェニル)メタン(BMI-70)、ビス(4-マレイミドフェニル)メタン(BMI-H)を表2に記載した比率で 160℃に溶融させ、攪拌しながら6時間反応させ、オリゴマー樹脂組成物を得た。得られた樹脂組成物をメチルエチルケトンに溶解させ、樹脂固形分 60%のワニスとした。このワニスにオクチル酸亜鉛 0.05部、ジクミルパーオキサイド 0.5部を加え、均一に混合した後、この溶液を厚み 0.1mmの平織りEガラス織布(116H、日東紡績)に含浸し、150℃で6分間乾燥してBステージ化し、プリプレグとした。このプリプレグを6枚重ね合わせ、その上下に 18μmの電解銅箔(3EC箔 三井金属鉱業)を重ねて、温度200℃、圧力3MPaで 120分間積層成形し 0.6mmの銅張積層板を得た。得られた銅張積層板の物性測定結果を表2に示す。
実施例6で得られたワニスにビスフェノールA型エポキシ樹脂(エピコート1001、ジャパンエポキシレジン)を表2に記載した比率で、メチルエチルケトンを加えで溶解させ、樹脂固形分60%のワニスとする以外は実施例5と同様に行い、銅張り積層板を得た。得られた銅張積層板の物性測定結果を表2に示す。
実施例5において、2,2-ビス(4-シアネートフェニル)プロパン(CX)とビス(3-エチル-5-メチル-4-マレイミドフェニル)メタン(BMI-70)を160℃に溶融させ、攪拌しながら10時間反応させる以外は、実施例5と同様に行い、0.6mmの銅張積層板を得た。得られた銅張積層板の物性測定結果を表2に示す。
1)ガラス転移温度:
サイズ 4mm×4mm×4mm(積層板は0.6mm)のサンプルを使用し、TMA装置(TA Instrumen 2940型)にて、加重 5g、昇温 5℃/min 条件下で3回測定を行った平均値。
2)誘電率:
サイズ 100mm×1mm×0.6mmのサンプルを使用し、ネットワークアナライザーHP8722ES (アジレンテクノロジー製)にて、空洞共振器摂動法により3回測定を行った平均値。 (測定周波数:1GHz)
3)吸湿耐熱性:
50mm×50mm角のサンプルの片面の半分以外の全銅箔をエッチング除去し、プレシッヤークッカー試験機(平山製作所製PC-3型)で121℃、2気圧で所定時間処理後、JIS C6481に準じて260℃の半田槽に60秒間フロートさせて、外観変化の異常の有無を目視にて観察した。(○:異常なし、×:膨れ、剥がれが発生)
4)半田耐熱性:
JIS C6481に準じて、半田槽温度260℃の半田槽に60秒間フロートさせて、外観変化の異常の有無を目視にて観察した。(○:異常なし、×:膨れ、剥がれが発生)
5)銅箔接着力:
JIS C6481に準じて3回測定を行った平均値。
Claims (4)
- シアン酸エステル樹脂(a)とビスマレイミド化合物{(b)+(c)}との重量配合比率が、70:30 〜 30:70である請求項1記載の熱硬化性樹脂組成物。
- ビスマレイミド(b)とビスマレイミド(c)との重量配合比率が、95:5 〜 70:30である請求項1記載の熱硬化性樹脂組成物。
- 請求項1〜3のいずれかに記載の熱硬化性樹脂組成物を使用した銅張積層板及びこれを用いたプリント配線板。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004313562A JP4784066B2 (ja) | 2004-10-28 | 2004-10-28 | 樹脂組成物及び銅張積層板 |
US11/251,934 US20060093824A1 (en) | 2004-10-28 | 2005-10-18 | Resin composition and its use |
KR1020050101803A KR101268482B1 (ko) | 2004-10-28 | 2005-10-27 | 수지 조성물 및 그 용도 |
TW94137605A TWI360557B (en) | 2004-10-28 | 2005-10-27 | Resin composition and its use |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004313562A JP4784066B2 (ja) | 2004-10-28 | 2004-10-28 | 樹脂組成物及び銅張積層板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006124494A true JP2006124494A (ja) | 2006-05-18 |
JP4784066B2 JP4784066B2 (ja) | 2011-09-28 |
Family
ID=36262322
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004313562A Active JP4784066B2 (ja) | 2004-10-28 | 2004-10-28 | 樹脂組成物及び銅張積層板 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20060093824A1 (ja) |
JP (1) | JP4784066B2 (ja) |
KR (1) | KR101268482B1 (ja) |
TW (1) | TWI360557B (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009132886A (ja) * | 2007-10-29 | 2009-06-18 | Mitsubishi Gas Chem Co Inc | 樹脂組成物並びにこれを用いたプリプレグ及び積層板 |
JP2009218509A (ja) * | 2008-03-12 | 2009-09-24 | Fujifilm Corp | 導電膜の形成方法及びプリント配線板の製造方法 |
WO2012090578A1 (ja) * | 2010-12-27 | 2012-07-05 | 三菱瓦斯化学株式会社 | 熱硬化性樹脂組成物 |
JP2016041799A (ja) * | 2014-08-19 | 2016-03-31 | Dic株式会社 | 硬化性組成物、硬化物、半導体封止材料、半導体装置、プリプレグ、プリント回路基板、フレキシルブル配線基板、ビルドアップフィルム、ビルドアップ基板、繊維強化複合材料、成形品 |
JP2018030974A (ja) * | 2016-08-26 | 2018-03-01 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、積層樹脂シート、樹脂シート、及びプリント配線板 |
JP2018070761A (ja) * | 2016-10-28 | 2018-05-10 | 株式会社日本触媒 | 硬化性樹脂組成物、それを用いた封止材及び半導体装置 |
WO2019124558A1 (ja) | 2017-12-22 | 2019-06-27 | 帝人株式会社 | 熱硬化性樹脂組成物 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI447009B (zh) * | 2006-09-28 | 2014-08-01 | 東麗股份有限公司 | 複合預浸漬基材之製法、積層基材及纖維強化塑膠 |
JP5024205B2 (ja) * | 2007-07-12 | 2012-09-12 | 三菱瓦斯化学株式会社 | プリプレグ及び積層板 |
US8658719B2 (en) | 2009-06-11 | 2014-02-25 | Arlon | Low loss pre-pregs and laminates and compositions useful for the preparation thereof |
US20110123796A1 (en) * | 2009-11-20 | 2011-05-26 | E.I. Dupont De Nemours And Company | Interposer films useful in semiconductor packaging applications, and methods relating thereto |
CN102939316B (zh) * | 2010-04-21 | 2016-04-27 | 三菱瓦斯化学株式会社 | 热固性组合物 |
US8686069B2 (en) * | 2010-10-12 | 2014-04-01 | Hexcel Corporation | Solvent resistance of epoxy resins toughened with polyethersulfone |
US10458197B2 (en) * | 2015-06-16 | 2019-10-29 | Baker Huges, A Ge Company, Llc | Disintegratable polymer composites for downhole tools |
US20180179424A1 (en) * | 2016-12-23 | 2018-06-28 | Industrial Technology Research Institute | Adhesive composition and composite substrate employing the same |
US20210229407A1 (en) * | 2018-06-01 | 2021-07-29 | Mitsubishi Gas Chemical Company, Inc. | Resin Composition, Prepreg, Metal Foil-Clad Laminate, Resin Sheet, and Printed Wiring Board |
CN113004690B (zh) * | 2019-12-20 | 2022-04-12 | 中国科学院大连化学物理研究所 | 一种双马来酰亚胺树脂组合物、其制备方法及应用 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0753864A (ja) * | 1993-08-19 | 1995-02-28 | Mitsubishi Gas Chem Co Inc | 硬化性樹脂組成物 |
JPH07196793A (ja) * | 1993-12-28 | 1995-08-01 | Sumitomo Bakelite Co Ltd | 封止用樹脂組成物 |
JP2003238681A (ja) * | 2002-02-19 | 2003-08-27 | Sumitomo Bakelite Co Ltd | 樹脂組成物、プリプレグ及び積層板 |
Family Cites Families (6)
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US4389516A (en) * | 1980-03-24 | 1983-06-21 | Mitsubishi Gas Chemical Company, Inc. | Curable polyphenylene ether resin composition |
US4645805A (en) * | 1984-03-14 | 1987-02-24 | Mitsubishi Gas Chemical Company, Inc. | Adhesive composition and adhesive film or sheet on which the composition is coated |
NL8403091A (nl) * | 1984-10-11 | 1986-05-01 | Gen Electric | Thermoplastisch mengsel met polyfunctionele verbinding. |
US4962161A (en) * | 1987-08-17 | 1990-10-09 | Hercules Incorporated | Thermosettable resin compositions |
MY104191A (en) * | 1988-09-06 | 1994-02-28 | Mitsubishi Gas Chemical Co | Process for producing multilayer printed wiring board |
US20050182203A1 (en) * | 2004-02-18 | 2005-08-18 | Yuuichi Sugano | Novel cyanate ester compound, flame-retardant resin composition, and cured product thereof |
-
2004
- 2004-10-28 JP JP2004313562A patent/JP4784066B2/ja active Active
-
2005
- 2005-10-18 US US11/251,934 patent/US20060093824A1/en not_active Abandoned
- 2005-10-27 TW TW94137605A patent/TWI360557B/zh active
- 2005-10-27 KR KR1020050101803A patent/KR101268482B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0753864A (ja) * | 1993-08-19 | 1995-02-28 | Mitsubishi Gas Chem Co Inc | 硬化性樹脂組成物 |
JPH07196793A (ja) * | 1993-12-28 | 1995-08-01 | Sumitomo Bakelite Co Ltd | 封止用樹脂組成物 |
JP2003238681A (ja) * | 2002-02-19 | 2003-08-27 | Sumitomo Bakelite Co Ltd | 樹脂組成物、プリプレグ及び積層板 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009132886A (ja) * | 2007-10-29 | 2009-06-18 | Mitsubishi Gas Chem Co Inc | 樹脂組成物並びにこれを用いたプリプレグ及び積層板 |
KR101466181B1 (ko) * | 2007-10-29 | 2014-11-27 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | 수지 조성물, 이를 이용한 프리프레그 및 라미네이트 |
JP2009218509A (ja) * | 2008-03-12 | 2009-09-24 | Fujifilm Corp | 導電膜の形成方法及びプリント配線板の製造方法 |
WO2012090578A1 (ja) * | 2010-12-27 | 2012-07-05 | 三菱瓦斯化学株式会社 | 熱硬化性樹脂組成物 |
CN103298854A (zh) * | 2010-12-27 | 2013-09-11 | 三菱瓦斯化学株式会社 | 热固性树脂组合物 |
JP2016041799A (ja) * | 2014-08-19 | 2016-03-31 | Dic株式会社 | 硬化性組成物、硬化物、半導体封止材料、半導体装置、プリプレグ、プリント回路基板、フレキシルブル配線基板、ビルドアップフィルム、ビルドアップ基板、繊維強化複合材料、成形品 |
JP2018030974A (ja) * | 2016-08-26 | 2018-03-01 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、積層樹脂シート、樹脂シート、及びプリント配線板 |
JP2018070761A (ja) * | 2016-10-28 | 2018-05-10 | 株式会社日本触媒 | 硬化性樹脂組成物、それを用いた封止材及び半導体装置 |
WO2019124558A1 (ja) | 2017-12-22 | 2019-06-27 | 帝人株式会社 | 熱硬化性樹脂組成物 |
KR20200055799A (ko) | 2017-12-22 | 2020-05-21 | 데이진 가부시키가이샤 | 열경화성 수지 조성물 |
Also Published As
Publication number | Publication date |
---|---|
JP4784066B2 (ja) | 2011-09-28 |
KR101268482B1 (ko) | 2013-06-04 |
US20060093824A1 (en) | 2006-05-04 |
TW200621852A (en) | 2006-07-01 |
KR20060052264A (ko) | 2006-05-19 |
TWI360557B (en) | 2012-03-21 |
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